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Browsing by Author "Medjdoub, Farid"

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    A comprehensive reliability investigation of the voltage-, temperature- and device geometry-dependence of the gate degradation on state-of-the-art GaN-on-Si HEMTs

    Marcon, Denis  
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    Kauerauf, Thomas
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    Medjdoub, Farid
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    Das, Jo
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    Van Hove, Marleen
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    Srivastava, Puneet
    Proceedings paper
    2010-12, IEEE International Electron Device Meeting - IEDM, 6/12/2010, p.472-472
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    AlN/GaN heterostructures grown by metal organic vapor phase epitaxy with in situ Si3N4 passivation

    Cheng, Kai
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    Degroote, Stefan
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    Leys, Maarten
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    Medjdoub, Farid
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    Derluyn, Joff
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    Sijmus, Bram
    Journal article
    2011, Journal of Crystal Growth, (315) 1, p.204-207
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    Enhancement of GaN-based device robustness by means of in-situ SiN cap layer

    Medjdoub, Farid
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    Marcon, Denis  
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    Cheng, Kai
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    Van Hove, Marleen
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    Leys, Maarten
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    Decoutere, Stefaan  
    Meeting abstract
    2010, 5th Space Agency - MOD Round Table Workshop on GaN Component Technologies, 2/09/2010
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    Excellent stability of GaN-on-Si HEMTs with 5 μm gate-drain spacing tested in off-state at a record drain voltage of 200V and 200°C

    Marcon, Denis  
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    Van Hove, Marleen
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    Visalli, Domenica
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    Derluyn, Joff
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    Das, Jo
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    Medjdoub, Farid
    Proceedings paper
    2009, International Conference on Solid-State Devices and Materials Conference - SSDM, 7/10/2009, p.816-817
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    Excellent stability of GaN-on-Si high electron mobility transistors with 5 μm gate/drain spacing tested in off-state at a record drain voltage of 200 V and 200 °C

    Marcon, Denis  
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    Van Hove, Marleen
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    Visalli, Domenica
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    Derluyn, Joff
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    Das, Jo
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    Medjdoub, Farid
    Journal article
    2010, Japanese Journal of Applied Physics, (49) 4, p.04DF07
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    GaN-on-Si for power conversion

    Germain, Marianne
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    Derluyn, Joff
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    Van Hove, Marleen
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    Medjdoub, Farid
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    Das, Jo
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    Marcon, Denis  
    Proceedings paper
    2010, The International Conference on Compound Semiconductor Manufacturing Technology - CSMANTECH, 17/05/2010, p.225-228
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    GaN-on-Si HEMT stress under high electric field condition

    Marcon, Denis  
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    Lorenz, Anne
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    Derluyn, Joff
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    Das, Jo
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    Medjdoub, Farid
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    Cheng, Kai
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    Degroote, Stefan
    Journal article
    2009, Physica Status Solidi C, (6) S2, p.S1024-S1028
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    GaN-on-Si HEMT stress under high electric field condition

    Marcon, Denis  
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    Lorenz, Anne
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    Derluyn, Joff
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    Das, Jo
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    Medjdoub, Farid
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    Cheng, Kai
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    Degroote, Stefan
    Meeting abstract
    2008, International Workshop on Nitride Semiconductors - IWN, 6/10/2008, p.302-302
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    GaN-on-Si HEMTs Above 10 W/mm at 2 GHz together with high thermal stability at 325°C

    Medjdoub, Farid
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    Marcon, Denis  
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    Das, Jo
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    Derluyn, Joff
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    Cheng, Kai
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    Degroote, Stefan
    Proceedings paper
    2010, European Microwave Conference - EuMiC, 26/10/2010
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    GaN-on-Si power field effect transistors

    Germain, Marianne
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    Derluyn, Joff
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    Van Hove, Marleen
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    Medjdoub, Farid
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    Das, Jo
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    Cheng, Kai
    Proceedings paper
    2010, International Symposium on VLSI Technology Systems and Applications - VLSI-TSA, 26/04/2010, p.171-172
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    High temperature on- and off-state stress of GaN-on- Si HEMTs with in-situ Si3N4 cap layer

