Browsing by author "Sardo, Stefano"
Now showing items 1-9 of 9
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Characterization of optical end-point detection for via reveal processing
Rassoul, Nouredine; Jourdain, Anne; Tutunjyan, Nina; De Vos, Joeri; Sardo, Stefano; Piumi, Daniele; Miller, Andy; Beyne, Eric; Walsby, Edward; Ashraf, Huma; Thomas, Dave (2018) -
Effect of inductively coupled electro-magnetic field on bottom oxide etch in a high aspect ratio trench
Sardo, Stefano; Palombizio, Antonio; Redolfi, Augusto; Mannarino, Manuel; Haspeslagh, Luc (2020) -
Effect of inductively coupled electro-magnetic field on bottom oxide etch in a high aspect ratio trench
Sardo, Stefano; Palombizio, Antonio; Redolfi, Augusto; Mannarino, Manuel (2020) -
Etch process modules development and integration in 3D SOC applications
Tutunjyan, Nina; Sardo, Stefano; De Vos, Joeri; Van Huylenbroeck, Stefaan; Jourdain, Anne; Peng, Lan; Inoue, Fumihiro; Rassoul, Nouredine; Beyer, Gerald; Beyne, Eric; Miller, Andy; Piumi, Daniele; Walsby, Edward; Ansell, Oliver; Ashraf, Huma; Thomas, Dave (2017) -
Etch process modules development and integration in 3D-SOC applications
Tutunjyan, Nina; Sardo, Stefano; De Vos, Joeri; Van Huylenbroeck, Stefaan; Jourdain, Anne; Peng, Lan; Inoue, Fumihiro; Rassoul, Nouredine; Beyer, Gerald; Beyne, Eric; Miller, Andy; Piumi, Daniele (2018) -
"Hole-in-one TSV", a new via last concept for high density 3DSOC interconnects
De Vos, Joeri; Van Huylenbroeck, Stefaan; Jourdain, Anne; Heylen, Nancy; Peng, Lan; Jamieson, Geraldine; Tutunjyan, Nina; Sardo, Stefano; Miller, Andy; Beyne, Eric (2018) -
Process characterization for donut TSV's
Slabbekoorn, John; Schepers, Bart; Sardo, Stefano; Van Huylenbroeck, Stefaan; Vandeweyer, Tom; Miller, Andy; Rebibis, Kenneth June; Flack, Warren; Kenyon, Gareth; Hsieh, Robert; Ranjan, Manish (2014) -
RIE dynamics for extreme wafer thinning applications
Rassoul, Nouredine; Jourdain, Anne; Tutunjyan, Nina; De Vos, Joeri; Sardo, Stefano; Inoue, Fumihiro; Piumi, Daniele; Miller, Andy; Beyne, Eric; Walsby, Edward; Jash Patel, Patel; Oliver, Ansell; Huma, Ashraf; Janet, Hopkins; Dave, Thomas (2017) -
Small pitch, high aspect ratio via-last TSV module
Van Huylenbroeck, Stefaan; Stucchi, Michele; Li, Yunlong; Slabbekoorn, John; Tutunjyan, Nina; Sardo, Stefano; Jourdan, Nicolas; Bogaerts, Lieve; Beirnaert, Filip; Beyer, Gerald; Beyne, Eric (2016)