Browsing by author "Vandepitte, Dirk"
Now showing items 1-20 of 23
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An integrated creep, crack growth and thermo-mechanical fatigue model for WLCSP assemblies soldered with SAC 405
Limaye, Paresh; Vandevelde, Bart; Vandepitte, Dirk; Verlinden, Bert (2009) -
Analysis of microbump induced stress effects in 3D stacked IC technologies
Ivankovic, Andrej; Van der Plas, Geert; Moroz, V.; Choi, M.; Cherman, Vladimir; Mercha, Abdelkarim; Marchal, Pol; Gonzalez, Mario; Eneman, Geert; Zhang, Wenqi; Buisson, Thibault; Detalle, Mikael; La Manna, Antonio; Verkest, Diederik; Beyer, Gerald; Beyne, Eric; Vandevelde, Bart; De Wolf, Ingrid; Vandepitte, Dirk (2012) -
Analysis of the induced stresses in silicon during thermocompression Cu-Cu bonding of Cu-through-vias in 3D-SIC architecture
Okoro, Chukwudi; Eneman, Geert; Gonzalez, Mario; Vandevelde, Bart; Swinnen, Bart; Stoukatch, Serguei; Beyne, Eric; Vandepitte, Dirk (2007-05) -
Aqualis
Heylen, Filip; De Munter, Wim; Vandepitte, Dirk; Thijs, Steven; Mahato, Swaraj; Verschooten, Tom; Bentell, Jonas; Livens, Stefan; Benhadj, Iskander; Adriaensen, Stefan; Tavaras, Jonathan Leon; Stercks, Sindy; Nuyts, Dirk (2021) -
Assessment of the feasibility of 'multiple chips-to-wafer' thermo-compression bonding using FEM
Okoro, Chukwudi; Jourdain, Anne; Vandevelde, Bart; Swinnen, Bart; Vandepitte, Dirk (2008) -
Crack growth rate measurement and analysis for WLCSP Sn-Ag-Cu solder joints
Limaye, Paresh; Vandevelde, Bart; Verlinden, Bert; Vandepitte, Dirk (2005-09) -
Creep behavior of mixed SAC 405/ SnPb soldered assemblies in shear loading
Limaye, Paresh; Labie, Riet; Vandevelde, Bart; Vandepitte, Dirk; Verlinden, Bert (2007) -
Dealing with IC package material and design uncertainties using FUZZY finite elements
Vandevelde, Bart; Konstantinou, Ionnas; Moens, David; Vandepitte, Dirk (2013) -
Elimination of the axial deformation problem of Cu-TSV in 3D integration
Okoro, Chukwudi; Huyghebaert, Cedric; Van Olmen, Jan; Labie, Riet; Vandevelde, Bart; Beyne, Eric; Vandepitte, Dirk (2010) -
Extraction of the appropriate material property for realistic modeling of through-silicon-vias using μ-raman spectroscopy
Okoro, Chukwudi; Yang, Yu; Vandevelde, Bart; Swinnen, Bart; Vandepitte, Dirk; Verlinden, Bert; De Wolf, Ingrid (2008) -
FET arrays as CPI sensors for 3D stacking and packaging characterization
Ivankovic, Andrej; Cherman, Vladimir; Van der Plas, Geert; Vandevelde, Bart; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid; Vandepitte, Dirk (2012) -
Finite element modeling of aolder joint fatigue in four-point bending test
Sabuncuoglu, Baris; Vanhee, Filip; Willems, Geert; Vandevelde, Bart; Vandepitte, Dirk; De Wolf, Ingrid (2012) -
Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu
Okoro, Chukwudi; Labie, Riet; Vanstreels, Kris; Franquet, Alexis; Gonzalez, Mario; Vandevelde, Bart; Beyne, Eric; Vandepitte, Dirk; Verlinden, Bert (2011) -
Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV
Okoro, Chukwudi; Vanstreels, Kris; Labie, Riet; Luhn, Ole; Vandevelde, Bart; Verlinden, Bert; Vandepitte, Dirk (2010) -
Influence of intermetallic properties of lead-free flip chip solder joints
Limaye, Paresh; Vandevelde, Bart; Labie, Riet; Vandepitte, Dirk; Verlinden, Bert (2008) -
Insertion bonding: A novel Cu-Cu bonding approach for 3D integration
Okoro, Chukwudi; Agarwal, Rahul; Limaye, Paresh; Vandevelde, Bart; Vandepitte, Dirk; Beyne, Eric (2010) -
Investigation of the influence of UBM on lead free flip chip solder fatigue life by explicit finite element modeling of intermetallic layers
Limaye, Paresh; Vandevelde, Bart; Labie, Riet; Ratchev, Petar; Beyne, Eric; Vandepitte, Dirk; Verlinden, Bert (2005) -
Low-temperature enbrittlement of lead-free solders in joint level impact testing
Limaye, Paresh; Maurissen, Wout; Lambrinou, Konstantza; Duflos, Frederic; Vandevelde, Bart; Allaert, Bart; Hillaert, Joost; Vandepitte, Dirk; Verlinden, Bert (2007-12) -
Mixed numerical-experimental analysis of embedding strain sensors in structural adhesive joints
Debruyne, Stijn; Vandepitte, Dirk; Hallez, Hans (2017) -
Novel Cu-Cu bonding technique: the insertion bonding approach
Okoro, Chukwudi; Limaye, Paresh; Agarwal, Rahul; Vandevelde, Bart; Beyne, Eric; Vandepitte, Dirk (2011)