Browsing by Author "Gray, William"
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Publication A comparative study of copper drift diffusion in plasma deposited a-SiC : H and Silicon Nitride
Journal article2001, Microelectronic Engineering, (55) 1_4, p.329-335Publication A comparative study of copper drift diffusion in plasma deposited A-Sic:H and silicon nitride
Oral presentation2000, Materials for Advanced Metallization Conference - MAM; February 28 - March 1, 2000; Stresa, Italy.Publication Integration of the 3MS low-k CVD material in a 0.18 μm Cu single damascene process
Proceedings paper2000, Advanced Metallization Conference 1999 - AMC 1999, 28/09/1999, p.33-39Publication Integration of the 3MS low-k CVD material in a 0.18µm Cu single damascene process
Oral presentation1999, Advanced Metallization Conference; September 28-30, 1999; Orlando, FL, USA.Publication Low-k materials etch and strip optimization for sub 0.25µm technology
Proceedings paper1999, Proceedings of the International Interconnect Technology Conference - IITC; San Francisco, CA, USA., p.53-55Publication Physical and electrical characterization of silsesquioxane-based ultra-low k dielectric films
Publication Process optimization and integration of trimethylsilane deposited a-SiC:H and SiOC:H dielectric thin films for damascene processing
Oral presentation2000, MRS Spring Meeting 2000. Symposium D: Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics; 2