Browsing by author "Kellens, Kristof"
Now showing items 21-37 of 37
-
Implementation of Ru based barriers in 50 nm half pitch single damascene Cu/SiCOH (k=2.5) structures
Carbonell, Laure; Volders, Henny; Heylen, Nancy; Kellens, Kristof; Tokei, Zsolt; Hendrickx, Dirk; Struyf, Herbert; Claes, Martine; Versluijs, Janko; Van Besien, Els; Caluwaerts, Rudy; Cockburn, Andrew; Gravey, Virginie; Shah, Kavita; Al-Bayati, Amir; Fu, X.; Lubben, D.; Sundarrajan, A.; Beyer, Gerald (2009) -
Integration and dielectric reliability of 30nm 1/2 pitch structures in Aurora LK HM
Demuynck, Steven; Huffman, Craig; Claes, Martine; Suhard, Samuel; Versluijs, Janko; Volders, Henny; Heylen, Nancy; Kellens, Kristof; Croes, Kristof; Struyf, Herbert; Vereecke, Guy; Verdonck, Patrick; De Roest, David; Beynet, Julien; Sprey, Hessel; Beyer, Gerald (2009) -
Integration and dielectric reliability of 30nm ½ pitch structures in Aurora® LK HM
Demuynck, Steven; Huffman, Craig; Claes, Martine; Suhard, Samuel; Versluijs, Janko; Volders, Henny; Heylen, Nancy; Kellens, Kristof; Croes, Kristof; Struyf, Herbert; Vereecke, Guy; Verdonck, Patrick; De Roest, David; Beynet, Julien; Sprey, Hessel; Beyer, Gerald (2010) -
Integration of vertical carbon nanotube bundles for applications as contacts
Chiodarelli, Nicolo; Kellens, Kristof; Cott, Daire; Peys, Nick; Arstila, Kai; Heyns, Marc; De Gendt, Stefan; Groeseneken, Guido; Vereecken, Philippe (2009) -
Integration of vertical carbon nanotube bundles for interconnects
Chiodarelli, Nicolo; Kellens, Kristof; Cott, Daire; Peys, Nick; Arstila, Kai; Heyns, Marc; De Gendt, Stefan; Groeseneken, Guido; Vereecken, Philippe (2009) -
Integration of vertical carbon nanotube bundles for interconnects
Chiodarelli, Nicolo; Kellens, Kristof; Cott, Daire; Peys, Nick; Arstila, Kai; Heyns, Marc; De Gendt, Stefan; Groeseneken, Guido; Vereecken, Philippe (2010) -
Investigation of forming and its controllability in novel HfO2-based 1T1R 40nm-crossbar RRAM cells
Govoreanu, Bogdan; Kubicek, Stefan; Kar, Gouri Sankar; Chen, Yangyin; Paraschiv, Vasile; Rakowski, Michal; Degraeve, Robin; Goux, Ludovic; Clima, Sergiu; Jossart, Nico; Adelmann, Christoph; Richard, Olivier; Raes, Thomas; Vangoidsenhoven, Diziana; Vandeweyer, Tom; Tielens, Hilde; Kellens, Kristof; Devriendt, Katia; Heylen, Nancy; Brus, Stephan; Verbrugge, Beatrijs; Pantisano, Luigi; Bender, Hugo; Pourtois, Geoffrey; Kittl, Jorge; Wouters, Dirk; Altimime, Laith; Jurczak, Gosia (2011) -
Metallization of sub- 30 nm Interconnects: Comparison of different liner/seed combinations
Carbonell, Laure; Volders, Henny; Heylen, Nancy; Kellens, Kristof; Caluwaerts, Rudy; Devriendt, Katia; Altamirano Sanchez, Efrain; Wouters, Johan M. D.; Gravey, Virginie; Shah, Kavita; Luo, Qian; Sundarrajan, Arvind; Lu, Jiang; Aubuchon, Joseph; Ma, Paul; Narasimhan, Murali; Cockburn, Andrew; Tokei, Zsolt; Beyer, Gerald (2009) -
Metallization options for sub- 30 nm interconnects: comparison of Cu and W metallizations
