Browsing by author "Philipsen, Harold"
Now showing items 1-20 of 71
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3D wafer-level packaging die stacking using spin-on-dielectric polymer liner through-silicon vias
Civale, Yann; Sabuncuoglu Tezcan, Deniz; Philipsen, Harold; Duval, Fabrice; Jaenen, Patrick; Travaly, Youssef; Soussan, Philippe; Swinnen, Bart; Beyne, Eric (2011) -
A simple copper metallisation process for high cell efficiencies and reliable modules
Russell, Richard; Tous, Loic; Philipsen, Harold; Horzel, Jörg; Cornagliotti, Emanuele; Ngamo Toko, Michel; Choulat, Patrick; Labie, Riet; Beckers, Johan; Bertens, Jurgen; Fuji, Masaki; John, Joachim; Poortmans, Jef; Mertens, Robert (2012) -
Aggregate-Free Micrometer-Thick Mesoporous Silica Thin Films on Planar and Three-Dimensional Structured Electrodes by Hydrodynamic Diffusion Layer Control during Electrochemically Assisted Self-Assembly
Vanheusden, Genis; Philipsen, Harold; Herregods, Sebastiaan; Vereecken, Philippe (2021) -
Air gap-based MEMS switch technology using nickel surface micromachining
Ekkels, Phillip; Rottenberg, Xavier; Czarnecki, Piotr; Philipsen, Harold; Mertens, Robert; Puers, Bob; Tilmans, Harrie (2011) -
Application of CMOS metal barriers to copper plated silicon solar cells
Hernandez, Jose Luis; Tous, Loic; Allebe, Christophe; Philipsen, Harold; Schlenker, Eva; John, Joachim; Baert, Kris; Poortmans, Jef (2010-09) -
Bath stability monitoring for electroless Cu seed formation in high aspect ratio TSV
Inoue, Fumihiro; Philipsen, Harold; Armini, Silvia; Radisic, Alex; Civale, Yann; Leunissen, Peter; Shingubara, Shose (2012) -
Co and Ru dual damascene compatible metallization studies
van der Veen, Marleen; Heylen, Nancy; Lariviere, Stephane; Vega Gonzalez, Victor; Kesters, Els; Le, Quoc Toan; Teugels, Lieve; Chew, Soon Aik; Philipsen, Harold; Hung, Joey; Adelmann, Christoph; Vanstreels, Kris; Jourdan, Nicolas; Holsteyns, Frank; Struyf, Herbert; Wilson, Chris; Tokei, Zsolt (2019) -
Conformal electrodeposition of manganese dioxide for 3D thin-film lithium-ion battery application
Timmermans, Marina; Philipsen, Harold; Vereecken, Philippe (2015) -
Controlled and Uniform Wet Etching of Molybdenum Nanowires
Deng, Kerong; Erofeev, Ivan; Ray Chowdhuri, Angshuman; Saidov, Khakimjon; Aabdin, Zainul; Pacco, Antoine; Philipsen, Harold; Holsteyns, Frank; Vinh Huynh, Han; Mirsaidov, Utkur (2023-09) -
Controlled Stepwise Wet Etching of Polycrystalline Mo Nanowires
Saidov, Khakimjon; Erofeev, Ivan; Aabdin, Zainul; Pacco, Antoine; Philipsen, Harold; Hartanto, Antony Winata; Chen, Yifan; Yan, Hongwei; Tjiu, Weng Weei; Holsteyns, Frank; Mirsaidov, Utkur (2024) -
Copper plating for 3D interconnects
Radisic, Alex; Luhn, Ole; Philipsen, Harold; El-Mekki, Zaid; Honore, Mia; Rodet, Simon; Armini, Silvia; Drijbooms, Chris; Bender, Hugo; Ruythooren, Wouter (2011) -
Correlation between Cu microstructure and TSV Cu pumping
De Messemaeker, Joke; Varela Pedreira, Olalla; Philipsen, Harold; Beyne, Eric; De Wolf, Ingrid; Van der Donck, Tom; Croes, Kristof (2014) -
Cu electrodeposition for Through-Silicon Via Technology
Philipsen, Harold; Luhn, Ole; Sabuncuoglu Tezcan, Deniz; Civale, Yann; Ruythooren, Wouter (2009) -
Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias
Inoue, Fumihiro; Philipsen, Harold; van der Veen, Marleen; Vandersmissen, Kevin; Van Huylenbroeck, Stefaan; Struyf, Herbert; Tanaka, Tetsu (2014) -
Defect detection in through silicon vias by GHz scanning acoustic microscopy: key ultrasonic characteristics
Phommahaxay, Alain; De Wolf, Ingrid; Djuric, Tatjana; Hoffrogge, Peter; Brand, Sebastien; Czurratis, Peter; Philipsen, Harold; Beyer, Gerald; Struyf, Herbert; Beyne, Eric (2014) -
Development of glyoxylic acid based electroless copper deposition on ruthenium
Inoue, Fumihiro; Philipsen, Harold; van der Veen, Marleen; Van Huylenbroeck, Stefaan; Armini, Silvia; Struyf, Herbert; Tanaka, Tetsu; Shingubara, Shoso (2014) -
Development of glyoxylic acid based electroless copper deposition on ruthenium
Inoue, Fumihiro; Philipsen, Harold; van der Veen, Marleen; Van Huylenbroeck, Stefaan; Armini, Silvia; Struyf, Herbert; Shingubara, Shoso; Tanaka, Tetsu (2015) -
Die stacking using 3D-wafer level packaging copper/polymer through-Si via technology and Cu/Sn interconnect bumping
Civale, Yann; Sabuncuoglu Tezcan, Deniz; Philipsen, Harold; Jaenen, Patrick; Agarwal, Rahul; Duval, Fabrice; Soussan, Philippe; Travaly, Youssef; Beyne, Eric (2009) -
Electrodeposition for 3D integration
Philipsen, Harold; Radisic, Alex; Luhn, Ole; Civale, Yann; Vandersmissen, Kevin; Rodet, Simon; Honore, Mia; Leunissen, Peter (2010) -
Electrodeposition of Ø50 × 50 μm Cu pillars for 3D stacking applications
El-Mekki, Zaid; Philipsen, Harold; Honore, Mia; Radisic, Alex; Slabbekoorn, John; Arnold, Marco; Fluegel, Alexander; Shu-Ya Chang, Iris; Struyf, Herbert; Mayer, Dieter (2016)