Now showing items 1-6 of 6

    • Buried power rail integration with FinFETs for ultimate CMOS scaling 

      Gupta, Anshul; Varela Pedreira, Olalla; Arutchelvan, Goutham; Zahedmanesh, Houman; Devriendt, Katia; Hanssen, Frederik; Tao, Zheng; Ritzenthaler, Romain; Wang, Shouhua; Radisic, Dunja; Kenis, Karine; Teugels, Lieve; Sebaai, Farid; Lorant, Christophe; Jourdan, Nicolas; Chan, BT; Subramanian, Sujith; Schleicher, Filip; Hopf, Toby; Peter, Antony; Rassoul, Nouredine; Debruyn, Haroen; Demonie, Ingrid; Siew, Yong Kong; Chiarella, Thomas; Briggs, Basoene; Zhou, Daisy; Rosseel, Erik; De Keersgieter, An; Capogreco, Elena; Dentoni Litta, Eugenio; Boccardi, Guillaume; Baudot, Sylvain; Mannaert, Geert; Bontemps, Noemie; Sepulveda Marquez, Alfonso; Mertens, Sofie; Kim, Min-Soo; Dupuy, Emmanuel; Vandersmissen, Kevin; Paolillo, Sara; Cousserier, Joris; Yakimets, Dmitry; Lazzarino, Frederic; Chehab, Bilal; Favia, Paola; Drijbooms, Chris; Jaysankar, Manoj; Morin, Pierre; Altamirano Sanchez, Efrain; Mitard, Jerome; Wilson, Chris; Holsteyns, Frank; Boemmels, Juergen; Demuynck, Steven; Tokei, Zsolt; Horiguchi, Naoto (2020)
    • Direct metal etch for advanced interconnect 

      Paolillo, Sara; Wan, Danny; Lazzarino, Frederic; Rassoul, Nouredine; Piumi, Daniele; Tokei, Zsolt (2018)
    • E-test validation of space error budget and metrology 

      Schelcher, Guillaume; De Poortere, Etienne P.; Kissoon, Nicola; Paolillo, Sara; e Silva, Marsil A. C.; Zhang, Yichen; Tabery, Cyrus; Mulkens, Jan; McManus, Moyra; Leray, Philippe; Halder, Sandip (2022-06-30)
    • Evolution of lithography-to-etch bias in multi-patterning processes 

      Panneerchelvam, Prem; Agarwal, Ankur; Huard, Chad M. M.; Pret, Alessandro Vaglio; Mani, Antonio; Gronheid, Roel; Demand, Marc; Kumar, Kaushik; Paolillo, Sara; Lazzarino, Frederic (2022)
    • Extreme contact shrink for back end of line connectivity 

      Schleicher, Filip; Paolillo, Sara; Decoster, Stefan; Wu, Chen; Vega Gonzalez, Victor; Hasan, Mahmudul; Beral, Christophe; Lazzarino, Frederic (2022-05-10)
    • Sequential infiltration synthesis for line edge roughness mitigation of EUV resist 

      Baryshnikova, Marina; De Simone, Danilo; Knaepen, Werner; Kachel, Krzysztof; Chan, BT; Paolillo, Sara; Maes, Jan; De Roest, David; Rincon Delgadillo, Paulina; Vandenberghe, Geert (2017)