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Browsing by Author "Lauwers, A."

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    A low thermal budget pre metal dielectric stack using PECVD and HDP processing

    Schaekers, Marc  
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    De Jaeger, Brice  
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    Sleeckx, Erik  
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    Debusschere, Ingrid  
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    Van Hove, Marleen
    Oral presentation
    2001, 7th International Dielectrics & Conductors for ULSI Multilevel Interconnection Conference (DCMIC) and Exhibition
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    A manufacturable process to improve thermal stability of 0.25-µm cobalt silicided poly gate

    Wang, Qingfeng
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    Lauwers, A.
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    Deweerdt, Bruno  
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    Verbeeck, Rita  
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    Loosen, Fred  
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    Maex, Karen  
    Journal article
    1995, IEEE Trans. Semiconductor Manufacturing, (8) 4, p.449-451
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    A reliability study of titanium silicide lines using micro-Raman spectroscopy and electron microscopy

    De Wolf, Ingrid  
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    Howard, Dave
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    Rasras, Mahmoud
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    Lauwers, A.
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    Maex, Karen  
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    Groeseneken, Guido  
    Proceedings paper
    1997, Proceedings of 8th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - ESREF 97; October 1997., p.1591-1594
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    A reliability study of titanium silicide lines using micro-raman spectroscopy and electron microscopy

    De Wolf, Ingrid  
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    Howard, Dave
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    Rasras, Mahmoud
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    Lauwers, A.
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    Maex, Karen  
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    Groeseneken, Guido  
    Journal article
    1997, Microelectronics and Reliability, (37) 10_11, p.1591-1594
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    Comparative study of Ni-silicide and Co-silicide for sub 0.25 μm technologies

    Lauwers, A.
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    Besser, Paul  
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    Gutt, T.
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    Satta, Alessandra
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    de Potter de ten Broeck, Muriel  
    Oral presentation
    1999, European Workshop Materials for Advanced Metallization; March 8-10, 1999; Oostende, Belgium.
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    Comparative study of Ni-silicide and Co-silicide for sub 0.25-μm technologies

    Lauwers, A.
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    Besser, Paul  
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    Gutt, T.
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    Satta, Alessandra
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    de Potter de ten Broeck, Muriel  
    Journal article
    2000, Microelectronic Engineering, (50) 1_4, p.103-116
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    Effect of implantation oxide on the silicidation of narrow diffused and poly-lines

    Naem, Abdalla
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    Lauwers, A.
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    de Potter de ten Broeck, Muriel  
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    Maex, Karen  
    Oral presentation
    1997, Materials Research Society 1997 Spring Meeting : Symposium on Multilevel Metal Process Integration; April 1-2, 1997; San Francis
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    Electrical performance and scalability of Ni-monosilicide towards sub 0.13 μm technologies

    Lauwers, A.
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    de Potter de ten Broeck, Muriel  
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    Lindsay, Richard
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    Steegen, An
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    Roelandts, Nico
    Oral presentation
    2001, Symposium K of the MRS Spring Meeting: Gate Stack and Silicide Issues in Si Processing II; 16-20 April 2001; San Francisco, CA,
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    Electrical transport in (100)CoSi2/Si contacts

    Lauwers, A.
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    Kyllesbech Larsen, K.
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    Van Hove, Marleen
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    Verbeeck, Rita  
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    Maex, Karen  
    Journal article
    1995, J. Appl. Phys., (77) 6, p.2525-36
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    Electronic Transport in Metallic Iron Disilicide

    Kyllesbech Larsen, K.
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    Van Hove, Marleen
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    Lauwers, A.
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    Donaton, R. A.
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    Maex, Karen  
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    Van Rossum, Marc
    Journal article
    1994, Phys. Rev. B, 50, p.14200-14211
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    Growth of epitaxial b-FeSi2 on (100) silicon using Fe-Ti-Si diffusion couples

    Kyllesbech Larsen, K.
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    Tavares, J.
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    Bender, Hugo  
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    Donaton, R. A.
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    Lauwers, A.
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    Maex, Karen  
    Journal article
    1995, J. Appl. Phys., (78) 1, p.599-601
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    In situ transmission electron microscopy study of Ni silicide phases formed on (001) Si active lines

    Teodorescu, V.
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    Nistor, Leona
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    Bender, Hugo  
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    Steegen, An
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    Lauwers, A.
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    Maex, Karen  
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    Van Landuyt, J.
    Journal article
    2001, Journal of Applied Physics, (90) 1, p.167-174
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    In situ transmission electron microscopy study of the silicidation process in Co thin films on patterned (001) Si substrates

    Ghica, C.
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    Nistor, Leona
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    Bender, Hugo  
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    Steegen, An
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    Lauwers, A.
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    Maex, Karen  
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    Van Landuyt, J.
    Journal article
    2001, Journal of Materials Research, (16) 3, p.701-708
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    L-shape spacer architecture for low cost, high performance CMOS

    Augendre, Emmanuel
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    Perello, Carles
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    Vandamme, Ewout
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    Pochet, Sandrine
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    Rooyackers, Rita
    Proceedings paper
    2001, ULSI Process Integration II; 26 March 2001; Washington, D.C., USA., p.297-304
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    Materials aspects, electrical performance, and scalability of Ni-silicide towards sub-0.13μm technologies

    Lauwers, A.
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    Steegen, An
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    de Potter de ten Broeck, Muriel  
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    Lindsay, Richard
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    Satta, Alessandra
    Journal article
    2001, Journal of Vacuum Science & Technology B, (19) 6, p.2026-2037
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    Optimized thermal processing for Ti-Capped CoSi2 for 0.13 μm technology

    Lindsay, Richard
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    Lauwers, A.
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    de Potter de ten Broeck, Muriel  
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    Roelandts, Nico
    Journal article
    2001, Microelectronic Engineering, (55) 1_4, p.157-162
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    Optimized thermal processing for Ti-capped CoSi2 for 0.13μm technology

    Lindsay, Richard
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    Lauwers, A.
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    de Potter de ten Broeck, Muriel  
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    Roelandts, Nico
    Oral presentation
    2000, Materials for Advanced Metallization Conference - MAM; February 28 - March 1, 2000; Stresa, Italy.
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    Orientation-dependent stress build-up during the formation of epitaxial CoSi2

    Steegen, An
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    Detavernier, C.
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    Lauwers, A.
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    Maex, Karen  
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    Van Meirhaeghe, R. L.
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    Cardon, F.
    Journal article
    2001, Microelectronic Engineering, (55) 1_4, p.145-150
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    Self-aligned CoSi2 for 0.18mm and below

    Maex, Karen  
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    Lauwers, A.
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    Besser, Paul  
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    Kondoh, Eiichi
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    de Potter de ten Broeck, Muriel  
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    Steegen, An
    Journal article
    1999, IEEE Trans. Electron Devices, (46) 7, p.1545-1550
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    Silicide induced pattern density and orientation dependent transconductance in MOS transistors

    Steegen, An
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    Stucchi, Michele  
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    Lauwers, A.
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    Maex, Karen  
    Proceedings paper
    1999, International Electron Devices Meeting. Technical digest; 5-8 Dec. 1999; Washington, D.C., USA., p.497-500

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