Browsing by author "Mandrekar, T."
Now showing items 1-8 of 8
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Barrier integrity effect on leakage mechanism and dielectric reliability of copper/OSG interconnects
Li, Yunlong; Tokei, Zsolt; Mandrekar, T.; Mebarki, Bencherki; Groeseneken, Guido; Maex, Karen (2005) -
Barrier reliability of ALD TaN on sub-100 nm copper low-k interconnects
Tokei, Zsolt; Gailledrat, Thomas; Li, Yunlong; Schuhmacher, Jorg; Mandrekar, T.; Guggilla, S.; Mebarki, B.; Maex, Karen (2005) -
Barrier reliability on sub-100nm copper low-k interconnects
Tokei, Zsolt; Gailledrat, T.; Li, Yunlong; Schuhmacher, Jorg; Mandrekar, T.; Guggilla, S.; Mebarki, Bencherki; Maex, Karen (2004) -
Barrier studies on porous silk semiconductor dielectric
Tokei, Zsolt; Iacopi, Francesca; Richard, Olivier; Waeterloos, Joost; Rozeveld, S.; Beach, E.; Mebarki, Bencherki; Mandrekar, T.; Guggilla, S.; Maex, Karen (2003) -
Copper seed layer scaling for advanced interconnects: extendibility of I-PVD
Tokei, Zsolt; Demuynck, Steven; Vervoort, Iwan; Mebarki, Bencherki; Mandrekar, T.; Guggilla, S.; Maex, Karen (2003) -
Cu resistivity scaling limits for 20 nm copper damascene lines
Van Olmen, Jan; List, Scott; Tokei, Zsolt; Carbonell, Laure; Brongersma, Sywert; Volders, Henny; Kunnen, Eddy; Heylen, Nancy; Ciofi, Ivan; Khandelwal, A.; Gelatos, J.; Mandrekar, T.; Boelen, Pieter (2007) -
Reliability studies of MOCVD TiSin and EnCoRe Ta(N)/Ta
Tokei, Zsolt; Kelleher, Deirdre Maria; Mebarki, Bencherki; Mandrekar, T.; Guggilla, S.; Maex, Karen (2003) -
Scaling of the Cu(Al) seed layer thickness and its impact on the specific resistivity of sub-100 nm lines
Carbonell, Laure; Volders, Henny; Haider, A.; Heylen, Nancy; Richard, Olivier; Palmans, Roger; Travaly, Youssef; Tokei, Zsolt; Boelen, Pieter; Rosenfeld, A.; Mandrekar, T.; Hernandez, Jose Luis; Vanhaelemeersch, Serge (2007)