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Browsing by Author "Chiappe, Daniele"

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    2D materials: roadmap to CMOS integration

    Huyghebaert, Cedric  
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    Schram, Tom  
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    Smets, Quentin  
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    Agarwal Kumar, Tarun
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    Verreck, Devin  
    Proceedings paper
    2018, IEEE Electron Devices Meeting - IEDM, 1/12/2018, p.512-515
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    Advanced semiconductor devices for future CMOS technologies

    Claeys, Cor
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    Chiappe, Daniele
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    Collaert, Nadine  
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    Mitard, Jerome  
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    Radu, Iuliana  
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    Rooyackers, Rita
    Proceedings paper
    2015, Advanced CMOS-Compatible Semiconductor Devices 17, 25/05/2015, p.49-60
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    Analysis of admittance measurements of MOS capacitors on CVD grown bilayer MoS2

    Gaur, Abhinav  
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    Chiappe, Daniele
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    Lin, Dennis  
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    Cott, Daire  
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    Asselberghs, Inge  
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    Heyns, Marc  
    Journal article
    2019, 2D Materials, (6) 3, p.35035
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    Analysis of transferred MoS2 layers grown by MOCVD: evidence of Mo vacancy related defect formation

    Schoenaers, Ben  
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    Leonhardt, Alessandra  
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    Nalin Mehta, Ankit  
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    Stesmans, Andre  
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    Chiappe, Daniele
    Journal article
    2020, ECS Journal of Solid State Science and Technology, (9) 9, p.93001
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    Atomic layer processing of 2D materials for beyond CMOS applications

    Delabie, Annelies  
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    Caymax, Matty  
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    Groven, Benjamin  
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    Heyne, Markus
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    Zhang, Haodong
    Meeting abstract
    2016, International Conference on Atomic Layer Deposition - ALD, 24/07/2016
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    BEOL compatible WS2 transistors fully fabricated in a 300 mm pilot line

    Schram, Tom  
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    Smets, Quentin  
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    Heyne, Markus
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    Groven, Benjamin  
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    Kunnen, Eddy
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    Thiam, Arame  
    Proceedings paper
    2017, Silicon Nanoelectronics Workshop - SNW, 4/07/2017, p.139-140
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    Bringing 2D material integration from the lab to the fab

    Huyghebaert, Cedric  
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    Schram, Tom  
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    Brems, Steven  
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    Asselberghs, Inge  
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    Chiappe, Daniele
    Proceedings paper
    2017, Graphene 2017, 28/03/2017
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    Challenges of large area integration of 2D materials in CMOS line

    Huyghebaert, Cedric  
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    Schram, Tom  
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    Smets, Quentin  
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    Chiappe, Daniele
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    Asselberghs, Inge  
    Meeting abstract
    2018, Graphene Conference 2018, 26/06/2018
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    Characterization of grain boundaries and impact of plasma-induced patterned in 2D materials

    Celano, Umberto  
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    Virkki, Olli
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    Chiappe, Daniele
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    Heyne, Markus
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    Hoflijk, Ilse  
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    Franquet, Alexis  
    Oral presentation
    2017, Material Reserach Society Spring Meeting
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    Controlled sulfurization process for the synthesis of large area MoS2 films and MoS2-WS2 heterostructures

    Chiappe, Daniele
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    Asselberghs, Inge  
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    Sutar, Surajit  
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    Iacovo, Serena  
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    Afanasiev, Valeri  
    Journal article
    2016, Advanced Materials Interfaces, (3) 4, p.DOI: 10.1002/ad
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    Demonstration of direction dependent conduction through MoS2 films prepared by tunable mass transport fabrication

    Chiappe, Daniele
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    Mongillo, Massimo  
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    Asselberghs, Inge  
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    El Kazzi, Salim
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    Caymax, Matty  
    Journal article
    2016, ECS Journal of Solid State Science and Technology, (5) 11, p.Q3046-Q3049
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    Dielectric properties of spin-on metal oxides and their applications for 2D semiconductor devices

    Sayan, Safak
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    Lin, Dennis  
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    Asselberghs, Inge  
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    Chiappe, Daniele
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    Sutar, Surajit  
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    Radu, Iuliana  
    Oral presentation
    2016, SPIE Advanced Lithography Conference
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    Direct and indirect optical transitions in bulk and atomically thin MoS2 studied by photoreflectance and photoacoustic spectroscopy

    Kopaczek, Jan
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    Zelewski, Szymon
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    Polak, Maciej
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    Gawlik, Andrzej  
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    Chiappe, Daniele
    Journal article
    2019, Journal of Applied Physics, (125) 13, p.135701
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    Dry cleaning and doping of MX2 for contact engineering

    Marinov, Daniil
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    Ludwig, Jonathan  
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    Chiappe, Daniele
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    Voronina, Ekaterina
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    Rakhimova, Tatyana
    Meeting abstract
    2018, AVS 65th International Symposium & Exhibition, 21/10/2018
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    Effects of buried grain boundaries in multilayer MoS2

    Ludwig, Jonathan  
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    Nalin Mehta, Ankit  
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    Mascaro, Marco  
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    Celano, Umberto  
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    Chiappe, Daniele
    Journal article
    2019, Nanotechnology, (30) 28, p.285705
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    Effects of grain boundaries on the electronic properties of MoS2 layers

    Ludwig, Jonathan  
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    Chiappe, Daniele
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    Mascaro, Marco  
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    Celano, Umberto  
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    Asselberghs, Inge  
    Meeting abstract
    2018, E-MRS Spring Meeting Symposium K: Defect-induced Effects in Nanomaterials, 18/06/2018, p.K.VII.1
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    Electrical atomic force microscopy for 2D transition metal dichalcogenide materials

    Celano, Umberto  
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    Virkki, Olli
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    Mascaro, Marco  
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    Nalin Mehta, Ankit  
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    Bender, Hugo  
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    Chiappe, Daniele
    Proceedings paper
    2017, Emerging Materials for Post CMOS Devices/Sensing and Applications 8, 28/05/2017, p.41-47
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    Growth of multilayer transition-metal dichalcogenide layers by high temperature sulfurization in H2S

    Heyne, Markus
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    Nuytten, Thomas  
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    Meersschaut, Johan  
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    Chiappe, Daniele
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    Caymax, Matty  
    Oral presentation
    2015, Nanospectroscopy for Two-dimensional Materials
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    Heterogeneous nano- to wide-scale co-integration of beyond-Si and Si CMOS devices to enhance future electronics

    Thean, Aaron  
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    Collaert, Nadine  
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    Radu, Iuliana  
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    Waldron, Niamh  
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    Merckling, Clement  
    Proceedings paper
    2015, Silicon Compatible Materials, and Technologies for Advanced Integrated Processes, Circuits and Emerging Applications 5, 29/06/2015, p.3-14
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    Improving MOCVD MoS2 electrical performance: reducing ambient exposure

    Leonhardt, Alessandra  
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    Chiappe, Daniele
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    Asselberghs, Inge  
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    Huyghebaert, Cedric  
    Journal article
    2017, IEEE Electron Device Letters, (38) 11, p.1606-1609
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