Browsing by author "Drijbooms, Chris"
Now showing items 21-38 of 38
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Materials characterization of WNxCy, WNx and WCx films for advanced barriers
Volders, Henny; Tokei, Zsolt; Bender, Hugo; Brijs, Bert; Caluwaerts, Rudy; Carbonell, Laure; Conard, Thierry; Drijbooms, Chris; Franquet, Alexis; Garaud, Sylvain; Hoflijk, Ilse; Li, Wei-Min; Moussa, Alain; Sinapi, Fabrice; Sprey, Hessel; Travaly, Youssef; Vanhaeren, Danielle; Vereecke, Guy (2007) -
Metrology for monitoring and detecting process issues in a TSV module
Philipsen, Harold; Vandersmissen, Kevin; Cockburn, Andrew; Erickson, David; Drijbooms, Chris; Moussa, Alain; Bender, Hugo; Struyf, Herbert (2014) -
New sensitive electrical measurement techniques for the study of stress induced voiding
Witvrouw, Ann; Drijbooms, Chris; Bender, Hugo; Maex, Karen (1997) -
New sensitive electrical measurement techniques for the study of stress induced voiding
Witvrouw, Ann; Drijbooms, Chris; Bender, Hugo; Maex, Karen (1998) -
Reverse tip sample scanning for precise and high-throughput electrical characterization of advanced nodes
Celano, Umberto; Hantschel, Thomas; Boehme, Thijs; Kanniainen, A.; Wouters, Lennaert; Bender, Hugo; Bosman, Niels; Drijbooms, Chris; Folkersma, Steven; Paredis, Kristof; Vandervorst, Wilfried; van der Heide, Paul (2019) -
Scanning Spreading Resistance Microscopy for carrier profiling beyond 32nm node
Mody, Jay; Zschaetzsch, Gerd; Koelling, Sebastian; De Keersgieter, An; Eneman, Geert; Kambham, Ajay Kumar; Drijbooms, Chris; Schulze, Andreas; Chiarella, Thomas; Horiguchi, Naoto; Eyben, Pierre; Vandervorst, Wilfried (2012) -
Some observations on the corrosion of Cu after FIB preparation
Bender, Hugo; Richard, Olivier; Benedetti, Alessandro; Van Marcke, Patricia; Drijbooms, Chris (2004) -
Structural analysis of TSVs
Bender, Hugo; Drijbooms, Chris; Van Marcke, Patricia; Geypen, Jef; Richard, Olivier; Favia, Paola (2010) -
Structural characterization of through silicon vias (TSV)
Bender, Hugo; Drijbooms, Chris; Van Marcke, Patricia; Geypen, Jef; Philipsen, Harold; Radisic, Alex (2012) -
Surface contamination and electrical damage by focused ion beam: conditions applicable to the extraction of TEM lamellae from nano-electronic devices
Bender, Hugo; Franquet, Alexis; Drijbooms, Chris; Parmentier, Brigitte; Clarysse, Trudo; Vandervorst, Wilfried; Kwakman, Laurens (2015) -
Surface redeposition and damage due to focused ion beam milling
Bender, Hugo; Franquet, Alexis; Drijbooms, Chris; Parmentier, Brigitte; Vandervorst, Wilfried; Kwakman, Laurens (2015) -
The bottom-up copper fill of Ø5μm × 40μm vias using 2-component model
Radisic, Alex; Yang, Liu; Drijbooms, Chris; Bender, Hugo (2012) -
The bottom-up copper fill of Ø5μm × 40μm vias using 2-component model chemistry
Radisic, Alex; Yang, Liu; Drijbooms, Chris; Bender, Hugo (2011) -
The impact of Focused Ion Beam (FIB) induced electrical damage on electrical characterization
Pandey, Komal; Paredis, Kristof; Drijbooms, Chris; Vandervorst, Wilfried; Bender, Hugo (2018) -
The impact of focused ion beam induced damage on scanning spreading resistance microscopy
Pandey, Komal; Paredis, Kristof; Hantschel, Thomas; Drijbooms, Chris; Vandervorst, Wilfried (2020) -
The role of additives and deposition parameters in Cu plating of high aspect ratio vias
Ko, Ted; Radisic, Alex; Armini, Silvia; Vereecken, Philippe; Drijbooms, Chris; Bender, Hugo; Sun, S.P.; Wann, C.; Yu, C.H.; Leunissen, Peter; Ruythooren, Wouter; Vanhaelemeersch, Serge (2009-10) -
TSV Cu plating and implications for CMP
Radisic, Alex; Philipsen, Harold; Honore, Mia; Wang, Yu-Shuen; Heylen, Nancy; El-Mekki, Zaid; Armini, Silvia; Vandersmissen, Kevin; Rodet, Simon; Van Ammel, Annemie; Bender, Hugo; Drijbooms, Chris; Vanstreels, Kris; Ruythooren, Wouter (2010) -
TSV Cu plating and implications for CMP
Radisic, Alex; Philipsen, Harold; Honore, Mia; Wang, Y.S.; Heylen, Nancy; El-Mekki, Zaid; Armini, Silvia; Vandersmissen, Kevin; Rodet, Simon; Van Ammel, Annemie; Bender, Hugo; Drijbooms, Chris; Vanstreels, Kris; Ruythooren, Wouter (2011)