Browsing by author "Allaert, Bart"
Now showing items 1-11 of 11
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A study of brittle to ductile fracture transition temperatures in bulk Pb-free solders
Ratchev, Petar; Loccufier, Tony; Vandevelde, Bart; Verlinden, Bert; Teliszewski, Steven; Werkhoven, Daniel; Allaert, Bart (2005) -
Board-level solder intermetallic strength measurements using mini-Charpy shock testing and FEM calibration
Labie, Riet; Duflos, Frederic; Vandevelde, Bart; Allaert, Bart; Lauwaert, Ralph; Willems, Geert (2018) -
Four-point bending cycling as alternative for thermal cycling solder fatigue testing
Vandevelde, Bart; Vanhee, Filip; Pissoort, Davy; Degrendele, Lieven; De Baets, Johan; Allaert, Bart; Lauwaert, Ralph; Labie, Riet; Willems, Geert (2016-04) -
Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components
Vandevelde, Bart; Vanhee, Filip; Pissoort, Davy; Degrendele, Lieven; De Baets, Johan; Allaert, Bart; Lauwaert, Ralph; Zanon, Franco; Labie, Riet; Willems, Geert (2017) -
Hidden-head-in-pillow soldering failures
Vandevelde, Bart; Willems, Geert; Allaert, Bart (2014) -
How the mold compound thermal expansion overrules the solder composition choice in board level reliability performance
Vandevelde, Bart; Degrendele, Lieven; Cauwe, Maarten; Allaert, Bart; Lauwaert, Ralph; Willems, Geert (2016-04) -
Impact of pad finish on mechanical shock resistance of lead-free solder joints tested under shear and in pull mode
Vandevelde, Bart; Van Kerckhove, Matthias; Degryse, Dominiek; D'Haese, Wim; Schaubroeck, David; Allaert, Bart; Geerinckx, Eddy; Lauwaert, Ralph; Willems, Geert (2013) -
In-situ monitoring of field conditions and interconnect integrity for an electronic on-board module
Labie, Riet; Vandevelde, Bart; Van Meensel, Wesley; Vogeleer, Mike; Werkhoven, Daniel; Allaert, Bart; Willems, Geert (2017) -
Low-temperature enbrittlement of lead-free solders in joint level impact testing
Limaye, Paresh; Maurissen, Wout; Lambrinou, Konstantza; Duflos, Frederic; Vandevelde, Bart; Allaert, Bart; Hillaert, Joost; Vandepitte, Dirk; Verlinden, Bert (2007-12) -
Second level joint failures due to excessive warpage of advanced IC packages
Debecker, Bjorn; Vandevelde, Bart; Willems, Geert; Allaert, Bart (2013) -
Vibration fatigue analysis of lead-free CSP assemblies on printed circuit board
Nawghane, Chinmay; Vandevelde, Bart; Labie, Riet; Allaert, Bart; Lauwaert, Ralf; Vanhee, Filip; Pissoort, Davy; De Wolf, Ingrid; Mehner, Jan (2018-04)