Browsing by Author "Rakowski, Michal"
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Publication 25Gb/s Silicon-Photonics WDM Platform for Low-Power Optical I/O
Meeting abstract2013, 3rd International Symposium on Photonics and Electronics Convergence - Advanced Nanophotonics and Silicon Device Systems- ISPEC, 18/11/2013Publication 3D stacked IC demonstration using a through silicon via first approach
Proceedings paper2008, Technical Digest International Electron Devices Meeting - IEDM, 15/12/2008, p.603-606Publication 3D stacked IC demonstrator using hybrid collective die-to-wafer bonding with copper through silicon vias (TSV)
; ; ; ; Proceedings paper2009, IEEE 3D-IC, 28/09/2009Publication 3D stacked ICs using Cu TSVs and die to wafer hybrid collective bonding
Proceedings paper2009, IEEE International Electron Devices Meeting - IEDM, 7/12/2009, p.357-360Publication 50Gb/s silicon photonics platform for short-reach optical interconnects
Proceedings paper2016, Optical Fiber Communication Conference - OFC, 20/03/2016, p.Th4HPublication A 4×20Gb/s WDM ring-based hybrid CMOS silicon photonics transceiver
Proceedings paper2015, IEEE International Solid-State Circuits Conference - ISSCC, 22/02/2015, p.408-409Publication A low-voltage biasing scheme for aggressively scaled bulk FinFET 1T-DRAM featuring 10s retention at 85°C
Proceedings paper2010, IEEE Symposium on VLSI Technology, 15/06/2010, p.161-162Publication Advances in silicon photonics WDM devices
Proceedings paper2014, Next-Generation Optical Networks for Data Centers and Short-Reach Links, 1/02/2014, p.90100JPublication Analysis of sense margin and reliability of 1T-DRAM fabricated on thin-film UTBOX substrates
Proceedings paper2009, IEEE International SOI Conference, 5/10/2009Publication Beam shaping for ultra-compact waveguide crossings on monolithic silicon photonics platform
Journal article2020, OPTICS LETTERS, (45) 22, p.6230-6233Publication Benchmarking SOI and bulk FinFET alternatives for PLANAR CMOS scaling succession
Journal article2010, Solid-State Electronics, (54) 9, p.855-860Publication Beyond silicon CMOS photonics: a technology for future short distance system interconnects
Oral presentation2015, 20th Annual Symposium of the IEEE Photonics Benelux ChapterPublication CMOS compatible anodization process for low cost high density capacitors
Proceedings paper2010, Processing, Materials, and Integration of Damascene and 3D Interconnects, 10/10/2010, p.107-115Publication CMOS compatible anodization process for low cost high density capacitors
Meeting abstract2010, 218th ECS Meeting Symposium 'Processing, Materials, and Integration of Damascene and 3D Interconnects', 10/10/2010, p.1682Publication CMOS compatible polycrystalline silicon-germanium based pressure sensors
Journal article2012, Sensors and Actuators A: Physical, 188, p.9-18Publication CMOS-integrated poly-SiGe piezoresistive pressure sensor
Journal article2012, IEEE Electron Device Letters, (33) 8, p.1204-1206Publication Compact MMI-Based AWGs in a Scalable Monolithic Silicon Photonics Platform
Publication Comparison of silicon ring modulators with interdigitated and lateral PN junctions
; ; ; ; Journal article2013, IEEE Journal of Selected Topics in Quantum Electronics, (19) 2, p.7900308Publication Comparison of scaled floating body RAM architectures
Proceedings paper2008, IEEE International SOI Conference Proceedings, 6/10/2008, p.35-36
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