Browsing by Author "Mebarki, Bencherki"
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Publication Barrier integrity effect on leakage mechanism and dielectric reliability of copper/OSG interconnects
Proceedings paper2005, Materials, Technology, and Reliability of Advanced Interconnects Interconnects, 28/03/2005, p.265-270Publication Barrier reliability on sub-100nm copper low-k interconnects
Oral presentation2004, Advanced Metallization ConferencePublication Barrier studies on porous silk semiconductor dielectric
Journal article2003, Microelectronic Engineering, (70) 2_4, p.352-357Publication Copper seed layer scaling for advanced interconnects: extendibility of I-PVD
Proceedings paper2003, Proceedings of the Advanced Metallization Conference 2002, 1/10/2002, p.403-407Publication Ni-based silicides for 45 nm CMOS and beyond
Journal article2004, Materials Science and Engineering B, 114-115, p.29-41Publication Reliability studies of MOCVD TiSin and EnCoRe Ta(N)/Ta
Journal article2003, Microelectronic Engineering, (70) 2_4, p.358-362