Browsing Presentations by imec author "6ae09c53bb67e38bfed177c88fd2bcc78f5cdce6"
Now showing items 1-8 of 8
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A method to pattern tight tip-to-tip in 32nm-pitch N5 interconnect using Ru area selective deposition tone inversion process
Briggs, Basoene; Soethoudt, Job; Delabie, Annelies; Wilson, Chris; Tokei, Zsolt; Boemmels, Juergen; Devriendt, Katia; Sebaai, Farid; Lorant, Christophe; Hody, Hubert (2018) -
Characterization of CVD-Mn barrier layers using X-ray absorption fine structure
Ablett, James; Wilson, Chris; Phuong, Nguyen Mai; Koike, Junichi; Tokei, Zsolt; Sterbinsky, George; Woicik, Joseph (2011) -
In-situ growth of Cu-Mn alloy self-forming barriers in 100 nm Cu/Low-k damascene interconnects
Wilson, Chris; Volders, Henny; Tokei, Zsolt; Croes, Kristof; Pantouvaki, Marianna; Beyer, Gerald; Horsfall, A.B.; O'Neill, A.G. (2009) -
Integration challenges of spin torque majority gatelogic
Wilson, Chris; Manfrini, Mauricio; Thiam, Arame; Souriau, Laurent; Babaei Gavan, Khashayar; Rassoul, Nouredine; Radisic, Dunja; Vaysset, Adrien; Trivkovic, Darko; Ercken, Monique; Swerts, Johan; Briggs, Basoene; Sayan, Safak; Radu, Iuliana; Mocuta, Dan (2016) -
Interpretation of Cu/SOG stress induced voiding using stress measurements performed with synchrotron radiation
Wilson, Chris; Croes, Kristof; Ablett, James; Lofrano, Melina; Beyer, Gerald; Tokei, Zsolt (2011) -
Recent advances in fundamental understanding of reliability phenomena in downscaled copper interconnects
Croes, Kristof; Wilson, Chris; Lofrano, Melina; Beyer, Gerald; Tokei, Zsolt (2011) -
Simulation of the effect of microstructure on the elastic properties of copper interconnects
Wilson, Chris; Oila, A.; Sanderson, L.; Bull, S.; Raskin, Jean-Pierre; Croes, Kristof; Horsfall, A.; O'Neill, A.; Tokei, Zsolt; Beyer, Gerald (2010) -
Texture characterization of Cu interconnects with different Ta based sidewall diffusion barriers
Wilson, Chris; Zhao, Chao; Volders, Henny; Zhao, Larry; Croes, Kristof; Tokei, Zsolt; Beyer, Gerald (2010)