Browsing by imec author "8732393f67b07512e725114ed9e129719bc408be"
Now showing items 41-51 of 51
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Split and design guidelines for double patterning
Wiaux, Vincent; Verhaegen, Staf; Cheng, Shaunee; Iwamoto, Fumio; Jaenen, Patrick; Maenhoudt, Mireille; Matsuda, Takashi; Postnikov, Sergey; Vandenberghe, Geert (2008) -
Status of ArF lithography for the 130nm technology node
Ronse, Kurt; Vandenberghe, Geert; Jaenen, Patrick; Delvaux, Christie; Vangoidsenhoven, Diziana; Van Roey, Frieda; Pollers, Ingrid; Maenhoudt, Mireille; Goethals, Mieke; Pollentier, Ivan; Vleeming, Bert; van Ingen Schenau, K.; Heskamp, B.; Davies, G.; Finders, Jo; Niroomand, Ardavan (2000) -
Study of novel EUVL mask absorber candidates
Wu, Meiyi; Thakare, Devesh; De Marneffe, Jean-Francois; Jaenen, Patrick; Souriau, Laurent; Opsomer, Karl; Soulie, Jean-Philippe; Erdmann, Andreas; Mesilhy, Hazem; Naujok, Philipp; Foltin, Markus; Soltwisch, Victor; Saadeh, Qais; Philipsen, Vicky (2021) -
(Sub-) 100-nm gate patterning using 248-nm alternating PSM
Vandenberghe, Geert; Jaenen, Patrick; Jonckheere, Rik; Ronse, Kurt; Toublan, O. (2001) -
Sub-32nm half pitch imaging with high NA immersion exposure systems using Double Patterning techniques
Vleeming, Bert; Maenhoudt, Mireille; Quaedackers, John; van der Heijden, Eddy; de Haas, Paul; Uzunbajakau, Siarhei; Meessen, Jeroen; Dicker, Gerald; Finders, Jo; Dusa, Mircea; Jaenen, Patrick; Locorotondo, Sabrina (2007) -
Sub-50nm gate patterning using line-trimming with 248nm or 193nm litho
Pollentier, Ivan; Jaenen, Patrick; Baerts, Christina; Ronse, Kurt (2002) -
Sub-resolution feature OPC as an enabler for manufacturing at 0.2 μm and below
Randall, John; Tritchkov, Alexander; Ronse, Kurt; Jaenen, Patrick (1998) -
Temporary 0-level MEMS packaging using a heat decomposable sealing ring
Bogaerts, Lieve; Phommahaxay, Alain; Gerets, Carine; Jaenen, Patrick; Van Hoof, Rita; Severi, Simone; De Coster, Jeroen; Soussan, Philippe; Witvrouw, Ann; Beernaert, Roel; Rudra, Sukumar (2011) -
Temporary protective packaging for optical MEMS
Bogaerts, Lieve; Phommahaxay, Alain; Gerets, Carine; Jaenen, Patrick; Van Hoof, Rita; Severi, Simone; Van De Peer, Myriam; De Coster, Jeroen; La Manna, Antonio; Soussan, Philippe; Witvrouw, Ann (2011) -
Through-silicon via technology for three-dimensional integrated circuit manufacturing
Civale, Yann; Redolfi, Augusto; Jaenen, Patrick; Kostermans, Maarten; Van Besien, Els; Mertens, Sofie; Witters, Thomas; Jourdan, Nicolas; Armini, Silvia; Vandersmissen, Kevin; Philipsen, Harold; Verdonck, Patrick; Heylen, Nancy; Nolmans, Philip; Li, Yunlong; Croes, Kristof; Beyer, Gerald; Swinnen, Bart; Beyne, Eric (2012) -
Via-middle through-silicon via with integrated airgap to zero TSV-induced stress impact on device performance
Civale, Yann; Van Huylenbroeck, Stefaan; Redolfi, Augusto; Guo, Wei; Babaei Gavan, Khashayar; Jaenen, Patrick; La Manna, Antonio; Beyer, Gerald; Swinnen, Bart; Beyne, Eric (2013)