Browsing by Author "Medjdoub, Farid"
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Publication A comprehensive reliability investigation of the voltage-, temperature- and device geometry-dependence of the gate degradation on state-of-the-art GaN-on-Si HEMTs
Proceedings paper2010-12, IEEE International Electron Device Meeting - IEDM, 6/12/2010, p.472-472Publication AlN/GaN heterostructures grown by metal organic vapor phase epitaxy with in situ Si3N4 passivation
;Cheng, Kai ;Degroote, Stefan ;Leys, Maarten ;Medjdoub, Farid ;Derluyn, JoffSijmus, BramJournal article2011, Journal of Crystal Growth, (315) 1, p.204-207Publication Enhancement of GaN-based device robustness by means of in-situ SiN cap layer
Meeting abstract2010, 5th Space Agency - MOD Round Table Workshop on GaN Component Technologies, 2/09/2010Publication Excellent stability of GaN-on-Si HEMTs with 5 μm gate-drain spacing tested in off-state at a record drain voltage of 200V and 200°C
Proceedings paper2009, International Conference on Solid-State Devices and Materials Conference - SSDM, 7/10/2009, p.816-817Publication Excellent stability of GaN-on-Si high electron mobility transistors with 5 μm gate/drain spacing tested in off-state at a record drain voltage of 200 V and 200 °C
Journal article2010, Japanese Journal of Applied Physics, (49) 4, p.04DF07Publication GaN-on-Si for power conversion
Proceedings paper2010, The International Conference on Compound Semiconductor Manufacturing Technology - CSMANTECH, 17/05/2010, p.225-228Publication GaN-on-Si HEMT stress under high electric field condition
Journal article2009, Physica Status Solidi C, (6) S2, p.S1024-S1028Publication GaN-on-Si HEMT stress under high electric field condition
Meeting abstract2008, International Workshop on Nitride Semiconductors - IWN, 6/10/2008, p.302-302Publication GaN-on-Si HEMTs Above 10 W/mm at 2 GHz together with high thermal stability at 325°C
Proceedings paper2010, European Microwave Conference - EuMiC, 26/10/2010Publication GaN-on-Si power field effect transistors
;Germain, Marianne ;Derluyn, Joff ;Van Hove, Marleen ;Medjdoub, Farid ;Das, JoCheng, KaiProceedings paper2010, International Symposium on VLSI Technology Systems and Applications - VLSI-TSA, 26/04/2010, p.171-172Publication High temperature on- and off-state stress of GaN-on- Si HEMTs with in-situ Si3N4 cap layer
Proceedings paper2010, IEEE International Reliability Physics Symposium - IRPS, 2/05/2010, p.146-151Publication Influence of thermal anneal steps on the current collapse of Fluorine treated enhancement mode SiN/AlGaN/GaN HEMTs
;Lorenz, Anne ;Derluyn, Joff ;Das, Jo ;Cheng, Kai ;Degroote, StefanMedjdoub, FaridJournal article2009, Physica Status Solidi C, (6) S2, p.S996-S998Publication Is GaN-on-Si HEMT technology suitable for space applications?
Proceedings paper2010, Microwaves Technology and Techniques Workshop, 10/05/2010Publication Low leakage high breakdown E-mode GaN DHFET on Si by selective removal of in-situ grown Si3N4
Proceedings paper2009-12, IEEE International Electron Devices Meeting - IEDM, 7/12/2009, p.157-160Publication Low on-resistance high-breakdown normally off AlN/GaN/AlGaN DHFET on Si substrate
Journal article2010, IEEE Electron Device Letters, (31) 2, p.111-113Publication Novel E-mode GaN-on-Si MOSHEMT using a selective thermal oxidation
Journal article2010, IEEE Electron Device Letters, (31) 9, p.948-950Publication Preliminary reliability assessment of GaN-on-Si HEMT using in-situ Si3N4 cap layer
Meeting abstract2008, 17th European Heterostructure Technology Workshop - HETECH, 3/11/2008, p.147-148Publication Preliminary reliability at 50 V of State-of-the-art RF power GaN-on-Si HEMTs
Proceedings paper2010, 68th Annual Device Research Conference - DRC, 21/06/2010, p.195-196Publication Thermal stability enhancement of GaN-based devices: towards highly reliable MOSHEMT
Proceedings paper2008, International Workshop on Nitride Semiconductors - IWN, 6/10/2008Publication Towards High Performance E-Mode InAIN/GaN HEMTs
;Medjdoub, Farid ;Alomari, A. ;Carlin, J.-F. ;Gonschorek, M. ;Feltin, E. ;Py, M.A.Gaquiere, C.Meeting abstract2008, 32nd Workshop on Compound Semiconductor Devices and Integrated Circuits - WOCSDICE, 18/05/2008