Browsing by author "Iker, Francois"
Now showing items 1-18 of 18
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3D Embedding and interconnection of ultra thin (<20um) silicon dies
Iker, Francois; Sabuncuoglu Tezcan, Deniz; Cotrin Teixeira, Ricardo; Soussan, Philippe; De Moor, Piet; Beyne, Eric; Baert, Kris (2007) -
3D Wafer level packaging: processes and materials for through silicon-vias and thin die embedding
Soussan, Philippe; Sabuncuoglu Tezcan, Deniz; Iker, Francois; Ruythooren, Wouter; Swinnen, Bart; Majeed, Bivragh; Beyne, Eric (2009) -
A descum review for cleaning surfaces in polymer embedded process flows
Jamieson, Geraldine; Iker, Francois; Takeshi, Kita; Duval, Fabrice; Pham, Nga; Gerets, Carine; Boullart, Werner; Funaya, T. (2010) -
Alternative patterning techniques enabling fine pitch interconnection on topography surfaces
Iker, Francois; Funaya, Takuo; Jamieson, Geraldine; Beyne, Eric (2010) -
Chip ultra-thinning and embedding technology for autonomous sensors array applications
Muller, Philippe; Iker, Francois; Soussan, Philippe; Beyne, Eric; Carchon, Geert; De Raedt, Walter (2009) -
Design and implementation of flexible and stretchable systems
Gonzalez, Mario; Vandevelde, Bart; Christiaens, Wim; Hsu, Yung-Yu; Iker, Francois; Bossuyt, Frederick; van der Sluis, Olaf; Timmermans, P.H.M. (2011) -
Design and integration technology for miniature medical microsystems
Van Hoof, Chris; Pereira Neves, Hercules; Aarts, Arno; Iker, Francois; Soussan, Philippe; Gonzalez, Mario; Beyne, Eric; Vanfleteren, Jan; Puers, Bob; De Moor, Piet (2008) -
Diamond bit cutting as alternative to polymer patterning for 3D interconnections technologies
Iker, Francois; Funaya, Takuo; Cotrin Teixeira, Ricardo; Ruythooren, Wouter (2009) -
Diamond bit cutting for processing high topography wafers
Agarwal, Rahul; Pham, Nga; Cotrin Teixeira, Ricardo; Andrei, Alexandru; Ruythooren, Wouter; Iker, Francois; Soussan, Philippe (2009) -
High density 3D die stacking without through-Si-vias: ultra thin chip embedding as enabling technology
Beyne, Eric; Iker, Francois; Soussan, Philippe; Funaya, Takuo; Vanfleteren, Jan; Cotrin Teixeira, Ricardo; Torfs, Tom; Christiaens, Wim (2008) -
Medical electronic system miniaturization using ultra thin chip embedding and stacking technology
Beyne, Eric; Vanden Bulcke, Mathieu; Iker, Francois; Baert, Kris; Van Hoof, Chris (2007) -
One-mask CMOS compatible process for the fabrication of three-dimensional self-assembled thin-film SOI microelectromechanical systems
Iker, Francois; André, N.; Pardoen, T.; Raskin, J.P. (2005) -
Process technology for the fabrication of a chip-in-wire style packaging
Vanden Bulcke, Mathieu; Iker, Francois; De Preter, Inge; Muller, Philippe; Soussan, Philippe; Beyne, Eric; Van Hoof, Chris; Baert, Kris (2008-05) -
Silicone for flexible packaging of thin dies (<20 μm) using wafer level techniques
Iker, Francois; De Preter, Inge; Gonzalez, Mario; Soussan, Philippe (2008) -
Technology platform for 3-D stacking of thinned embedded dies
Iker, Francois; Soussan, Philippe; Beyne, Eric; Baert, Kris (2008) -
Thermo-mechanical analysis of flexible and stretchable systems
Gonzalez, Mario; Vandevelde, Bart; Christiaens, Wim; Hsu, Yung-Yu; Iker, Francois; Bossuyt, Frederick; Vanfleteren, Jan; van der Sluis, Olaf; Timmermans, Peter (2010) -
Ultra thin chip embedding technology (UTCS-UTCP)
Beyne, Eric; Christiaens, Wim; Torfs, Tom; Huwel, W.; Perdu, Wim; Vanfleteren, Jan; Iker, Francois; Funaya, Takuo; Buisson, Thibault; De Preter, Inge; Jamieson, Geraldine; Soussan, Philippe; Van Hoof, Chris (2010) -
Ultra thin die embedding technology with 20um-pitch interconnection
Funaya, Takuo; Buisson, Thibault; De Preter, Inge; Beyne, Eric; Iker, Francois (2010)