Recently added

vfTLP characteristics of ESD diodes in bulk Si gate-all-around vertically stacked horizontal nanowire technology

Chen, Shih-Hung; Hellings, Geert; Scholz, Mirko; Linten, Dimitri; Mertens, Hans; Ritzenthaler, Romain; Boschke, Roman; Groeseneken, Guido; Mocuta, Anda; Horiguchi, Naoto (2017)

Towards optimal ESD diodes in next generation bulk FinFET and GAA NW technology nodes

Chen, Shih-Hung; Hellings, Geert; Linten, Dimitri; Chiarella, Thomas; Mertens, Hans; Boschke, Roman; Mitard, Jerome; Kubicek, Stefan; Ritzenthaler, Romain; Bury, Erik; Wang, Nian; Groeseneken, Guido; Mocuta, Anda; Horiguchi, Naoto (2017)

The relationship between the cost of cybercrime and web security posture: A case study on Belgian companies

Chen, Ping; Visschers, Jonas; Verstraete, Cedric; Paoli, Letizia; Huygens, Christophe; Desmet, Lieven; Joosen, Wouter (2017)

Excellent via passivation and high open circuit voltage for large-area n-type MWT-PERT silicon solar cells

Chen, Jia; Singh, Sukhvinder; van der Heide, Arvid; Duerinckx, Filip; Razzaq, Arsalan; Cornagliotti, Emanuele; Uruena De Castro, Angel; Tous, Loic; Russell, Richard; Govaerts, Jonathan; Gordon, Ivan; Dewallef, Stefan; Poortmans, Jef; Szlufcik, Jozef (2017)

Distributed massive MIMO: A diversity combining method for TDD reciprocity calibration

Chen, Cheng-Ming; Blandino, Steve; Gaber, Abdo; Desset, Claude; Bourdoux, André; Van der Perre, Liesbet; Pollin, Sofie (2017)

Distributed massive MIMO: a diversity combining method for TDD reciprocity calibration

Chen, Cheng-Ming; Blandino, Steve; Gaber, Abdo; Desset, Claude; Bourdoux, André; Van der Perre, Liesbet; Pollin, Sofie (2017)

Effective use of aerial image metrology for calibration of OPC models

Chen, Ao; Foong, Yee Mei; Thaler, Thomas; Buttgereit, Ute; Chung, Angeline; Burbine, Andrew; Sturtevant, John; Clifford, Chris; Adam, Kostas; De Bisschop, Peter (2017)

Pre-processing and classification of hyperspectral imagery via selective inpainting

Chayes, Victoria; Miller, Kevin; Bhalerao, Rasika; Zhu, Wei; Bertozzi, Andrea; Liao, Wenzhi; Osher, Stanley (2017)

Cryo-etching for integration in micro-electronic : Silicon deep etch for contact and low-k integration in Back end of line (BEOL)

Chanson, Romain; Lefaucheux, Philippe; Dussart, Remi; Shen, Peng; Urabe, Keiichiro; Dussarat, Christian; Maekawa, Kaoru; yatsuda, koichi; Tahara, Shigeru; de Marneffe, Jean-Francois (2017)

Low-k cryo-etching : comparison of four different High Boiling Point Organic (HBPO)

Chanson, Romain; Lefaucheux, P.L.; Dussart, R.; Tillocher, T.; Shen, P.; Urabe, K.; Dussarat, C.; Maekawa, K.; Yatsuda, K.; Tahara, S.; de Marneffe, Jean-Francois (2017)

Low damage ULK etching by means of high boiling point organic condensation

Chanson, Romain; Holtzer, Nicolas; Lefaucheux, Philippe; Dussart, Rémi; SHEN, Peng; URABE, Keiichiro; Dussarat, Christian; Maekawa, Kaoru; yatsuda, koichi; Tahara, Shigeru; de Marneffe, Jean-Francois (2017)

Integration of the Sequential Infiltration Synthesis (SIS) on Polyphtaladehyde (PPA) resist for thermal Scanning Probe Lithography (t-SPL) patterning

Chan, BT; de Marneffe, Jean-Francois; Spieser, Martin; Knoll, Armin; Knaepen, Werner (2017)

SW-SGD: The sliding window stochastic gradient descent algorithm

Chakroun, Imen; Haber, Tom; Ashby, Tom (2017)

