Browsing by author "Leunissen, Peter"
Now showing items 1-20 of 112
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A functional 41-stage ring oscillator using scaled FinFET devices with 25nm gate lengths and 10nm Fin widths applicable for the 45nm CMOS node
Collaert, Nadine; Dixit, Abhisek; Goodwin, Michael; Kottantharayil, Anil; Rooyackers, Rita; Degroote, Bart; Leunissen, Peter; Veloso, Anabela; Jonckheere, Rik; De Meyer, Kristin; Jurczak, Gosia; Biesemans, Serge (2004-08) -
All wet photoresist strip by solvent aerosol spray
Wada, Masayuki; Sano, Ken-Ichi; Snow, Jim; Vos, Rita; Leunissen, Peter; Mertens, Paul; Eitoku, A (2008) -
An overview of some recent CMP projects at imec
Teugels, Lieve; Heylen, Nancy; Leunissen, Peter (2011) -
Bath stability monitoring for electroless Cu seed formation in high aspect ratio TSV
Inoue, Fumihiro; Philipsen, Harold; Armini, Silvia; Radisic, Alex; Civale, Yann; Leunissen, Peter; Shingubara, Shose (2012) -
Challenges with respect to high-k/metal gate stack etching and cleaning
Vos, Rita; Arnauts, Sophia; Bovie, Inge; Onsia, Bart; Garaud, Sylvain; Xu, Kaidong; Yu, HongYu; Kubicek, Stefan; Rohr, Erika; Schram, Tom; Veloso, Anabela; Conard, Thierry; Leunissen, Peter; Mertens, Paul (2007) -
Chemical mechanical planarization of patterned InP in shallow trench isolation (STI) template structures using hydrogen peroxide-based silica slurries containing oxalic acid or citric acid
Matovu, John B.; Ong, Patrick; Teugels, Lieve; Leunissen, Peter; Babu, S. V. (2014) -
Chemical mechanical polishing of Ge using colloidal silica particles and H2O2
Ong, Patrick; Peddeti, Shivaji; Leunissen, Peter; Babu, S. V. (2011) -
Chemical mechanical polishing of InP
Ong, Patrick; Peddeti, Shivaji; Leunissen, Peter; Babu, S.V. (2012) -
Chemical mechanical polishing of nickel for damascene applications
Teugels, Lieve; Van den Eynde, Matthias; Delande, Tinne; Leunissen, Peter (2012) -
Cleaning requirement in the thinning module for 3D-Stacked IC (3D-SIC) integration
Wostyn, Kurt; Zhao, Ming; Cui, Hushan; Laermans, Patrick; Jourdain, Anne; Verbinnen, Greet; Struyf, Herbert; De Strycker, Steven; Claes, Martine; Travaly, Youssef; Leunissen, Peter (2010) -
CMP of Ge and InP for microelectronic applications
Ong, Patrick; Peddeti, Shivaji; Leunissen, Peter; Babu, S.V. (2011) -
CMP of Ge for high mobility channels
Ong, Patrick; Witters, Liesbeth; Leunissen, Peter (2010) -
CMP of novel materials
Ong, Patrick; Kellens, Kristof; Chiodarelli, Nicolo; Meuris, Marc; Leunissen, Peter (2009) -
CMP of novel materials for frontend-of-line and backend-of-line applications
Leunissen, Peter; Ong, Patrick; Teugels, Lieve (2011) -
CMP on SiGe materials - linking chemical and physical properties to design low defect selective slurries
Ong, Patrick; Siebert, Max; Huang, Kevin; Teugels, Lieve; Ansar, Sheik; Leunissen, Peter (2014) -
CMP processing to enable 3D stacked IC integration
Vaes, Jan; Heylen, Nancy; Van Olmen, Jan; Huyghebaert, Cedric; Leunissen, Peter (2009) -
Co-silicide, Co(Ni)-silicide and Ni-silicide to source/drain contact resistance
Akheyar, Amal; Lauwers, Anne; Kittl, Jorge; de Potter de ten Broeck, Muriel; Chamirian, Oxana; Jonckheere, Rik; Leunissen, Peter; Van Dal, Mark; Lindsay, Richard; Tempel, Georg; Maex, Karen (2003) -
Cu/Low-k thickness measurement for advanced Cu CMP process development and control
Li, Yunlong; Heylen, Nancy; Delande, Tinne; Kellens, Kristof; Ong, Patrick; Leunissen, Peter; Tarnowka, Alexandre; Eliyahu, Aviv (2009-03) -
Current status of 193 nm immersion lithography and outlook to the future
Ronse, Kurt; Cheng, Shaunee; Ercken, Monique; Leunissen, Peter; Maenhoudt, Mireille; Vandenberghe, Geert; Van den hove, Luc (2005) -
Damage clustering and damage-size distributions after megasonic cleaning
De Marco, Cinzia; Wostyn, Kurt; Bearda, Twan; Sano, Ken-Ichi; Kenis, Karine; Janssens, Tom; Leunissen, Peter; Eitoku, Atsuro; Mertens, Paul (2007)