Recently added

Methodology and more accurate electrothermal model for fast simulation of power HEMTs

Chvála, Aleš; Marek, Juraj; Cernaj, Luboš; Príbytnŭ, Patrik; Šatka, Alexander; Stoffels, Steve; Posthuma, Niels; Decoutere, Stefaan; Donoval, Daniel (2018)

A cautionary note when looking for a truly reconfigurable resistive RAM PUF

Chuang, Kent; Degraeve, Robin; Fantini, Andrea; Groeseneken, Guido; Linten, Dimitri; Verbauwhede, Ingrid (2018)

A physically unclonable function featuring 0% BER using soft oxide breakdown positions in 40nm CMOS

Chuang, Kent; Bury, Erik; Degraeve, Robin; Kaczer, Ben; Linten, Dimitri; Verbauwhede, Ingrid (2018)

A multi-bits/cell PUF using analog breakdown positions in CMOS

Chuang, Kent; Bury, Erik; Degraeve, Robin; Kaczer, Ben; Kallstenius, Thomas; Groeseneken, Guido; Linten, Dimitri; Verbauwhede, Ingrid (2018)

Novel computational fluid dynamics modeling of spatial convective heat transfer over PV-modules mounted on an inclined surface with an underlying air gap

Chowdhury, Gofran; Somma, Lucas; Goossens, Dirk; Goverde, Hans; Horvath, Imre T; Voroshazi, Eszter; Poortmans, Jef; Catthoor, Francky (2018)

Electron-selective contact using i-a-Si:H/TiOx/Yb/Ag stack for silicon heterojunction solar cells

Cho, Jinyoun; Recaman Payo, Maria; Debucquoy, Maarten; Sivaramakrishnan Radhakrishnan, Hariharsudan; Gordon, Ivan; Szlufcik, Jozef; Ghannam, Moustafa; Poortmans, Jef (2018)

Evidence of TiOx reduction at the SiOx/TiOx interface of passivating electron-selective contacts

Cho, Jinyoun; Debucquoy, Maarten; Recaman Payo, Maria; Schapmans, Elie; Gordon, Ivan; Szlufcik, Jozef; Poortmans, Jef (2018)

Techno-economic viability of integrating satellite communication in 4G networks to bridge the broadband digital divide

Chiha, Asma; Van Der Wee, Marlies; Verbrugge, Sofie; Colle, Didier (2018)

Scalable, layer-controlled synthesis of 2D semiconductors

Chiappe, Daniele; El Kazzi, Salim; Afanasiev, Valeri; Leonhardt, Alessandra; Ludwig, Jonathan; Celano, Umberto; Brems, Steven; Pourtois, Geoffrey; Caymax, Matty; Schram, Tom; Huyghebaert, Cedric; Asselberghs, Inge; De Gendt, Stefan; Radu, Iuliana (2018)

Layer-controlled, wafer-scale fabrication of 2D semiconductor materials

Chiappe, Daniele; Afanasiev, Valeri; Tomczak, Yoann; Sutar, Surajit; Leonhardt, Alessandra; Ludwig, Jonathan; Celano, Umberto; Brems, Steven; Dabral, Ashish; Pourtois, Geoffrey; Caymax, Matty; Schram, Tom; Huyghebaert, Cedric; Asselberghs, Inge; De Gendt, Stefan; Radu, Iuliana (2018)

Replacement metal contact using sacrificial ILD0 for wrap around contact in scaled FinFET technology

Chew, Soon Aik; Demuynck, Steven; Zhang, Liping; Pacco, Antoine; Devriendt, Katia; Teugels, Lieve; Hopf, Toby; Versluijs, Janko; Vrancken, Christa; Dangol, Anish; Altamirano Sanchez, Efrain; Mocuta, Dan; Horiguchi, Naoto (2018)

Evaluation of mechanical stress induced during IC packaging

Cherman, Vladimir; Lofrano, Melina; Gonzalez, Mario; Cadacio Jr., Francisco; Rebibis, Kenneth June; Beyne, Eric; Takano, Akihito; Higashi, Mitsutoshi (2018)

ESD diodes in next generation bulk FinFET and GAA NW technology nodes

Chen, Shih-Hung; Hellings, Geert; Linten, Dimitri; Mertens, Hans; Chiarella, Thomas; Mitard, Jerome; Mocuta, Anda; Horiguchi, Naoto (2018)

A 400G $X input-impedance, 220mVpp linear-input-range, 2.8Vpp CM-interference-tolerant active electrode for non-contact capacitively coupled ECG acquisition

Chen, Mingyi; Castro Miller, Ivan Dario; Lin, Qiuyang; Torfs, Tom; Tavernier, Filip; Van Hoof, Chris; Van Helleputte, Nick (2018)

Conference contributions: Recent submissions

Methodology and more accurate electrothermal model for fast simulation of power HEMTs

A cautionary note when looking for a truly reconfigurable resistive RAM PUF

A physically unclonable function featuring 0% BER using soft oxide breakdown positions in 40nm CMOS

A multi-bits/cell PUF using analog breakdown positions in CMOS

Novel computational fluid dynamics modeling of spatial convective heat transfer over PV-modules mounted on an inclined surface with an underlying air gap