Whole-body diffusion-weighted MR image stitching and alignment to anatomical MRI

Cerenka, Jakub; Polfliet, Mathias; Lecouvet, Frederic; Michoux, Nicolas; Vandemeulebroucke, Jef (2017)

Electrical atomic force microscopy for 2D transition metal dichalcogenide materials

Celano, Umberto; Virkki, Olli; Mascaro, Marco; Nalin Mehta, Ankit; Bender, Hugo; Chiappe, Daniele; Asselberghs, Inge; Paredis, Kristof; Hoflijk, Ilse; Franquet, Alexis; Huyghebaert, Cedric; Radu, Iuliana; Vandervorst, Wilfried (2017)

Non-filamentary (VMCO) memory: a two- and three-dimensional study on switching and failure modes

Celano, Umberto; Gastaldi, Carlotta; Subhechha, Subhali; Govoreanu, Bogdan; Donadio, Gabriele Luca; Franquet, Alexis; Ahmad, Tareq; Detavernier, Christophe; Richard, Olivier; Bender, Hugo; Goux, Ludovic; Kar, Gouri Sankar; van der Heide, Paul; Vandervorst, Wilfried (2017)

Individual device analysis using hybrid TEM-scalpel SSRM metrology

Celano, Umberto; Favia, Paola; Drijbooms, Chris; Dixon-Luinenburg, Oberon; Richard, Olivier; Bender, Hugo; Vancoille, Eric; Paredis, Kristof; Loo, Roger; Schulze, Andreas; Hikavyy, Andriy; Witters, Liesbeth; Mitard, Jerome; Collaert, Nadine; Horiguchi, Naoto; Vandervorst, Wilfried (2017)

Metrology for memristive devices: from filamentary to areal switching

Celano, Umberto (2017)

Hybrid copper dielectric direct bonding of 200mm CMOS wafers with five metal levels: morphologic, electrical and reliability characterization

Cavaco, Celso; Peng, Lan; Guerrieri, Stefano; Osman, Haris (2017)

Voltage dependence of potential-induced degradation and recovery on photovoltaic one-cell laminates

Carolus, Jorne; Govaerts, Jonathan; Voroshazi, Eszter; De Ceuninck, Ward; Daenen, Michaël (2017)

Conference contributions: Recent submissions

vfTLP characteristics of ESD diodes in bulk Si gate-all-around vertically stacked horizontal nanowire technology ﻿

Towards optimal ESD diodes in next generation bulk FinFET and GAA NW technology nodes ﻿

The relationship between the cost of cybercrime and web security posture: A case study on Belgian companies ﻿

Excellent via passivation and high open circuit voltage for large-area n-type MWT-PERT silicon solar cells ﻿

Distributed massive MIMO: A diversity combining method for TDD reciprocity calibration ﻿

Distributed massive MIMO: a diversity combining method for TDD reciprocity calibration ﻿

Effective use of aerial image metrology for calibration of OPC models ﻿

Pre-processing and classification of hyperspectral imagery via selective inpainting ﻿

Cryo-etching for integration in micro-electronic : Silicon deep etch for contact and low-k integration in Back end of line (BEOL) ﻿

Low-k cryo-etching : comparison of four different High Boiling Point Organic (HBPO) ﻿

Low damage ULK etching by means of high boiling point organic condensation ﻿

Integration of the Sequential Infiltration Synthesis (SIS) on Polyphtaladehyde (PPA) resist for thermal Scanning Probe Lithography (t-SPL) patterning ﻿

SW-SGD: The sliding window stochastic gradient descent algorithm ﻿

Whole-body diffusion-weighted MR image stitching and alignment to anatomical MRI ﻿

Electrical atomic force microscopy for 2D transition metal dichalcogenide materials ﻿

Non-filamentary (VMCO) memory: a two- and three-dimensional study on switching and failure modes ﻿

Individual device analysis using hybrid TEM-scalpel SSRM metrology ﻿

Metrology for memristive devices: from filamentary to areal switching ﻿

Hybrid copper dielectric direct bonding of 200mm CMOS wafers with five metal levels: morphologic, electrical and reliability characterization ﻿

Voltage dependence of potential-induced degradation and recovery on photovoltaic one-cell laminates ﻿