Browsing by author "Cross, Andrew"
Now showing items 1-14 of 14
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Capture probability of assembly defects in 14 nm half-pitch line/space DSA patterns
Pathangi Sriraman, Hari; Chan, BT; Van Look, Lieve; Vandenbroeck, Nadia; Van Den Heuvel, Dieter; Cross, Andrew; Hong, Sung Eun; Nafus, Kathleen; D'Urzo, Lucia; Gronheid, Roel (2015) -
Connected component analysis of review-SEM images for sub-10nm node process verification
Halder, Sandip; Leray, Philippe; Sah, Kaushik; Cross, Andrew; Parisi, Paolo (2017) -
Defect characterization of EUV Self-Aligned Litho-Etch Litho-Etch (SALELE) patterning scheme for advanced nodes
Sah, Kaushik; Cross, Andrew; Das, Sayantan; Blanco, Victor; Kljucar, Luka; Halder, Sandip; Leray, Philippe (2021) -
Defect source analysis of directed self-assembly process
Rincon Delgadillo, Paulina; Suri, Mayur; Durant, Stephane; Cross, Andrew; Nagaswami, Venkat; Van Den Heuvel, Dieter; Gronheid, Roel; Nealey, Paul (2013) -
Defect source analysis of directed self-assembly process (DSA of DSA)
Rincon Delgadillo, Paulina; Harukawa, Ryota; Suri, Mayur; Durant, Stephane; Cross, Andrew; Nagaswami, Venkat; Van Den Heuvel, Dieter; Gronheid, Roel; Nealey, Paul (2013) -
DSA materials contributions to the defectivity performance of the 14nm half-pitch LiNe flow @ imec
Pathangi Sriraman, Hari; Vaid, Varun; Chan, BT; Vandenbroeck, Nadia; Li, Jin; Hong, Sung Eun; Cao, Yi; Durairaj, Baskaran; Lin, Guanyang; Somervell, Mark; Kitano, Takahiro; Harukawa, Ryota; Sah, Kaushik; Cross, Andrew; Bayana, Hareen; D'Urzo, Lucia; Gronheid, Roel (2016) -
EUV stochastic defect monitoring with advanced broadband optical wafer inspection and e-beam review systems
Sah, Kaushik; Cross, Andrew; Plihal, Martin; Anantha, Vidyasagar; Babulnath, Raghav; Fung, Derek; De Bisschop, Peter; Halder, Sandip (2018) -
Extreme thinning of Si wafers for via-last and multi wafer stacking applications
Jourdain, Anne; De Vos, Joeri; Rassoul, Nouredine; Zahedmanesh, Houman; Miller, Andy; Beyer, Gerald; Beyne, Eric; Walsby, Edward; Patel, Jash; Ansell, Oliver; Ashraf, Huma; Thomas, Dave; Li, Shifang; Chang, Timothy; Hiebert, Stephen; Cross, Andrew; Stoerring, Moritz (2018) -
In-line metrology for characterization and control of extreme wafer thinning of bonded wafers
Liebens, Maarten; Jourdain, Anne; De Vos, Joeri; Vandeweyer, Tom; Miller, Andy; Beyne, Eric; Li, Shifang; Bast, G.; Stoerring, Moritz; Hiebert, S.; Cross, Andrew (2017) -
In-line metrology for characterization and control of extreme wafer thinning of bonded wafers
Liebens, Maarten; Jourdain, Anne; De Vos, Joeri; Vandeweyer, Tom; Miller, Andy; Beyne, Eric; Li, Shifang; Bast, Gerard; Stoerring, Moritz; Hiebert, Stephen; Cross, Andrew (2019) -
Investigation of the performance of state-of-the-art defect inspection tools within EUV lithography
Van Den Heuvel, Dieter; Jonckheere, Rik; Cheng, Shaunee; Marcuccilli, Gino; Cross, Andrew; Inderhees, Greg; Parisi, Paolo (2012) -
Process window discovery methodology development for advanced lithography
Van Den Heuvel, Dieter; Foubert, Philippe; Baudemprez, Bart; Lee, Angelica; Cross, Andrew; Sao, Kaushik; Haque, Naoshin; Parisi, Paolo; Baris, Oksin (2016) -
Process window discovery, expansion and control of design hotspots susceptible to overlay failures
Sah, Kaushik; Cross, Andrew; Mani, Antonio; Van Den Heuvel, Dieter; Foubert, Philippe (2017) -
stochastic defect monitoring with advanced broadband optical wafer inspection and e-Beam review systems
Sah, Kaushik; Cross, Andrew; Plihal, Martin; Anantha, Vidyasugar; Fung, Derek; De Bisschop, Peter; Halder, Sandip (2018)