Browsing by author "Klipp, Andreas"
Now showing items 1-7 of 7
-
All-wet removal of post-etch photoresist and sidewall residues: Electrical characterization of 90 nm and 30 nm ½ pitch structures
Le, Quoc Toan; Demuynck, Steven; Suhard, Samuel; Klipp, Andreas; Vereecke, Bart; Vereecke, Guy (2010) -
Challenges in BEOL cleaning for the 10 nm node and beyond
Yu, David; Le, Quoc Toan; Braun, Simon; Kesters, Els; Shen, Mary; Klipp, Andreas; Holsteyns, Frank (2014) -
Implanted photoresist remover for advanced nodes including SiGe, Ge and high k-metals
Braun, S.; Vos, Rita; Klipp, Andreas; Claes, Martine; Bittner, Christian; Albert, Johan; Horiguchi, Naoto; Struyf, Herbert (2013) -
New cleaning solutions for all-wet-post etch residue removal on Cu BEOL for sub 45nm nodes
Klipp, Andreas; Vereecke, Guy; Le, Quoc Toan; Claes, Martine (2009) -
Removal of photoresist and BARC in Cu BEOL using an all-wet process
Le, Quoc Toan; Klipp, Andreas; Lux, Marcel; Li, Yunlong; Zhao, Larry; Vereecke, Guy (2009) -
Wet clean in BEOL interconnect: Post etch residue removal and material compatibility
Kesters, Els; Le, Quoc Toan; Yu, David; Shen, Mary; Braun, Simon; Klipp, Andreas; Holsteyns, Frank (2014) -
Wet-chemical cleaning of cobalt and molybdenum for advanced interconnects
Le, Quoc Toan; Kesters, Els; Usman Ibrahim, Ansar; Klipp, Andreas; Pacco, Antoine; van der Veen, Marleen; Altamirano Sanchez, Efrain; Holsteyns, Frank (2020)