Browsing by author "Vandecasteele, Bjorn"
Now showing items 1-20 of 41
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3D Multifunctional composites based on large-area stretchable circuit with thermoforming technology
Yang, Yang; Vervust, Thomas; Dunphy, Sheila; Van Put, Steven; Vandecasteele, Bjorn; Dhaenens, Kristof; Degrendele, Lieven; Mader, Lothar; De Vriese, Linde; Martens, Tom; Kaufmann, Markus; Sekitiani, Tsyoshi; Vanfleteren, Jan (2018) -
A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels
Cauwe, Maarten; Vandecasteele, Bjorn; De Baets, Johan; van den Brand, Jeroen; Kusters, Roel; Sridhar, Ashok (2012) -
A Ka-band SiGe BiCMOS power amplifier with 24 dBm output power
Pierco, Ramses; Torfs, Guy; De Keulenaer, Timothy; Vandecasteele, Bjorn; Missinne, Jeroen; Bauwelinck, Johan (2015-03) -
Active and passive component embedding into low-cost plastic substrates aimed at smart system application
Cauwe, Maarten; Vandecasteele, Bjorn; De Baets, Johan; van den Brand, Jeroen; Kusters, Roel; Sridhar, Ashok (2013) -
Adhesive bonding by SU-8 transfer for assembling microfluidic devices
Salvo, Pietro; Verplancke, Rik; Bossuyt, Frederick; Latta, Daniel; Vandecasteele, Bjorn; Liu, Chengxun; Vanfleteren, Jan (2012) -
Advanced technologies in fabrication and interconnection of flexible displays and substrates
Bert, T.; Vanfleteren, Jan; Vandecasteele, Bjorn; Maeyaert, S; Doutreloigne, Jan; Govaerts, J; De Smet, Herbert; Van Calster, Andre (2005-06) -
An approach to produce a stack of photo definable polyimide based flat UTCPs
Priyabadini, Swarnakamal; Sterken, Tom; Wang, Liang; Dhaenens, Kristof; Vandecasteele, Bjorn; Van Put, Steven; Petersen, A.E.; Vanfleteren, Jan (2012) -
Arbitrarily shaped 2.5D circuits using stretchable interconnects embedded in thermoplastic polymers
Plovie, Bart; Yang, Yang; Guillaume, Joren; Dunphy, Sheila; Dhaenens, Kristof; Van Put, Steven; Vandecasteele, Bjorn; Vervust, Thomas; Bossuyt, Frederick; Vanfleteren, Jan (2017) -
Bismuth-based solder characterization for lower-temperature assembly of thermally-sensitive components in 3D interconnect applications
Vakanas, George; Vandecasteele, Bjorn; De Preter, Inge; Derakhshandeh, Jaber; Snyder, Brad; Van Campenhout, Joris; Croes, Kristof; Rebibis, Kenneth June; Beyne, Eric (2014) -
Co-Sn intermetallic compoundsfor potential integration in 3D interconnects
Vakanas, George; O, Minho; Dimcic, Biljana; Vandecasteele, Bjorn; Vanstreels, Kris; De Messemaeker, Joke; De Preter, Inge; Derakhshandeh, Jaber; Guerrieri, Stefano; Rebibis, Kenneth June; La Manna, Antonio; Kajihara, Masanori; De Wolf, Ingrid; Beyne, Eric (2014) -
Comparison of different flex materials in high density flip chip on flex applications
Palm, P.; Määttänen, J.; De Maquillé, Y.; Picault, A.; Vanfleteren, Jan; Vandecasteele, Bjorn (2003) -
Development of an active high-density transverse intrascicular micro-electrode probe
Verplancke, Rik; Cauwe, Maarten; Schaubroeck, David; Cuypers, Dieter; Vandecasteele, Bjorn; Mader, Lothar; Vanhaverbeke, Celine; Ballini, Marco; O'Callaghan, John; Goikoetxea, Erkuden; Braeken, Dries; Kundu, Aritra; Patrick, Erin; Maghari, Nima; Otto, Kevin; Bashirullah, Rizwan; Op de Beeck, Maaike (2020) -
Electroless nickel plating bath composition and replenishment for microvia plating process
Stoukatch, Serguei; Zhang, S.; Vanfleteren, Jan; Vereeken, Maria; Van Calster, Andre; Vandecasteele, Bjorn (2000) -
Embedding of thinned chips in plastic substrates
Vandecasteele, Bjorn; Govaerts, Jonathan; Vanfleteren, Jan (2007-02) -
FITEP: a flexible implantable thin electronic package platform for long tem implatation applications, based on polymer and ceramic ALD multilayers
Op de Beeck, Maaike; Verplancke, Rik; Schaubroeck, David; Li, Changzheng; Cuypers, Dieter; Cauwe, Maarten; Vandecasteele, Bjorn; Mader, Lothar; Vanhaverbeke, Celine; O'Callaghan, John; Braeken, Dries; Andrei, Alexandru; Firrincieli, Andrea; Ballini, Marco; Kundu, Aritra; Fahmy, Ahmed; Patrick, Erin; Maghari, Nima; Bashirullah, Rizwan; De Baets, Johan (2019) -
Flexible implantable ultrathin chip encapsulation (FITEP) to fabricate neural CMOS-based probes for intra-fascicular implantation
Op de Beeck, Maaike; Verplancke, Rik; Schaubroeck, David; Cuypers, Dieter; Cauwe, Maarten; Vandecasteele, Bjorn; O'Callaghan, John; Braeken, Dries; Ballini, Marco; Bashirullah, Rizwan; De Baets, Johan (2017) -
Flip chip based packaging solution for high current driver chips used in automotive applications
Vandevelde, Bart; Vandecasteele, Bjorn; Vanderstraeten, Daniel; Brizar, Guy; Blansaer, Eddy (2008) -
Formation, processing and characterization of Co-Sn intermetallic compounds for potential integration in 3D interconnects
Vakanas, George; O, Minho; Dimcic, Biljana; Vanstreels, Kris; Vandecasteele, Bjorn; De Preter, Inge; Derakhshandeh, Jaber; Rebibis, Kenneth June; Kajihara, Masanori; De Wolf, Ingrid; Beyne, Eric (2015) -
High density flip chip with adhesives on ceramics
Vandecasteele, Bjorn; Podprocky, T.; Vanfleteren, Jan (2002) -
Integration of thick film resistors in a multilayer structure
Podprocky, Tomas; Vandecasteele, Bjorn; De Baets, Johan; Van Calster, Andre; Bansky, Juraj (2003)