Browsing by author "Winters, Christophe"
Now showing items 1-16 of 16
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3D SoP integration of a BAN sensor node
Brebels, Steven; Sanders, Steven; Winters, Christophe; Webers, Tomas; Vaesen, Kristof; Carchon, Geert; Gyselinckx, Bert; De Raedt, Walter (2005-06) -
An analysis of the reliability of a wafer level package (WLP) using a silicon under the bump (SUB) configuration
Gonzalez, Mario; Vandevelde, Bart; Vanden Bulcke, Mathieu; Winters, Christophe; Beyne, Eric; Lee, Y.J.; Harkness, B.R.; Mohamed, M.; Meynen, H.; Vanlathem, E. (2003) -
Double and triple stacked solder joint technology for further miniaturization of 3D-SIP
Stoukatch, Serguei; Winters, Christophe; Torfs, Tom; De Raedt, Walter; Beyne, Eric; Van Hoof, Chris (2007) -
Electromigration failure mechanisms for different flip chip configurations
Labie, Riet; Webers, Tomas; Winters, Christophe; Cherman, Vladimir; Croes, Kristof; Vandevelde, Bart; Dosseul, Franck (2011) -
Electromigration, fuse and thermo-mechanical performance of solder bump versus Cu pillar flip chip assemblies
Vandevelde, Bart; Labie, Riet; Cherman, Vladimir; Webers, Tomas; Winters, Christophe; Beyne, Eric; Dosseul, Franck (2011) -
Enabling technologies for antenna integration on microwave SiPs
De Raedt, Walter; Brebels, Steven; Beyne, Eric; Carchon, Geert; Stoukatch, Serguei; Vaesen, Kristof; Winters, Christophe (2004) -
FCOB: packaging issues for RF-MEMS applications and reliability study
Stoukatch, Serguei; Webers, Tomas; Winters, Christophe; Ratchev, Petar; De Wolf, Ingrid; Baert, Kris; Beyne, Eric; Oya, Yoichi; Okubora, Akihiko (2005) -
Introducing a silicone under the bump configuration for stress relief in a wafer level package
Vanden Bulcke, Mathieu; Gonzalez, Mario; Vandevelde, Bart; Winters, Christophe; Beyne, Eric; Larson, L.; Harkness, B.R.; Gardner, G.; Mohamed, M.; Sudbury-Holtschlag, J.; Meynen, H. (2003) -
Optimization of a silicone under the bump (SUB) structure for wafer level packaging
Gonzalez, Mario; Vandevelde, Bart; Vanden Bulcke, Mathieu; Winters, Christophe; Beyne, Eric; Lee, Y.J.; Larson, L.; Harkness, B.R.; Mohamed, M.; Meynen, H. (2003) -
Outperformance of Cu pillar flip chip bumps in electromigration testing
Labie, Riet; Dosseul, Franck; Webers, Tomas; Winters, Christophe; Cherman, Vladimir; Beyne, Eric; Vandevelde, Bart (2011) -
Patternable silicones for next generation packaging reliability requirements
Kunselman, Michael; Larson, Lyndon; Harkness, Brian; Gardner, Geoff; Alger, James; Cummings, Michelle; Meynen, Herman; Gonzalez, Mario; Vandevelde, Bart; Vanden Bulcke, Mathieu; Winters, Christophe; Beyne, Eric (2004) -
Photopatternable silicone compositions for electronics packaging applications
Harkness, Brian R.; Gardner, Geoff B.; Alger, James S.; Cummings, Michelle R.; Princing, Jennifer; Lee, Yeong; Meynen, Herman; Gonzalez, Mario; Vandevelde, Bart; Vanden Bulcke, Mathieu; Winters, Christophe; Beyne, Eric (2004) -
Study of the integration of a new elastomeric material in a silicone under the bump configuration
Vanden Bulcke, Mathieu; Gonzalez, Mario; Winters, Christophe; Beyne, Eric; Meynen, Herman; Gardner, Geoff; Harkness, Brian (2004) -
Thermo-compression flip chip bonding using gold ball bumps for RF and MEMS application
Stoukatch, Serguei; Webers, Tomas; Winters, Christophe; Baert, Kris; Beyne, Eric (2004) -
Ultra low stress and low temperature patternable silicone materials for applications within microelectronics
Meynen, Herman; Vanden Bulcke, Mathieu; Gonzalez, Mario; Harkness, Brian; Gardner, Geoff; Sudbury-Holtschlag, Joan; Vandevelde, Bart; Winters, Christophe; Beyne, Eric (2004) -
Wireless network of autonomous environmental sensors
Torfs, Tom; Sanders, Steven; Winters, Christophe; Brebels, Steven; Van Hoof, Chris (2004-10)