Browsing by Author "Nagar, Magi"
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Publication Copper plating on resistive substrates, diffusion barrier and alternative seed layers
Proceedings paper2010, Semiconductors, Metal Oxides, and Composites: Metallization and Electrodeposition of Thin Films and Nanostructures, 4/10/2009, p.175-184Publication Copper plating on resistive substrates, diffusion barrier and alternative seed layers
Meeting abstract2009, 216th ECS Meeting, 4/10/2009, p.2178Publication Direct copper electrochemical deposition on Ru-based substrates for advanced interconnects target 30 nm and ½ pitch lines: from coupon to full-wafer experiments
Proceedings paper2011-05, Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications, 1/05/2011, p.117-123Publication Direct copper electrochemical deposition on Ru-based substrates for advanced interconnects target 30 nm and ½ pitch lines: from coupon to full-wafer experiments
Journal article2013, Journal of the Electrochemical Society, (160) 3, p.D1-D6Publication Direct copper plating on a RuTa substrate
Meeting abstract2010, 217th ECS Meeting Symposium "Electrochemical Engineering for the 21st Century", 24/04/2010, p.1259Publication Elucidating advanced inhibitor material in Copper CMP: K-sorbate as an inhibitor in Copper CMP slurry
Publication Exploration of process window for fill of sub 30 nm features by direct plating
Meeting abstract2012, 222nd Meeting of the The Electrochemical Society: Symposium E8: Processing Materials of 3D Interconnects, 7/10/2012, p.2733Publication From high-density nanoparticle deposits to nanometer thin continuous by growth inhibited nucleation enhancement
Meeting abstract2014, 226th Meeting of the Electrochemical Society, 5/10/2014, p.912Publication Galvanic corrosion issues related to copper/barrier CMP via inline electrochemical measurements
Proceedings paper2010, 15th International Symposium on Chemical-Mechanical Planarization - CMP, 8/08/2010Publication K-sorbate as a passivator in copper chemical mechanical planarization (CMP) slurries
Publication Multi-scale modeling of direct copper plating on resistive non-copper substrates
Journal article2012, Electrochimica Acta, 78, p.524-531Publication Multi-scale modeling of direct copper plating on resistive non-copper substrates
Meeting abstract2012-10, ECS Fall Meeting Symposium E8: Processing Materials of 3D Interconnects, 7/10/2012, p.2738Publication Nucleation and growth of copper on Ru-based substrates: I. the effect of the inorganic components
Meeting abstract2011, 220th ECS Fall Meeting Symposium F4: Semiconductors, Metal Oxides, and Composites, 9/10/2011, p.2329Publication Nucleation and growth of copper on Ru-Based Substrates: I. The effect of the inorganic components
Proceedings paper2012, Processing Materials of 3D Interconnects, Damascene and Electronics Packaging, 9/10/2011, p.75-82Publication Nucleation and growth of copper on Ru-based substrates: II. The effect of the suppressor additive
Proceedings paper2012, Processing Materials of 3D Interconnects, Damascene and Electronics Packaging, 9/10/2011, p.99-110Publication Nucleation and growth of copper on Ru-based substrates: II. the effect of the suppressor additive
Meeting abstract2011, 220th ECS Fall Meeting Symposium F4: Semiconductors, Metal Oxides, and Composites, 9/10/2011, p.2331Publication Polyether suppressors for filling sub 30 nm features by direct plating
Proceedings paper2012, Electrochemistry 2012, 17/09/2012Publication Potassium sorbate as an inhibitor in copper chemical mechanical planarization slurries. Part II: Effects of sorbate on chemical mechanical planarization performance
Publication Potassium sorbate as an inhibitor in copper chemical mechanical planarization. Part I. Elucidating slurry chemistry
Publication Seed-less copper electrochemical deposition on barrier materials as a replacement/enhancement for PVD Cu seed layers in HAR TSVs
Meeting abstract2010, 217th ECS Meeting Symposium 'Electrochemical Engineering for the 21st Century ', 24/04/2010, p.1280