Browsing by Author "Sutcliffe, Victor"

Atomic layer deposited barriers for copper interconnects

Atomic layer deposition of barriers for interconnect

Comprehensive electromigration studies of dual-damascene Cu interconnects with ALD WCxNy barriers

Corrosion and inhibition of WNxCy barrier during chemical mechanical planarization

Impact of the barrier/dielectric interface quality on reliability of Cu porous-low-k interconnects

Initial growth mechanism of atomic layer deposited TiN

Integration of ALD WCN into a dual damascene oxide module

Interface characterization of nanoscale laminate structures on dense dielectric substrates by X-ray reflectivity

Interface characterization of nanoscale laminate structures on dense dielectric substrates by x-ray reflectivity

Opportunities and challenges for integration of ALD barrier layers in damascene process flows

Processing damage and electrical performance of porous dielectrics in narrow spaced interconnects

Sidewall damage and electrical performance of porous dielectrics in narrow spaced interconnects