Recently added

Probing defects generation during stress in high- $j/metal gate FinFETs by random telegraph noise characterization

Puglisi, Francesco Maria; Costantini, Felipe; Kaczer, Ben; Larcher, Luca; Pavan, Paolo (2016)

Impact of Mg out-diffusion and activation on the p-GaN gate HEMT device performance

Posthuma, Niels; You, Shuzhen; Liang, Hu; Ronchi, Nicolo; Kang, Xuanwu; Wellekens, Dirk; Saripalli, Yoga; Decoutere, Stefaan (2016)

Wafer-scale growth of graphene on Ge and Si wafers by reduced-pressure chemical vapor deposition

Porret, Clément; Nuytten, Thomas; Vanhaeren, Danielle; Steenbergen, Johnny; Brems, Steven; Caymax, Matty; Langer, Robert; Loo, Roger (2016)

Wafer-scale growth of graphene on Ge and Si wafers by reduced-pressure chemical vapor deposition

Porret, Clément; Luraschi, Claudio; Nuytten, Thomas; Vanhaeren, Danielle; Conard, Thierry; Verguts, Ken; Brems, Steven; Caymax, Matty; Langer, Robert; Loo, Roger (2016-11)

Investigation of physical and electrical scaling limits of strontium titanate in metal-insulator-metal capacitors for DRAM technology

Popovici, Mihaela Ioana; Redolfi, Augusto; Kaczer, Ben; Hody, Hubert; Jurczak, Gosia; Van Elshocht, Sven (2016)

EUV lithography imaging using novel pellicle membranes

Pollentier, Ivan; Vanpaemel, Johannes; Lee, Jae Uk; Adelmann, Christoph; Zahedmanesh, Houman; Huyghebaert, Cedric; Gallagher, Emily (2016)

Multi-layer graphene interconnect - a feasibility study

Politou, Maria; Wu, Xiangyu; Contino, Antonino; Soree, Bart; Huyghebaert, Cedric; Lin, Dennis; Radu, Iuliana; Tokei, Zsolt; Asselberghs, Inge (2016)

Electrical characterization of multilayer graphene ribbons with Pd edge contacts for advanced interconnects

Politou, Maria; Asselberghs, Inge; Wu, Xiangyu; Radu, Iuliana; Huyghebaert, Cedric; Tokei, Zsolt; De Gendt, Stefan; Heyns, Marc (2016)

Investigation of advanced dicing technologies for ultra low-k and 3D integration

Podpod, Arnita; Inoue, Fumihiro; De Wolf, Ingrid; Gonzalez, Mario; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric (2016)

Security guarantees for the execution infrastructure of software applications

Piessens, Frank; Devriese, Dominique; Mühlberg, Jan Tobias; Strackx, Raoul (2016)

Extremely low force debonding of thinned CMOS substrate by laser release of a temporary bond material

Phommahaxay, Alain; Potoms, Goedele; Verbinnen, Greet; Sleeckx, Erik; Beyer, Gerald; Beyne, Eric; Guerrero, Alice; Donghun, Bai; Xiao, Liu; Yess, Kim; Arnold, Kim; Spiess, Walter; Griesbach, Tim; Rapps, Thomas; Lutter, Stefan (2016)

Mitigating EUV mask 3D effects by alternative metal absorbers

Philipsen, Vicky; Luong, Vu; Hendrickx, Eric; Erdmann, Andreas; Dongbo, Xu; Evanschitzky, Peter; van de Kruijs, Robbert; Edrisi, Arash; Scholze, Frank; Laubis, Christian; Irmscher, Mathias; Naasz, Sandra (2016)

Hybrid single mode nanophotonic-plasmonic waveguides for on-chip surface enhanced raman spectroscopy

Peyskens, Frederick; Dhakal, Ashim; Van Adrichem, Paul; Le Thomas, Nicolas; Baets, Roel (2016)

Surface enhanced raman spectroscopy on single mode nanophotonic-plasmonic waveguides

Peyskens, Frederic; Dhakal, Ashim; Van Dorpe, Pol; Le Thomas, Nicolas; Baets, Roel (2016)

Development of multi-stack dielectric wafer bonding

Peng, Lan; Kim, Soon-Wook; Inoue, Fumihiro; Wang, Teng; Phommahaxay, Alain; Verdonck, Patrick; Jourdain, Anne; Sleeckx, Erik; Struyf, Herbert; Miller, Andy; Beyer, Gerald; Beyne, Eric; Soules, Mike; Lutter, Stefan (2016)

3D-SoC integration utilizing high accuracy wafer level bonding

Peng, Lan; Kim, Soon-Wook; Heylen, Nancy; Reichardt, Maik; Kurz, Florian; Wagenleitner, Thomas; Sleeckx, Erik; Struyf, Herbert; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2016)

Evaluation of post etch residue cleaning solutions for the removal of TiN hardmask after dry etch of low-k dielectric materials on 45 nm pitch interconnects

