Browsing by Author "Lagrange, Sébastien"
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Publication A controlled deposition of organic contamination and the removal with ozone based cleaning
Proceedings paper2001, Ultra Clean Processing of Silicon Surfaces 2000: Proceedings of the 5th International Conference - UCPSS, 18/09/2000, p.223-226Publication Critical issues in post Cu CMP cleaning
Proceedings paper2000, Proceedings of the 9th International Symposium on Semiconductor Manufacturing - ISSM, 26/09/2000, p.415-418Publication Evaluation of ozonated water spray for resist cleaning applications
Meeting abstract1999, Electrochemical Society Fall Meeting: 6th International Symposium on Cleaning Technology in Semiconductor Device Manufacturing, 17/10/1999, p.1116Publication Evaluation of ozonated water spray for resist cleaning applications
Proceedings paper2000, Cleaning Technology in Semiconductor Device Manufacturing. Proceedings of the 6th International Symposium, 17/10/1999, p.391-398Publication Making the cleaner greener
Publication Non-correlated behavior of sheet resistance and stress during self-annealing of electroplated copper
Proceedings paper1999, Proceedings of the International Interconnect Technology Conference - IITC; San Francisco, CA, USA., p.290-292Publication Ozonated HF applications in a spray processing tool
Proceedings paper2002, Cleaning Technology in Semiconductor Device Manufacturing VII, 4/09/2001, p.314-321Publication Ozonated HF applications in a spray processing tool
Meeting abstract2001, 200th Meeting of the Electrochemical Society: 7th International Symposium on Cleaning Technology in Semiconductor Device Manufac, 2/09/2001Publication Pattern dependent corrosion effects in HF based post-Cu CMP cleanings
Proceedings paper2001, Ultra Clean Processing of Silicon Surfaces 2000: Proceedings of the 5th International Conference - UCPSS, 18/09/2000, p.275-278Publication Pre-diffusion cleaning using ozone and HF
Proceedings paper2001, Ultra Clean Processing of Silicon Surfaces 2000: Proceedings of the 5th International Conference - UCPSS, 18/09/2000, p.85-88Publication Roles of additive during filling process of damascene structures with electrochemical deposited copper
Oral presentation1999, Advanced Metallization Conference; September 28-30, 1999; Orlando, FL, USA.Publication Roles of additives during filling process of damascene structures with electrochemical deposited copper
Proceedings paper2000, Advanced Metallization Conference 1999 - AMC 1999, 28/09/1999, p.149-153Publication Self-annealing characterization of electroplated copper films
Journal article2000, Microelectronic Engineering, (50) 1_4, p.449-457Publication Self-annealing characterization of electroplated copper films
Oral presentation1999, European Workshop Materials for Advanced Metallization; March 8-10, 1999; Oostende, Belgium.Publication TOFSIMS evaluation of the removal of resists on silicon by ozone-based cleaning
; ; ; Publication Two-step room temperature grain growth in electroplated copper
Journal article1999, J. Appl. Phys., (86) 7, p.3642-3645