Recently added

Vertical device architecture for 5nm and beyond: device & circuit implications

Thean, Aaron; Yakimets, Dmitry; Huynh Bao, Trong; Schuddinck, Pieter; Sakhare, Sushil; Garcia Bardon, Marie; Sibaja-Hernandez, Arturo; Ciofi, Ivan; Eneman, Geert; Veloso, Anabela; Ryckaert, Julien; Raghavan, Praveen; Mercha, Abdelkarim; Mocuta, Anda; Tokei, Zsolt; Verkest, Diederik; Wambacq, Piet; De Meyer, Kristin; Collaert, Nadine (2015)

Heterogeneous nano- to wide-scale co-integration of beyond-Si and Si CMOS devices to enhance future electronics

Thean, Aaron; Collaert, Nadine; Radu, Iuliana; Waldron, Niamh; Merckling, Clement; Witters, Liesbeth; Loo, Roger; Mitard, Jerome; Rooyackers, Rita; Vandooren, Anne; Verhulst, Anne; Veloso, Anabela; Yakimets, Dmitry; Huynh Bao, Trong; Chiappe, Daniele; Vaysset, Adrien; Zografos, Odysseas; Caymax, Matty; Huyghebaert, Cedric; Barla, Kathy; Steegen, An (2015)

Tackling CMP challenges related to the integration of III-V materials for <10nm node applications

Teugels, Lieve; Ong, Patrick; Waldron, Niamh; Boccardi, Guillaume (2015)

3D-COSTAR: A tool for 2.5D/3D test flow optimization

Taouil, Mottaqiallah; Hamdioui, Said; Marinissen, Erik Jan (2015-10)

Experimental validation of electromigration by low frequency noise measurement for advanced interconnects application

Tang, Baojun; Croes, Kristof; Simoen, Eddy; Beyne, Sofie; Adelmann, Christoph; Tokei, Zsolt (2015)

Constant voltage electromigration for advanced BEOL copper interconnects

Tang, Baojun; Croes, Kristof; Jourdain, Anne; Boemmels, Juergen; Tokei, Zsolt; De Wolf, Ingrid; Wilcox, Eric; McMullen, Timothy (2015)

Line profile measurement of advanced-FinFET features by reference metrology

Takamasu, Kiyoshi; Iwaki, Y.; Takahashi, S.; Kawada, H.; Ikota, M.; Yamaguchu, A.; Lorusso, Gian; Horiguchi, Naoto (2015)

Investigation of the electrical properties of carbon doped Si0.75Ge0.25/Si hetero junction diodes by 2 MeV electron irradiation

Takakura, Kenichiro; Ogata, H.; Inoue, T.; Yoneoka, M.; Tsunoda, I.; Simoen, Eddy; Claeys, Cor (2015)

EUV scanner printability evaluation of natural blank defects detected by actinic blank inspection

Takagi, Noriaki; Watanabe, Hidehiro; Van Den Heuvel, Dieter; Jonckheere, Rik; Gallagher, Emily (2015-07)

Three zones of current collection: more than the space charge limit in thick organic photovoltaics

Tait, Jeffrey; Paetzold, Ulrich W.; Cheyns, David; Turbiez, Mathieu; Heremans, Paul; Rand, Barry (2015)

Non-halogenated solvent systems for blade coating of diketopyrrolopyrrole-based organic photovoltaics

Tait, Jeffrey; Merckx, Tamara; Li, Wenqi; Wong, Cindy; Gehlhaar, Robert; Cheyns, David; Turbiez, Mathieu; Heremans, Paul (2015)

Blade coating of diketopyrrolopyrrole based organic photovoltaics from non-halogenated solvent systems

Tait, Jeffrey; Merckx, Tamara; Li, Wenqi; Wong, Cindy; Gehlhaar, Robert; Cheyns, David; Turbiez, Mathieu; Heremans, Paul (2015)

Perovskite photovoltaics via concurrently pumped ultrasonic spray coating

Tait, Jeffrey; Manghooli, Sara; Qiu, Weiming; Rakocevic, Lucija; Kootstra, Lucinda; Jaysankar, Manoj; Masse de la Huerta, Cesar; Paetzold, Ulrich W.; Gehlhaar, Robert; Cheyns, David; Heremans, Paul; Poortmans, Jef (2015)

Efficient perovskite photovoltaics via concurrently pumped ultrasonic spray coating

Tait, Jeffrey; Manghooli, Sara; Qiu, Weiming; Kootstra, Lucinda; Paetzold, Ulrich W.; Cheyns, David; Poortmans, Jef; Heremans, Paul (2015)

High performance diketopyrrolopyrrole based organic photovoltaics via concurrently pumped ultrasonic spray coating

Tait, Jeffrey; Cheyns, David; Turbiez, Mathieu; Rand, Barry; Heremans, Paul (2015)

A valve-less capillary system: a novel approach for passive flow control on chip

Taher, Ahmed; Jones, Ben; Fiorini, Paolo; Lagae, Liesbet (2015)

Developing an ellipsometry-based biosensor platform viacovalent and oriented coupling of the nanobody targeting the vascular cell adhesu-ion molecule-1 to a silicon wafer

Ta, Duy Tien; Vranken, Tom; Steen Redeker, Erik; Noben, Jean-Paul; Guedens, Wanda; Adriaensens, Peter (2015)

Conference contributions: Recent submissions

Vertical device architecture for 5nm and beyond: device & circuit implications

Heterogeneous nano- to wide-scale co-integration of beyond-Si and Si CMOS devices to enhance future electronics