Payne, Makonnen; Lippy, Steve; Lieten, Ruben; Kesters, Els; Le, Quoc Toan; Murdoch, Gayle; Vega Gonzalez, Victor; Holsteyns, Frank (2016)

Effects of border traps on transfer curve hysteresis and split-CV mobility measurement in InGaAs quantum-well MOSFETs

Pavan, Paolo; Puglisi, F. M.; Zagni, Nicolo; Alian, AliReza; Thean, Aaron; Collaert, Nadine; Verzellesi, G. (2016)

DSA materials contributions to the defectivity performance of the 14nm half-pitch LiNe flow @ imec

Pathangi Sriraman, Hari; Vaid, Varun; Chan, BT; Vandenbroeck, Nadia; Li, Jin; Hong, Sung Eun; Cao, Yi; Durairaj, Baskaran; Lin, Guanyang; Somervell, Mark; Kitano, Takahiro; Harukawa, Ryota; Sah, Kaushik; Cross, Andrew; Bayana, Hareen; D'Urzo, Lucia; Gronheid, Roel (2016)

Improved cost-effectiveness of the block co-polymer anneal process for DSA

Pathangi Sriraman, Hari; Stokhof, Maarten; Knaepen, Werner; Vaid, Varun; Mallik, Arindam; Chan, BT; Vandenbroeck, Nadia; Maes, Jan; Gronheid, Roel (2016)

Conference contributions: Recent submissions

Probing defects generation during stress in high- $j/metal gate FinFETs by random telegraph noise characterization ﻿

Impact of Mg out-diffusion and activation on the p-GaN gate HEMT device performance ﻿

Wafer-scale growth of graphene on Ge and Si wafers by reduced-pressure chemical vapor deposition ﻿

Wafer-scale growth of graphene on Ge and Si wafers by reduced-pressure chemical vapor deposition ﻿

Investigation of physical and electrical scaling limits of strontium titanate in metal-insulator-metal capacitors for DRAM technology ﻿

EUV lithography imaging using novel pellicle membranes ﻿

Multi-layer graphene interconnect - a feasibility study ﻿

Electrical characterization of multilayer graphene ribbons with Pd edge contacts for advanced interconnects ﻿

Investigation of advanced dicing technologies for ultra low-k and 3D integration ﻿

Security guarantees for the execution infrastructure of software applications ﻿

Extremely low force debonding of thinned CMOS substrate by laser release of a temporary bond material ﻿

Mitigating EUV mask 3D effects by alternative metal absorbers ﻿

Hybrid single mode nanophotonic-plasmonic waveguides for on-chip surface enhanced raman spectroscopy ﻿

Surface enhanced raman spectroscopy on single mode nanophotonic-plasmonic waveguides ﻿

Development of multi-stack dielectric wafer bonding ﻿

3D-SoC integration utilizing high accuracy wafer level bonding ﻿

Evaluation of post etch residue cleaning solutions for the removal of TiN hardmask after dry etch of low-k dielectric materials on 45 nm pitch interconnects ﻿

Effects of border traps on transfer curve hysteresis and split-CV mobility measurement in InGaAs quantum-well MOSFETs ﻿

DSA materials contributions to the defectivity performance of the 14nm half-pitch LiNe flow @ imec ﻿

Improved cost-effectiveness of the block co-polymer anneal process for DSA ﻿

Probing defects generation during stress in high- $j/metal gate FinFETs by random telegraph noise characterization

Impact of Mg out-diffusion and activation on the p-GaN gate HEMT device performance

Wafer-scale growth of graphene on Ge and Si wafers by reduced-pressure chemical vapor deposition

Wafer-scale growth of graphene on Ge and Si wafers by reduced-pressure chemical vapor deposition

Investigation of physical and electrical scaling limits of strontium titanate in metal-insulator-metal capacitors for DRAM technology

EUV lithography imaging using novel pellicle membranes

Multi-layer graphene interconnect - a feasibility study

Electrical characterization of multilayer graphene ribbons with Pd edge contacts for advanced interconnects

Investigation of advanced dicing technologies for ultra low-k and 3D integration

Security guarantees for the execution infrastructure of software applications

Extremely low force debonding of thinned CMOS substrate by laser release of a temporary bond material

Mitigating EUV mask 3D effects by alternative metal absorbers

Hybrid single mode nanophotonic-plasmonic waveguides for on-chip surface enhanced raman spectroscopy

Surface enhanced raman spectroscopy on single mode nanophotonic-plasmonic waveguides

Development of multi-stack dielectric wafer bonding

3D-SoC integration utilizing high accuracy wafer level bonding

Evaluation of post etch residue cleaning solutions for the removal of TiN hardmask after dry etch of low-k dielectric materials on 45 nm pitch interconnects

Effects of border traps on transfer curve hysteresis and split-CV mobility measurement in InGaAs quantum-well MOSFETs

DSA materials contributions to the defectivity performance of the 14nm half-pitch LiNe flow @ imec

Improved cost-effectiveness of the block co-polymer anneal process for DSA