Browsing by Author "Chen, Jian"
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Publication Bonding on Cu: a new stress evaluation approach by Raman spectroscopy
Proceedings paper2002, Proceedings 4th Electronics Packaging Technology Conference, 10/12/2002, p.60-64Publication High resolution stress and temperature measurements in semiconductor devices using micro-Raman spectroscopy
Proceedings paper1999, Advanced Photonic Sensors and Applications, 30/11/1999, p.239-252Publication Infrared interface analysis of high-k dielectrics deposited by atomic layer chemical vapour deposition
Proceedings paper2001, Extended Abstracts of the International Workshop on Gate Insulator - IWGI, 1/11/2001, p.226-229Publication Integration issues of polysilicon with high k dielectrics deposited by Atomic Layer Chemical Vapor Deposition
Proceedings paper2002, Semiconductor Silicon 2002. Proceedings of the 9th International Symposium on Silicon Materials Science and Technology, 12/05/2002, p.747-760Publication Local stress analysis on polymer sud grid array (PSGA) packages by raman spectroscopy and FEM simulation
Proceedings paper2001, Proceedings of the 2nd Eurosime Conference; 9-11 April 2001; Paris, France., p.209-214Publication Local stress measurements in packaging by Raman spectroscopy
Proceedings paper2000, Proceedings of the 3rd Electronics Packaging Technology Conference - EPTC, 5/12/2000, p.159-162Publication Mechanical issues of Cu to Cu wire bonding
Journal article2004-09, IEEE Trans. Components and Packaging Technologies, (27) 3, p.539-545Publication Micro-Raman spectroscopy study of the mechanical stress induced by BGA-assembly and validation by FEM
Proceedings paper2001, Proceedings 13th European Microelectronics and Packaging Conference & Exhibition; 30 May - 1 June 2001; Strasbourg, France., p.34-38Publication Physical characterization of high-k gate stacks deposited on HF-last surfaces
Proceedings paper2001, Ectended Abstracts of the International Workshop on Gate Insulator. IWGI 2001, 1/11/2001, p.86-92Publication Raman spectroscopy as a stress sensor in packaging: correct formulae for different sample surfaces
Publication Stress evaluation in packaging using Raman spectroscopy and finite element simulation
Chen, JianPHD thesis2004-04Publication Study of damage and stress induced by backgrinding in Si wafers
Publication Temperature profile measurement and failure characterization of ESD protection devices using spectroscopic photon emission microscopy and Raman spectroscopy
Proceedings paper1999, Conference Proceedings from the 25th International Symposium for Testing and Failure Analysis - ISTFA, 14/11/1999, p.69-76Publication Theoretical and experimental Raman spectroscopy study of mechanical stress induced by electronic packaging
Publication Thermal processing of high-K materials thermodynamics and kinetics
Meeting abstract2002, 201st Meeting of the Electrochemical Society. Rapid Thermal and Other Short Time Processing Technologies III, 12/05/2002, p.715