Browsing by author "Visker, Jakob"
Now showing items 1-13 of 13
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Bonding yield analysis of enclosed structures
Visker, Jakob; Fiorentino, Giuseppe; Peng, Lan (2018) -
DEMONSTRATING ELECTRICAL CONNECTION ON RECONSTITUTED ASIC CHIPS ON 8-INCH SILICON WAFER
Wei, Wei; Zhang, Lei; Tobback, Bert; Visker, Jakob; Stakenborg, Tim; Karve, Gauri; Sabuncuoglu Tezcan, Deniz (2024) -
Edge trimming for surface activated dielectric bonded wafers
Inoue, Fumihiro; Jourdain, Anne; Visker, Jakob; Peng, Lan; Moeller, Berthold; Yokoyama, Yokoyama; Phommahaxay, Alain; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric; Sleeckx, Erik (2017) -
Edge trimming for wafer-to-wafer 3D integration
Inoue, Fumihiro; Visker, Jakob; Jourdain, Anne; Moeller, Berthold; Yokoyama, Kaori; Peng, Lan; Kosemura, Daisuke; De Wolf, Ingrid; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric; Sleeckx, Erik (2016) -
Enabling backside processing for perforated microfluidic devices
Visker, Jakob; Han, Yang; Visker, Evert; Dang Thi Thuy, Chi; Gocyla, Mateusz; Humbert, Aurelie; Ackaert, Jan; Peng, Lan; Vanhaelemeersch, Serge (2023) -
Enabling pre-sssembly process of 3D wafers with high topography at the backside
Podpod, Arnita; Demeurisse, Caroline; Inoue, Fumihiro; Duval, Fabrice; Visker, Jakob; De Vos, Joeri; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2015) -
Influence of composition of SiCN for surface activated bonding
Inoue, Fumihiro; Peng, Lan; Iacovo, Serena; Phommahaxay, Alain; Visker, Jakob; Verdonck, Patrick; Meersschaut, Johan; Dara, Praveen; Sleeckx, Erik; Miller, Andy; Beyne, Eric (2018) -
Influence of contact area on oxide-oxide fusion bonding quality between 200mm quartz and silicon wafers
Buja, Federico; Humbert, Aurelie; Visker, Jakob; Peng, Lan (2017) -
Investigation on Low-temperature Temporary Bonding for Microfluidic Devices in Lifescience Applications
Han, Yang; Dang Thi Thuy, Chi; Visker, Evert; Visker, Jakob; Humbert, Aurelie; Peng, Lan (2021) -
Layer configurations for Al-Ge eutectic wafer bonding
Visker, Jakob; Kang, Shuo; Peng, Lan; Vereecke, Bart; Haspeslagh, Luc (2020) -
On the fabrication of backside illuminated image sensors: bonding oxide, edge trimming and CMP rework routes
Cavaco, Celso; Peng, Lan; Sebaai, Farid; Verbinnen, Greet; Visker, Jakob; Van Olmen, Jan; Sabuncuoglu Tezcan, Deniz; Osman, Haris (2015) -
Tape-assisted fusion bonding for wafers with through Si holes
Stassen, Andim; Visker, Jakob; Andrei, Alexandru; Fondu, Jelle (2017) -
Wafer reconstitution: embedded multi-die III-V and silicon co-integration platform
Karve, Gauri; Li, Yunlong; Motsnyi, Vasyl; Wei, Wei; Visker, Jakob; Chancerel, Francois; Ackaert, Jan; Puybaret, Renaud; Dutta, Barundeb; Sabuncuoglu Tezcan, Deniz; Peng, Lan; Soussan, Philippe; Severi, Simone; Osman, Haris (2024)