Browsing by Author "Myers, James"
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Publication 3D Partitioning with Pipeline Optimization for Low-Latency Memory Access in Many-Core SoCs
Proceedings paper2024, IEEE International Symposium on Circuits and Systems (ISCAS), MAY 19-22, 2024Publication A Holistic Evaluation of Buried Power Rails and Back-Side Power for Sub-5 nm Technology Nodes
Journal article2022-07-07, IEEE TRANSACTIONS ON ELECTRON DEVICES, (69) 8, p.4453-4459Publication Accelerating large language model training with in-package optical links for scale-out systems
; ; ; ; ; Proceedings paper2024, IEEE-Computer-Society Annual Symposium on VLSI (ISVLSI), JUL 01-03, 2024, p.118-123Publication Bandwidth-Latency-Thermal Co-Optimization of Interconnect-Dominated Many-Core 3D-IC
Journal article2025, IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, (33) 2, p.346-357Publication Cryo-Computing for Infrastructure Applications: A Technology-to-Microarchitecture Co-optimization Study
Proceedings paper2022, International Electron Devices Meeting (IEDM), DEC 03-07, 2022Publication Managing Crosstalk in multi-GHz Front Side Clock for Back Side Power enabled Sub-2nm 2D/3D ICs
Proceedings paper2024, IEEE International Conference on IC Design and Technology (ICICDT), SEP 25-27, 2024Publication Multidie 3-D Stacking of Memory Dominated Neuromorphic Architectures
Journal article2024, IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, (32) 11, p.2144-2148Publication N2 Nanosheet Pathfinding-PDK (P-PDKTM) Including Back-Side PDN
Proceedings paper2024, 50th IEEE European Solid-State Electronics Research Conference (ESSERC), SEP 09-12, 2024, p.17-20Publication STCO: driving the More than Moore era
Proceedings paper2024, IEEE-Computer-Society Annual Symposium on VLSI (ISVLSI), JUL 01-03, 2024, p.7-8Publication System-Technology Co-Optimization for Dense Edge Architectures Using 3-D Integration and Nonvolatile Memory
Journal article2024, IEEE JOURNAL ON EXPLORATORY SOLID-STATE COMPUTATIONAL DEVICES AND CIRCUITS, 10, p.125-134Publication Thermal Analysis of High-Performance Server SoCs from FinFET to Nanosheet Technologies
Proceedings paper2024, International Reliability Physics Symposium (IRPS), APR 14-18, 2024Publication Thermal Implications in Scaling High-Performance Server 3D Chiplet-based 2.5D SoC from FinFET to Nanosheet
Proceedings paper2024, IEEE-Computer-Society Annual Symposium on VLSI (ISVLSI), JUL 01-03, 2024, p.45-50Publication Thermal Insights into 3D Packaging of a HighPerformance Server SoC in Advanced Nanosheet Technology
Proceedings paper2024, 50th IEEE European Solid-State Electronics Research Conference (ESSERC), SEP 09-12, 2024, p.337-340Publication Toward Fine-Grained Partitioning of Low-Level SRAM Caches for Emerging 3D-IC Designs
Journal article2024, IEEE JOURNAL ON EXPLORATORY SOLID-STATE COMPUTATIONAL DEVICES AND CIRCUITS, 10, p.67-74Publication Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs)
Proceedings paper2023, 61st IEEE International Reliability Physics Symposium (IRPS), MAR 26-30, 2023Publication Ultra-Scaled E-Tree-Based SRAM Design and Optimization With Interconnect Focus
Journal article2024, IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, (71) 10, p.4597-4610