Browsing Presentations by imec author "409d33832e4264f8f1a713c9d36a6b1d48b72b3a"
Now showing items 1-14 of 14
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3-D Integration from system design perspective
Milojevic, Dragomir; Van der Plas, Geert (2009) -
3D-Integration: status, opportunities
Van der Plas, Geert; Marchal, Pol (2011) -
3D-stacked integrated circuits: design consequences, architectural aspects, design methodologies and tools
Milojevic, Dragomir; Van der Plas, Geert (2009) -
Analog designer's playground beyond 20nm, is it Circuit Physics or Auto Place&Route?
Van der Plas, Geert; Wambacq, Piet; Verkest, Diederik; Steegen, An (2013) -
Application of substrate noise simulation methodology to 3D-stacking
Bronckers, Stephane; Van der Plas, Geert; Marchal, Pol; Rolain, Yves (2009) -
CMOS technology development vehicle for bulk FinFET N10/N7
Dehan, Morin; Boemmels, Juergen; Horiguchi, Naoto; Van der Plas, Geert (2013) -
Design of femto-joule energy efficiency ADCs in CMOS
Van der Plas, Geert (2008) -
Design of femto-joule energy efficiency ADCs in CMOS
Van der Plas, Geert (2008) -
ESD evaluation of 3D SIC technology using TSV
Thijs, Steven; Linten, Dimitri; Scholz, Mirko; Mercha, Abdelkarim; Van der Plas, Geert; Travaly, Youssef; Van Olmen, Jan; Groeseneken, Guido (2010) -
Substrate noise coupling: accurate modeling for deep sub-micron technologies
Van der Plas, Geert (2005) -
Supply and substrate noise in VCOs
Craninckx, Jan; Soens, Charlotte; Van der Plas, Geert (2005) -
The future of 3D integration from all angles
Van der Plas, Geert (2009) -
Thermal aspects of 3D and 2.5D integration
Oprins, Herman; Cherman, Vladimir; Van der Plas, Geert; Beyne, Eric (2014) -
Thermal modeling and experimental validation of thermal effects of 3D-ICs
Srinivasan, Adi; Cheng, Edmund; Oprins, Herman; Van der Plas, Geert (2010)