Recently added

Sensor interfaces for IoE

Van Helleputte, Nick (2016)

Ka-to-l-band frequency down-conversion using a micro-photonic III-V-on-silicon mode-locked laser and mach-zehnder modulator

Van Gasse, Kasper; Wang, Zhechao; Uvin, Sarah; De Deckere, B.; Marien, J.; Thomassen, L.; Roelkens, Gunther (2016)

Passively mode-locked III-V-on-silicon laser with 1 GHz repetition rate

Van Gasse, Kasper; Wang, Zhechao; Moskalenko, V.; Latkowski, S.; Kuyken, Bart; Bente, E.; Roelkens, Gunther (2016)

480Mbps / 1 Gbps radio-over-fiber link based on a directly modulated III-V-on-silicon DFB laser

Van Gasse, Kasper; Van Kerrebrouck, Joris; Abbasi, Amin; Torfs, Guy; Chen, Hongtao; Yin, Xin; Bauwelinck, Johan; Roelkens, Gunther (2016)

Patterning of graphene on silicon-on-insulator waveguides through laser ablation and plasma etching

Van Erps, Jurgen; Ciuk, Tymoteusz; Pasternak, Iwona; Krajewska, Aleksandra; Strupinski, Wlodek; Van Put, Steven; Van Steenberge, Geert; Baert, Kitty; Terryn, Herman; Thienpont, Hugo; Vermeulen, Nathalie (2016)

A novel optically wide-band electro-absorption modulator based on bandfilling in n-InGaAs

Van Engelen, J.P.; Shen, Longfei; van der Tol, J.J.G.M.; Roelkens, Gunther; Smit, M. (2016)

Optical design of a novel wide-band membrane electro-absorption modulator based on bandfilling

Van Engelen, J. P.; Shen, L.; Roelkens, Gunther; Jiao, Y.; Smit, M. K.; van der Tol, J. J. G. M. (2016)

Silicon nitride based planar integrated circuits for biophotonics applications

Van Dorpe, Pol (2016)

Towards atomic-layer-scale processing of high mobility channel materials in acidic solutions for N5 and N7 technology nodes

van Dorp, Dennis; Arnauts, Sophia; Abrenica, Graniel; Holsteyns, Frank (2016)

Barrier/liner stacks for scaling the Cu interconnect metallization

van der Veen, Marleen; Jourdan, Nicolas; Vega Gonzalez, Victor; Wilson, Chris; Heylen, Nancy; Varela Pedreira, Olalla; Struyf, Herbert; Croes, Kristof; Boemmels, Juergen; Tokei, Zsolt (2016)

Conformal Cu electroless seed on Co and Ru liners enables Cu fill by plating for advanced interconnects

van der Veen, Marleen; Inoue, Fumihiro; Vandersmissen, Kevin; Dictus, Dries; Tanaka, Tetsu; Boemmels, Juergen; Struyf, Herbert; Tokei, Zsolt (2016)

Multi-walled carbon nanotubes evaluated for nanointerconnect applications

van der Veen, Marleen; Boemmels, Juergen; Tokei, Zsolt (2016)

Demonstration of upstream flexible 2-/4-PAM formats for practical PON deployments

van der Linden, R.; Yin, Xin; Tran, N. C.; Bauwelinck, Johan; Tangdiongga, E.; Koonen, A. M. J. (2016)

Process window discovery methodology development for advanced lithography

Van Den Heuvel, Dieter; Foubert, Philippe; Baudemprez, Bart; Lee, Angelica; Cross, Andrew; Sao, Kaushik; Haque, Naoshin; Parisi, Paolo; Baris, Oksin (2016)

Experimental analysis of the performance of Facade-integrated BIPV in deifferent configurations

van den Broeck, Giel; Parys, Wout; Goverde, Hans; Baert, Kris; Saelens, Dirk; van de Putten, Stijn; Poortmans, Jef; Driesen, Johan (2016)

Comparing ballistic Landauer quantum transport to time-evolved Wigner functions

Van de Put, Maarten; Magnus, Wim; Soree, Bart (2016)

In-air ultrasonic 3D-touchscreen with gesture recognition using existing hardware for smart devices

Van Dam, Bert; Murillo, Yuri; Li, Min; Pollin, Sofie (2016)

Thermal stability extraction from single perpendicular MTJs and Mbit arrays: comparison and statistical analysis

Van Beek, Simon; Martens, Koen; Roussel, Philippe; Kim, Woojin; Swerts, Johan; Donadio, Gabriele Luca; Kar, Gouri Sankar; Thean, Aaron; Furnemont, Arnaud; Groeseneken, Guido (2016)

Voltage acceleration and pulse dependence of barrier breakdown in MgO based magnetic tunnel junctions

Van Beek, Simon; Martens, Koen; Roussel, Philippe; Donadio, Gabriele Luca; Swerts, Johan; Mertens, Sofie; Thean, Aaron; Kar, Gouri Sankar; Furnemont, Arnaud; Groeseneken, Guido (2016)

Impact of wafer thinning on front-end reliability for 3D integration

Vaisman Chasin, Adrian; Scholz, Mirko; Guo, Wei; Franco, Jacopo; Potoms, Goedele; Jourdain, Anne; Linten, Dimitri; Van der Plas, Geert; Absil, Philippe; Beyne, Eric (2016)

Conference contributions: Recent submissions

Sensor interfaces for IoE ﻿

Ka-to-l-band frequency down-conversion using a micro-photonic III-V-on-silicon mode-locked laser and mach-zehnder modulator ﻿

Passively mode-locked III-V-on-silicon laser with 1 GHz repetition rate ﻿

480Mbps / 1 Gbps radio-over-fiber link based on a directly modulated III-V-on-silicon DFB laser ﻿

Patterning of graphene on silicon-on-insulator waveguides through laser ablation and plasma etching ﻿

A novel optically wide-band electro-absorption modulator based on bandfilling in n-InGaAs ﻿

Optical design of a novel wide-band membrane electro-absorption modulator based on bandfilling ﻿

Silicon nitride based planar integrated circuits for biophotonics applications ﻿

Towards atomic-layer-scale processing of high mobility channel materials in acidic solutions for N5 and N7 technology nodes ﻿

Barrier/liner stacks for scaling the Cu interconnect metallization ﻿

Conformal Cu electroless seed on Co and Ru liners enables Cu fill by plating for advanced interconnects ﻿

Multi-walled carbon nanotubes evaluated for nanointerconnect applications ﻿

Demonstration of upstream flexible 2-/4-PAM formats for practical PON deployments ﻿

Process window discovery methodology development for advanced lithography ﻿

Experimental analysis of the performance of Facade-integrated BIPV in deifferent configurations ﻿

Comparing ballistic Landauer quantum transport to time-evolved Wigner functions ﻿

In-air ultrasonic 3D-touchscreen with gesture recognition using existing hardware for smart devices ﻿

Thermal stability extraction from single perpendicular MTJs and Mbit arrays: comparison and statistical analysis ﻿

Voltage acceleration and pulse dependence of barrier breakdown in MgO based magnetic tunnel junctions ﻿

Impact of wafer thinning on front-end reliability for 3D integration ﻿