Browsing by author "Palmans, Roger"
Now showing items 21-36 of 36
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Megasonics: a cavitation driven process
Holsteyns, Frank; Lee, Kuntack; Graf, S.; Palmans, Roger; Vereecke, Guy; Mertens, Paul (2004) -
Megasonics: a cavitation driven process
Holsteyns, Frank; Lee, Kuntack; Graf, S.; Palmans, Roger; Vereecke, Guy; Mertens, Paul (2005) -
Microstructure and resistivity characterization of CuAu I superlattice formed in Cu/Au thin films
Zhang, Wenqi; Brongersma, Sywert; Richard, Olivier; Brijs, Bert; Palmans, Roger; Froyen, Ludo; Maex, Karen (2004) -
New plating bath for electroless copper deposition on sputtered barrier layers
Lantasov, Yuri; Palmans, Roger; Maex, Karen (2000) -
New plating path for electroless copper deposition on sputtered barrier layers
Lantasov, Yuri; Min, Woo Sig; Palmans, Roger; Maex, Karen (1999) -
Non-correlated behavior of sheet resistance and stress during self-annealing of electroplated copper
Brongersma, Sywert; Vervoort, Iwan; Judelewicz, Moshe; Bender, Hugo; Conard, Thierry; Vandervorst, Wilfried; Beyer, Gerald; Richard, Emmanuel; Palmans, Roger; Lagrange, Sébastien; Maex, Karen (1999) -
Roles of additive during filling process of damascene structures with electrochemical deposited copper
Richard, Emmanuel; Vervoort, Iwan; Brongersma, Sywert; Beyer, Gerald; Bender, Hugo; Palmans, Roger; Lagrange, Sébastien; Maex, Karen (1999) -
Roles of additives during filling process of damascene structures with electrochemical deposited copper
Richard, Emmanuel; Vervoort, Iwan; Brongersma, Sywert; Bender, Hugo; Beyer, Gerald; Palmans, Roger; Lagrange, Sébastien; Maex, Karen (2000) -
Scaling of the Cu(Al) seed layer thickness and its impact on the specific resistivity of sub-100 nm lines
Carbonell, Laure; Volders, Henny; Haider, A.; Heylen, Nancy; Richard, Olivier; Palmans, Roger; Travaly, Youssef; Tokei, Zsolt; Boelen, Pieter; Rosenfeld, A.; Mandrekar, T.; Hernandez, Jose Luis; Vanhaelemeersch, Serge (2007) -
Self-annealing characterization of electroplated copper films
Lagrange, Sébastien; Brongersma, Sywert; Judelewicz, Moshe; Saerens, Annelies; Vervoort, Iwan; Richard, Emmanuel; Palmans, Roger; Maex, Karen (2000) -
Self-annealing characterization of electroplated copper films
Lagrange, Sébastien; Brongersma, Sywert; Judelewicz, Moshe; Saerens, Annelies; Vervoort, Iwan; Richard, Emmanuel; Palmans, Roger; Maex, Karen (1999) -
Stress Reduction in Tungsten CVD Films by RTA Post-Treatment of Ti/TiN Bilayers in Ammonia
Palmans, Roger; Mouroux, Aliette; Zhang, S. L.; Petersson, S.; Maex, Karen (1995) -
The formation of Pd seeded copper layer on TiN substrates by electroless deposition
Min, Woo Sig; Lantasov, Yuri; Palmans, Roger; Maex, Karen; Lee, D. N. (1998) -
The formation of Pd seeded copper layer on TiN substrates by electroless deposition
Min, Woo Sig; Lantasov, Yuri; Palmans, Roger; Maex, Karen; Dong, Nyung Lee (1999) -
The thickness and temperature dependent resistivity of thin copper films
Zhang, Wenqi; Brongersma, Sywert; Clarysse, Trudo; Wu, Wen; Vervoort, Iwan; Palmans, Roger; Hoflijk, Ilse; Bender, Hugo; Hui, W.; Carbonell, Laure; Rosseel, Erik; Vandervorst, Wilfried; Maex, Karen (2003) -
Thickness and temperature dependent resistivity of thin copper films
Zhang, Wenqi; Brongersma, Sywert; Clarysse, Trudo; Wu, Wen; Vervoort, Iwan; Palmans, Roger; Hoflijk, Ilse; Bender, Hugo; Hui, W.; Carbonell, Laure; Rosseel, Erik; Vandervorst, Wilfried; Maex, Karen (2004)