Browsing by Author "Mouraille, Orion"
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Publication 22nm node imaging and beyond: When will EUV take over?
Proceedings paper2010, International Symposium on Extreme Ultraviolet Lithography, 18/10/2010Publication Direct correlation between mask registration and on-wafer measurements for individual logic device features
Proceedings paper2022, Photomask Technology Conference, SEP 26-29, 2022, p.Art. 122930LPublication Etch tool pressure optimization enabling wafer edge overlay control.
Oral presentation2020, ASML Technology Conference 2020Publication Experimental verification of source-mask optimization and freeform illumination for 22 nm node SRAM cells
Journal article2011-03, Journal of Micro/Nanolithography MEMS and MOEMS, (10) 1, p.13008Publication Intra-field etch induced overlay penalties
Proceedings paper2020, Advanced Etch Technology for Nanopatterning IX, 23/02/2020, p.1132910Publication Intra-field mask-to-mask overlay, separating the mask writing from the dynamic pellicle contribution
Proceedings paper2018, Photomask Japan 2018: XXV Symposium on Photomask and Next-Generation Lithography Mask Technology, 18/04/2018, p.108070KPublication Mitigation of the etch-induced intra-field overlay contribution
Publication Off-line mask-to-mask registration characterization
Meeting abstract2017, Photomask Photomask Technology and EUV Lithography, 11/09/2017, p.1045111-1-1045111-16Publication On product overlay characterization after stressed layer etch
Proceedings paper2021, Advanced Etch Technology and Process Integration for Nanopatterning X, 21/02/2021, p.116150NPublication The impact of the reticle and wafer alignment mark placement accuracy on the intra-field mask-to-mask overlay
; ; Publication The impact of the reticle and wafer alignment mark placement accuracy on the intra-field mask-to-mask overlay
; ; Publication The mask contribution as part of the intra-field on-product overlay performance
Proceedings paper2020, Photomask Technology Conference, SEP 21-25, 2020Publication The mask contribution as part of the intra-field on-product overlay performance
; ; Publication Wafer alignment mark placement accuracy impact on the layer to layer overlay performance
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