Browsing by Author "Wang, Cong"
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Publication Advanced PECVD SiCOH low-k films with low dielectric constant and/or high Young's modulus
Journal article2014, Microelectronic Engineering, 120, p.225-229Publication Advanced PECVD SiCOH low-k films with low dielectric constant and/or high Young�s modulus
Meeting abstract2013, Materials for Advanced Metallization - MAM, 12/03/2013, p.259-260Publication Development and evaluation of a-SiC:H films using a dimethylsilacyclopentane precursor as a low -k Cu capping layer in advanced interconnects
Proceedings paper2013, IEEE International Interconnect Technology Conference - IITC, 13/06/2013, p.105-107Publication Evaluation of barrier integrity on ultra low-k films with different porosities
Meeting abstract2013, MRS Spring Meeting Sympiosium AA: Advanced Interconnects for Micro- and Nanoelectronics-Materials, Processes, and Reliability, 1/04/2012, p.AA6.05Publication Study of porogen removal by atomic hydrogen generated by hot wire chemical vapor deposition for the fabrication of advanced low-k thin films
Journal article2015, Thin Solid Films, 575, p.103-106Publication Study of porogen removal by HWCVD for the fabrication of advanced low-k films
Meeting abstract2012, 7th International Conference on Hot- Wire Chemical Vapor deposition - Cat-CVD, 8/10/2012, p.T5-7-T5-7