Electron-selective contact using i-a-Si:H/TiOx/Yb/Ag stack for silicon heterojunction solar cells

Evidence of TiOx reduction at the SiOx/TiOx interface of passivating electron-selective contacts

Techno-economic viability of integrating satellite communication in 4G networks to bridge the broadband digital divide

Scalable, layer-controlled synthesis of 2D semiconductors

Layer-controlled, wafer-scale fabrication of 2D semiconductor materials

Replacement metal contact using sacrificial ILD0 for wrap around contact in scaled FinFET technology

Evaluation of mechanical stress induced during IC packaging

ESD diodes in next generation bulk FinFET and GAA NW technology nodes

A 400G $X input-impedance, 220mVpp linear-input-range, 2.8Vpp CM-interference-tolerant active electrode for non-contact capacitively coupled ECG acquisition

Pilot contamination in massive MIMO: A measurement-based analysis using 2D-MUSIC

High spatial resolution nanoslit SERS for real-time single-molecule nucleobase sensing

Real-time kHz to GHz monitoring of incubated yeast cell growth using interdigitated capacitors

DTCO exploration for efficient standard cell power rails

Advanced CD-SEM solution for edge placement error characterization of BEOL pitch 32nm metal layer

Low-k material cryoetch using high boiling point organic compounds to reduce plasma induced damage

Conference contributions: Recent submissions

Methodology and more accurate electrothermal model for fast simulation of power HEMTs ﻿

A cautionary note when looking for a truly reconfigurable resistive RAM PUF ﻿

A physically unclonable function featuring 0% BER using soft oxide breakdown positions in 40nm CMOS ﻿

A multi-bits/cell PUF using analog breakdown positions in CMOS ﻿

Novel computational fluid dynamics modeling of spatial convective heat transfer over PV-modules mounted on an inclined surface with an underlying air gap ﻿

Electron-selective contact using i-a-Si:H/TiOx/Yb/Ag stack for silicon heterojunction solar cells ﻿

Evidence of TiOx reduction at the SiOx/TiOx interface of passivating electron-selective contacts ﻿

Techno-economic viability of integrating satellite communication in 4G networks to bridge the broadband digital divide ﻿

Scalable, layer-controlled synthesis of 2D semiconductors ﻿

Layer-controlled, wafer-scale fabrication of 2D semiconductor materials ﻿

Replacement metal contact using sacrificial ILD0 for wrap around contact in scaled FinFET technology ﻿

Evaluation of mechanical stress induced during IC packaging ﻿

ESD diodes in next generation bulk FinFET and GAA NW technology nodes ﻿

A 400G $X input-impedance, 220mVpp linear-input-range, 2.8Vpp CM-interference-tolerant active electrode for non-contact capacitively coupled ECG acquisition ﻿

Pilot contamination in massive MIMO: A measurement-based analysis using 2D-MUSIC ﻿

High spatial resolution nanoslit SERS for real-time single-molecule nucleobase sensing ﻿

Real-time kHz to GHz monitoring of incubated yeast cell growth using interdigitated capacitors ﻿

DTCO exploration for efficient standard cell power rails ﻿

Advanced CD-SEM solution for edge placement error characterization of BEOL pitch 32nm metal layer ﻿

Low-k material cryoetch using high boiling point organic compounds to reduce plasma induced damage ﻿

Methodology and more accurate electrothermal model for fast simulation of power HEMTs

A cautionary note when looking for a truly reconfigurable resistive RAM PUF

A physically unclonable function featuring 0% BER using soft oxide breakdown positions in 40nm CMOS

A multi-bits/cell PUF using analog breakdown positions in CMOS

Novel computational fluid dynamics modeling of spatial convective heat transfer over PV-modules mounted on an inclined surface with an underlying air gap

Electron-selective contact using i-a-Si:H/TiOx/Yb/Ag stack for silicon heterojunction solar cells

Evidence of TiOx reduction at the SiOx/TiOx interface of passivating electron-selective contacts

Techno-economic viability of integrating satellite communication in 4G networks to bridge the broadband digital divide

Scalable, layer-controlled synthesis of 2D semiconductors

Layer-controlled, wafer-scale fabrication of 2D semiconductor materials

Replacement metal contact using sacrificial ILD0 for wrap around contact in scaled FinFET technology

Evaluation of mechanical stress induced during IC packaging

ESD diodes in next generation bulk FinFET and GAA NW technology nodes

A 400G $X input-impedance, 220mVpp linear-input-range, 2.8Vpp CM-interference-tolerant active electrode for non-contact capacitively coupled ECG acquisition

Pilot contamination in massive MIMO: A measurement-based analysis using 2D-MUSIC

High spatial resolution nanoslit SERS for real-time single-molecule nucleobase sensing

Real-time kHz to GHz monitoring of incubated yeast cell growth using interdigitated capacitors

DTCO exploration for efficient standard cell power rails

Advanced CD-SEM solution for edge placement error characterization of BEOL pitch 32nm metal layer

Low-k material cryoetch using high boiling point organic compounds to reduce plasma induced damage