Carbonell, Laure; Caluwaerts, Rudy; Volders, Henny; Heylen, Nancy; Kellens, Kristof; Mertens, Sofie; Van Ammel, Annemie; Van Roey, Frieda; Cockburn, Andrew; Gravey, Virgine; Shah, Kavita; Rajagopalan, Ravi; Tokei, Zsolt; Beyer, Gerald (2010) -
Optical metrology based post Cu CMP metal residue detection and characterization
Li, Yunlong; Tarnowka, Alexandre; Eliyahu, Aviv; Heylen, Nancy; Delande, Tinne; Favia, Paola; Bender, Hugo; Kellens, Kristof; Leunissen, Peter (2009) -
Poly-open and metal CMP steps in RMG processing on planar and 3D architecture devices
Devriendt, Katia; Kellens, Kristof; Veloso, Anabela; Athimulam, Raja; Horiguchi, Naoto; Leunissen, Peter (2011) -
Post-direct-CMP dielectric surface copper contamination: quantitative analysis and impact on dielectric breakdown behaviour
Heylen, Nancy; Li, Yunlong; Kellens, Kristof; Travaly, Youssef; Vereecke, Guy; Volders, Henny; Tokei, Zsolt; Versluijs, Janko; Rip, Jens; Van Besien, Els; Carbonell, Laure; Beyer, Gerald; Fischer, Paul; Zhao, Larry; Santoro, Gaetano; Cockburn, Andrew; Nguyen, Olivier (2009) -
Process control & integration options of RMG Technology for aggressively scaled devices
Veloso, Anabela; Higuchi, Yuichi; Chew, Soon Aik; Devriendt, Katia; Ragnarsson, Lars-Ake; Sebaai, Farid; Schram, Tom; Brus, Stephan; Vecchio, Emma; Kellens, Kristof; Rohr, Erika; Eneman, Geert; Simoen, Eddy; Cho, Moon Ju; Paraschiv, Vasile; Crabbe, Yvo; Shi, Xiaoping; Tielens, Hilde; Van Ammel, Annemie; Dekkers, Harold; Favia, Paola; Geypen, Jef; Bender, Hugo; Phatak, Anup; del Agua Borniquel, Jose Ignacio; Xu, K.; Allen, M.; Liu, C.; Xu, T.; Yoo, W.S.; Thean, Aaron; Horiguchi, Naoto (2012) -
Stabilisation and control of improved nano-ceria dispersions for STI CMP slurries
De Messemaeker, Jo; Kellens, Kristof; Van Genechten, Dirk; Put, Stijn; Nelis, Daniel; Strauven, Yvan; Ong, Patrick; Devriendt, Katia (2008) -
Tackling corrosion issues that occur during the chemical mechanical polishing process
Teugels, Lieve; Kellens, Kristof; Heylen, Nancy (2012) -
Thermal and SF6-plasma treatments for improved (sub-)1nm EOT planar and FinFET-based RMG high-k last devices and enabling a simplified scalable CMOS integration scheme
Veloso, Anabela; Boccardi, Guillaume; Ragnarsson, Lars-Ake; Higuchi, Yuichi; Arimura, Hiroaki; Lee, Jae Woo; Simoen, Eddy; Cho, Moon Ju; Roussel, Philippe; Paraschiv, Vasile; Shi, Xiaoping; Schram, Tom; Chew, Soon Aik; Brus, Stephan; Dangol, Anish; Vecchio, Emma; Sebaai, Farid; Kellens, Kristof; Heylen, Nancy; Devriendt, Katia; Dekkers, Harold; Van Ammel, Annemie; Witters, Thomas; Conard, Thierry; Vaesen, Inge; Richard, Olivier; Bender, Hugo; Athimulam, Raja; Chiarella, Thomas; Thean, Aaron; Horiguchi, Naoto (2013) -
Use of MIR-FTIR and k-value measurements to assess potential solutions to reduce damage during porous low-k integration
Beynet, Julien; De Roest, David; Rochat, N.; Kellens, Kristof; Verdonck, Patrick; Sprey, Hessel (2009)