Browsing Articles by imec author "759f59d90a1302fe1a08f552b3b65bda7da66ac2"
Now showing items 1-12 of 12
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A photo-elastic microscopy study of the temperature dependecy of stress induced by through silicon vias in silicon
Herms, Martin; Wagner, Matthias; De Messemaeker, Joke; De Wolf, Ingrid (2017) -
Degradation of Cu6Sn5 intermetallic compound by pore formation in solid-liquid interdiffusion Cu/Sn microbump interconnects
Panchenko, Iuliana; Croes, Kristof; De Wolf, Ingrid; De Messemaeker, Joke; Beyne, Eric; Wolter, Klaus-Juergen (2014) -
Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures
Dimcic, Biljana; Labie, Riet; De Messemaeker, Joke; Vanstreels, Kris; Croes, Kristof; Verlinden, Bert; De Wolf, Ingrid (2012) -
Effect of test structure on electromigration characteristics in 3D-TSV stacked devices
Oba, Yoshiyuki; De Messemaeker, Joke; Tyrovouzi, Anna-Maria; Miyamori, Yuichi; De Vos, Joeri; Wang, Teng; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid; Croes, Kristof (2015) -
Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects
Kljucar, Luka; Gonzalez, Mario; Croes, Kristof; De Wolf, Ingrid; De Messemaeker, Joke; Murdoch, Gayle; Nolmans, Philip; De Vos, Joeri; Boemmels, Juergen; Tokei, Zsolt (2017) -
Interaction forces between a glass surface and ceria-modified PMMA-based abrasives for CMP measured by colloidal probe AFM
Armini, Silvia; Burtovyy, Ruslan; Moinpour, Mansour; Luzinov, Igor; De Messemaeker, Joke; Whelan, Caroline; Maex, Karen (2008) -
Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling
Nabiollahi, Nabi; Moelans, Nele; Gonzalez, Mario; De Messemaeker, Joke; Wilson, Chris; Croes, Kristof; Beyne, Eric; De Wolf, Ingrid (2015) -
Reliability Challenges in Advanced 3D Technologies: The Case of Through Silicon Vias and SiCN-SiCN Wafer-to-Wafer Hybrid-Bonding Technologies
Chery, Emmanuel; Fohn, Corinna; De Messemaeker, Joke; Beyne, Eric (2023) -
Reliability challenges related to TSV integration and 3D stacking
Croes, Kristof; De Messemaeker, Joke; Li, Yunlong; Guo, Wei; Varela Pedreira, Olalla; Cherman, Vladimir; Stucchi, Michele; De Wolf, Ingrid; Beyne, Eric (2016) -
Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bonding
Tsau, Yan Wen; De Messemaeker, Joke; Salahouelhadj, Abdellah; Gonzalez, Mario; Witters, Liesbeth; Zhang, Boyao; Seefeldt, Marc; Beyne, Eric; De Wolf, Ingrid (2022) -
Sn whisker evaluations in 3D microbumped structures
Vakanas, George; Vandecasteele, Bjorn; Schaubroeck, David; De Messemaeker, Joke; Willems, Geert; Ashworth, Mark A.; Wilcox, Geoffrey D.; De Wolf, Ingrid (2014) -
Statistical distribution of through-silicon via Cu pumping
De Messemaeker, Joke; Roussel, Philippe; Varela Pedreira, Olalla; Van der Donck, Tom; Van Huylenbroeck, Stefaan; Beyne, Eric; De Wolf, Ingrid; Stucchi, Michele; Croes, Kristof (2017)