Recently added

Evaluating the Effects of FeFET Device Variability on Charge Sharing Based AiMC Accelerator

Majumdar, Swatilekha; Cosemans, Stefan; Mallik, Arindam; Debacker, Peter; Catthoor, Francky; Van Houdt, Jan (2023)

Evaluating Quality of Visual Explanations of Deep Learning Models for Vision Tasks

Yang, Yuqing; Mahmoudpour, Saeed; Schelkens, Peter; Deligiannis, Nikolaos (2023)

ESD process assessment of 2.5D and 3D bonding technologies

Simicic, Marko; Gijbels, Frank; Iacovo, Serena; Chen, Shih-Hung; Van der Plas, Geert; Beyne, Eric (2023)

ESD mitigation for 3D IC hybrid bonding

Lin, Shih-Hsiang; Simicic, Marko; Pantano, Nicolas; Chen, Shih-Hung; Roussel, Philippe; Van der Plas, Geert; Beyne, Eric; Wambacq, Piet (2023)

Device-Aware Test for Back-Hopping Defects in STT-MRAMs

Yuan, Sicong; Taouil, Mottaqiallah; Fieback, Moritz; Xun, Hanzhi; Marinissen, Erik Jan; Kar, Gouri Sankar; Rao, Siddharth; Couet, Sebastien; Hamdioui, Said (2023)

Device Aware Diagnosis for Unique Defects in STT-MRAMs

Aouichi, Ahmed; Yuan, Sicong; Fieback, Moritz; Rao, Siddharth; Kim, Woojin; Marinissen, Erik Jan; Couet, Sebastien; Taouil, Mottaqiallah; Hamdioui, Said (2023)

Comfort-aware HVAC Aggregation Method based on Deep Reinforcement Learning

Nonaka, Shotaro; Taniguchi, Ittetsu; Nishikawa, Hiroki; Zhao, Dafang; Catthoor, Francky; Onoye, Takao (2023)

Emerging Interconnect Exploration for SRAM Application Using Nonconventional H-Tree and Center-Pin Access

Pei, Zhenlin; Mayahinia, Mahta; Liu, Hsiao-Hsuan; Tahoori, Mehdi; Salahuddin, Shairfe Muhammad; Catthoor, Francky; Tokei, Zsolt; Pan, Chenyun (2023)

MTJ degradation in multi-pillar SOT-MRAM with selective writing

Van Beek, Simon; Cai, Kaiming; Fan, Kaiquan; Talmelli, Giacomo; Trovato, Anna; Jossart, Nico; Rao, Siddharth; Vaisman Chasin, Adrian; Couet, Sebastien (2023)

Quantum Transport Study of Contact Resistance of Edge- and Top-Contacted Two-Dimensional Materials

Deylgat, Emeric; Chen, Edward; Soree, Bart; Vandenberghe, William G. (2023)

Special Session: Neuromorphic hardware design and reliability from traditional CMOS to emerging technologies

Pavanello, Fabio; Vatajelu, Elena Ioana; Bosio, Alberto; Van Vaerenbergh, Thomas; Bienstman, Peter; Charbonnier, Benoit; Carpegna, Alessio; Di Carlo, Stefano; Savino, Alessandro (2023)

Spin-orbit torque MRAM for ultrafast cache and neuromorphic computing applications

Rao, Siddharth; Cai, Kaiming; Talmelli, Giacomo; Franchina Vergel, Nathali; Janssens, Ward; Hody, Hubert; Yasin, Farrukh; Wostyn, Kurt; Couet, Sebastien (2023)

Utilizing Communication Air-Time to Reduce Energy Consumption of Access Points

Ozkaya, Ozgur; Haxhibeqiri, Jetmir; Moerman, Ingrid; Hoebeke, Jeroen (2023)

Coupled Dynamic Thermo-Optical Analysis and Compact Modelling of Self-Heating in Ring Modulator

Coenen, David; Kim, Minkyu; Oprins, Herman; De Wolf, Ingrid; Ban, Yoojin; Van Campenhout, Joris (2023)

Cost-Aware Active Learning for Feasible Region Identification

Nikova, Ioana; Dhaene, Tom; Couckuyt, Ivo (2023)

Bayesian Optimisation of Existing Object Detection Methods for New Contexts

Willems, Tim; Aelterman, Jan; Van Hamme, David (2023)

Study of the effect of multiple conductions on threshold voltage in a MIS-HEMT from 450 K down to 200 K

Perina, Welder F.; Martino, Joao A.; Simoen, Eddy; Peralagu, Uthayasankaran; Collaert, Nadine; Agopian, Paula G. D. (2023)

The Effect of Rapport on Delegation to Virtual Agents

Sun, Ningyuan; Botev, Jean; Simoens, Pieter (2023)

Thermal and Mechanical characterization of embedded PTCQ packaging test chip die

Weis, Gerald; Schwarz, Timo; Cherman, Vladimir; Stahr, Hannes; Van der Plas, Geert (2023)

A Simulation Study of Capacitive Body-Coupled Communication along Human Limbs

Thielens, Arno (2023)

Conference contributions: Recent submissions

Evaluating the Effects of FeFET Device Variability on Charge Sharing Based AiMC Accelerator ﻿

Evaluating Quality of Visual Explanations of Deep Learning Models for Vision Tasks ﻿

ESD process assessment of 2.5D and 3D bonding technologies ﻿

ESD mitigation for 3D IC hybrid bonding ﻿

Device-Aware Test for Back-Hopping Defects in STT-MRAMs ﻿

Device Aware Diagnosis for Unique Defects in STT-MRAMs ﻿

Comfort-aware HVAC Aggregation Method based on Deep Reinforcement Learning ﻿

Emerging Interconnect Exploration for SRAM Application Using Nonconventional H-Tree and Center-Pin Access ﻿

MTJ degradation in multi-pillar SOT-MRAM with selective writing ﻿

Quantum Transport Study of Contact Resistance of Edge- and Top-Contacted Two-Dimensional Materials ﻿

Special Session: Neuromorphic hardware design and reliability from traditional CMOS to emerging technologies ﻿

Spin-orbit torque MRAM for ultrafast cache and neuromorphic computing applications ﻿

Utilizing Communication Air-Time to Reduce Energy Consumption of Access Points ﻿

Coupled Dynamic Thermo-Optical Analysis and Compact Modelling of Self-Heating in Ring Modulator ﻿

Cost-Aware Active Learning for Feasible Region Identification ﻿

Bayesian Optimisation of Existing Object Detection Methods for New Contexts ﻿

Study of the effect of multiple conductions on threshold voltage in a MIS-HEMT from 450 K down to 200 K ﻿

The Effect of Rapport on Delegation to Virtual Agents ﻿

Thermal and Mechanical characterization of embedded PTCQ packaging test chip die ﻿

A Simulation Study of Capacitive Body-Coupled Communication along Human Limbs ﻿