    Marcon, Denis  
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    Medjdoub, Farid
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    Visalli, Domenica
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    Van Hove, Marleen
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    Derluyn, Joff
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    Das, Jo
    Proceedings paper
    2010, IEEE International Reliability Physics Symposium - IRPS, 2/05/2010, p.146-151
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    Influence of thermal anneal steps on the current collapse of Fluorine treated enhancement mode SiN/AlGaN/GaN HEMTs

    Lorenz, Anne
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    Derluyn, Joff
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    Das, Jo
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    Cheng, Kai
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    Degroote, Stefan
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    Medjdoub, Farid
    Journal article
    2009, Physica Status Solidi C, (6) S2, p.S996-S998
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    Is GaN-on-Si HEMT technology suitable for space applications?

    Medjdoub, Farid
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    Marcon, Denis  
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    Das, Jo
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    Derluyn, Joff
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    Cheng, Kai
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    Degroote, Stefan
    Proceedings paper
    2010, Microwaves Technology and Techniques Workshop, 10/05/2010
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    Low leakage high breakdown E-mode GaN DHFET on Si by selective removal of in-situ grown Si3N4

    Derluyn, Joff
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    Van Hove, Marleen
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    Visalli, Domenica
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    Lorenz, Anne
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    Marcon, Denis  
    Proceedings paper
    2009-12, IEEE International Electron Devices Meeting - IEDM, 7/12/2009, p.157-160
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    Low on-resistance high-breakdown normally off AlN/GaN/AlGaN DHFET on Si substrate

    Medjdoub, Farid
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    Derluyn, Joff
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    Cheng, Kai
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    Leys, Maarten
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    Degroote, Stefan
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    Marcon, Denis  
    Journal article
    2010, IEEE Electron Device Letters, (31) 2, p.111-113
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    Novel E-mode GaN-on-Si MOSHEMT using a selective thermal oxidation

    Medjdoub, Farid
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    Van Hove, Marleen
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    Cheng, Kai
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    Marcon, Denis  
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    Leys, Maarten
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    Decoutere, Stefaan  
    Journal article
    2010, IEEE Electron Device Letters, (31) 9, p.948-950
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    Preliminary reliability assessment of GaN-on-Si HEMT using in-situ Si3N4 cap layer

    Marcon, Denis  
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    Lorenz, Anne
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    Derluyn, Joff
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    Das, Jo
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    Medjdoub, Farid
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    Cheng, Kai
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    Degroote, Stefan
    Meeting abstract
    2008, 17th European Heterostructure Technology Workshop - HETECH, 3/11/2008, p.147-148
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    Preliminary reliability at 50 V of State-of-the-art RF power GaN-on-Si HEMTs

    Medjdoub, Farid
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    Marcon, Denis  
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    Das, Jo
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    Derluyn, Joff
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    Cheng, Kai
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    Degroote, Stefan
    Proceedings paper
    2010, 68th Annual Device Research Conference - DRC, 21/06/2010, p.195-196
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    Thermal stability enhancement of GaN-based devices: towards highly reliable MOSHEMT

    Medjdoub, Farid
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    Derluyn, Joff
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    Cheng, Kai
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    Degroote, Stefan
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    Germain, Marianne
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    Borghs, Gustaaf  
    Proceedings paper
    2008, International Workshop on Nitride Semiconductors - IWN, 6/10/2008
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    Towards High Performance E-Mode InAIN/GaN HEMTs

    Medjdoub, Farid
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    Alomari, A.
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    Carlin, J.-F.
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    Gonschorek, M.
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    Feltin, E.
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    Py, M.A.
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    Gaquiere, C.
    Meeting abstract
    2008, 32nd Workshop on Compound Semiconductor Devices and Integrated Circuits - WOCSDICE, 18/05/2008
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