Browsing by Author "Ho, Meng"
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Publication Advanced wire bonding: bonding on copper
Proceedings paper2002, Proceedings of the European Microelectronics Packaging and Interconnection Symposium - IMAPS-EUROPE, 16/06/2002, p.27-32Publication Bonding on Cu: a new stress evaluation approach by Raman spectroscopy
Proceedings paper2002, Proceedings 4th Electronics Packaging Technology Conference, 10/12/2002, p.60-64Publication Copper wire bonding to advanced copper back-end integrated circuits
Oral presentation2003, Semicon Europe, Advanced Packaging SeminarPublication Corrosion inhibition by self-assembled monolayers for enhanced wire bonding on Cu surfaces
Journal article2003, Microelectronic Engineering, (70) 2_4, p.551-557Publication Direct Au and Cu wire bonding on Cu/Low-k BEOL
Proceedings paper2002, Proceedings 4th Electronics Packaging Technology Conference, 10/12/2002, p.344-349Publication Direct gold and copper wires bonding on copper
Journal article2003, Microelectronics Reliability, (43) 6, p.913-923Publication Effect of recrystallization and grain growth on the reliability of Cu-Cu wire bonds
Proceedings paper2003, IMAPS-Nordic, 21/09/2003, p.126-132Publication Fine pitch copper wire bonding on copper bond pad process optimization
Proceedings paper2002, 4th International Symposium on Electronic Materials and Packaging, 3/12/2002, p.63-68Publication Flip chip assembly using SBB of high frequency GaAs modules
Proceedings paper2002, MicroTech, 29/01/2002Publication High density 3-D stack structure for SIP solutions
Proceedings paper2003, 14th European Microelectronics and Packaging Conference & Exhibition - EMPC, 23/02/2003, p.341-343Publication Miniaturization using 3-D stack structure for SIP applications
Proceedings paper2003, Proc. SMTA (Surface Mount Technology Association) International Conference, 21/09/2003Publication Mixed assembly on PCB of wide variety components (MCM-D, SMDs, bare dies) using wire bonding and SMT
Proceedings paper2002, Proceedings 52nd Electronic Components and Technology Conference, 28/05/2002, p.1671-1674Publication Orientation imaging microscopy applications in Cu-interconnects and Cu-Cu wire bonding
Proceedings paper2002, Proceedings 28th International Symposium for Testing and Failure Analysis - ISTFA, 3/11/2002, p.61-66