Solving the Annealing of Mo Interconnects for Next-Gen Integrated Circuits

View/open

Published version (2.583Mb)

Metadata

Show full item record

Authors

Erofeev, Ivan; Hartanto, Antony Winata; Saidov, Khakimjon; Aabdin, Zainul; Pacco, Antoine; Philipsen, Harold; Tjiu, Weng Weei; Hui, Hui Kim; Holsteyns, Frank; Mirsaidov, Utkur

DOI

10.1002/aelm.202400035

ISSN

2199-160X

Issue

9

Journal

ADVANCED ELECTRONIC MATERIALS

Volume

10

Title

Solving the Annealing of Mo Interconnects for Next-Gen Integrated Circuits

Publication type

Journal article

Embargo date

2024-06-24

Collections

Articles