Tackling CMP challenges related to the integration of III-V materials for <10nm node applications

3D-COSTAR: A tool for 2.5D/3D test flow optimization

Experimental validation of electromigration by low frequency noise measurement for advanced interconnects application

Constant voltage electromigration for advanced BEOL copper interconnects

Line profile measurement of advanced-FinFET features by reference metrology

Investigation of the electrical properties of carbon doped Si0.75Ge0.25/Si hetero junction diodes by 2 MeV electron irradiation

EUV scanner printability evaluation of natural blank defects detected by actinic blank inspection

Three zones of current collection: more than the space charge limit in thick organic photovoltaics

Non-halogenated solvent systems for blade coating of diketopyrrolopyrrole-based organic photovoltaics

Blade coating of diketopyrrolopyrrole based organic photovoltaics from non-halogenated solvent systems

Perovskite photovoltaics via concurrently pumped ultrasonic spray coating

Efficient perovskite photovoltaics via concurrently pumped ultrasonic spray coating

High performance diketopyrrolopyrrole based organic photovoltaics via concurrently pumped ultrasonic spray coating

A valve-less capillary system: a novel approach for passive flow control on chip

Developing an ellipsometry-based biosensor platform viacovalent and oriented coupling of the nanobody targeting the vascular cell adhesu-ion molecule-1 to a silicon wafer

Free layer effective anisotropy thickness in high TMR top and bottom pinned perpendicular magnetic tunnel junctions

ASIC design and prototyping for education and innovation with a look on Latin America

A novel structure of MOSFET array to measure Ioff-Ion with high accuracy and high density

Conference contributions: Recent submissions

Vertical device architecture for 5nm and beyond: device & circuit implications ﻿

Heterogeneous nano- to wide-scale co-integration of beyond-Si and Si CMOS devices to enhance future electronics ﻿

Tackling CMP challenges related to the integration of III-V materials for <10nm node applications ﻿

3D-COSTAR: A tool for 2.5D/3D test flow optimization ﻿

Experimental validation of electromigration by low frequency noise measurement for advanced interconnects application ﻿

Constant voltage electromigration for advanced BEOL copper interconnects ﻿

Line profile measurement of advanced-FinFET features by reference metrology ﻿

Investigation of the electrical properties of carbon doped Si0.75Ge0.25/Si hetero junction diodes by 2 MeV electron irradiation ﻿

EUV scanner printability evaluation of natural blank defects detected by actinic blank inspection ﻿

Three zones of current collection: more than the space charge limit in thick organic photovoltaics ﻿

Non-halogenated solvent systems for blade coating of diketopyrrolopyrrole-based organic photovoltaics ﻿

Blade coating of diketopyrrolopyrrole based organic photovoltaics from non-halogenated solvent systems ﻿

Perovskite photovoltaics via concurrently pumped ultrasonic spray coating ﻿

Efficient perovskite photovoltaics via concurrently pumped ultrasonic spray coating ﻿

High performance diketopyrrolopyrrole based organic photovoltaics via concurrently pumped ultrasonic spray coating ﻿

A valve-less capillary system: a novel approach for passive flow control on chip ﻿

Developing an ellipsometry-based biosensor platform viacovalent and oriented coupling of the nanobody targeting the vascular cell adhesu-ion molecule-1 to a silicon wafer ﻿

Free layer effective anisotropy thickness in high TMR top and bottom pinned perpendicular magnetic tunnel junctions ﻿

ASIC design and prototyping for education and innovation with a look on Latin America ﻿

A novel structure of MOSFET array to measure Ioff-Ion with high accuracy and high density ﻿

Vertical device architecture for 5nm and beyond: device & circuit implications

Heterogeneous nano- to wide-scale co-integration of beyond-Si and Si CMOS devices to enhance future electronics

Tackling CMP challenges related to the integration of III-V materials for <10nm node applications

3D-COSTAR: A tool for 2.5D/3D test flow optimization

Experimental validation of electromigration by low frequency noise measurement for advanced interconnects application

Constant voltage electromigration for advanced BEOL copper interconnects

Line profile measurement of advanced-FinFET features by reference metrology

Investigation of the electrical properties of carbon doped Si0.75Ge0.25/Si hetero junction diodes by 2 MeV electron irradiation

EUV scanner printability evaluation of natural blank defects detected by actinic blank inspection

Three zones of current collection: more than the space charge limit in thick organic photovoltaics

Non-halogenated solvent systems for blade coating of diketopyrrolopyrrole-based organic photovoltaics

Blade coating of diketopyrrolopyrrole based organic photovoltaics from non-halogenated solvent systems

Perovskite photovoltaics via concurrently pumped ultrasonic spray coating

Efficient perovskite photovoltaics via concurrently pumped ultrasonic spray coating

High performance diketopyrrolopyrrole based organic photovoltaics via concurrently pumped ultrasonic spray coating

A valve-less capillary system: a novel approach for passive flow control on chip

Developing an ellipsometry-based biosensor platform viacovalent and oriented coupling of the nanobody targeting the vascular cell adhesu-ion molecule-1 to a silicon wafer

Free layer effective anisotropy thickness in high TMR top and bottom pinned perpendicular magnetic tunnel junctions

ASIC design and prototyping for education and innovation with a look on Latin America

A novel structure of MOSFET array to measure Ioff-Ion with high accuracy and high density