Browsing by author "Teugels, Lieve"
Now showing items 41-60 of 102
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Effect of deposition methods on material removal rate during nickel CMP
Wang, Yanni; Teugels, Lieve; Vandersmissen, Kevin; De Gendt, Stefan; Struyf, Herbert (2017-10) -
Effect of deposition methods on material removal rate during nickel CMP
Wang, Yanni; Teugels, Lieve; Vandersmissen, Kevin; De Gendt, Stefan; Krishnan, Sitaraman; Struyf, Herbert (2017-10) -
Effects of H2O2 and pH on the Chemical Mechanical Planarization of Molybdenum
Ryu, Heon-Yul; Teugels, Lieve; Devriendt, Katia; Struyf, Herbert; Kim, Tae-Gon; Park, Jin-Goo (2021) -
Electrical characterization of CNT contacts with Cu damascene top contact
van der Veen, Marleen; Vereecke, Bart; Huyghebaert, Cedric; Cott, Daire; Masahito, Sugiura; Kashiwagi, Yusaku; Teugels, Lieve; Caluwaerts, Rudy; Chiodarelli, Nicolo; Vereecken, Philippe; Beyer, Gerald; Heyns, Marc; De Gendt, Stefan; Tokei, Zsolt (2013) -
Electroless deposition on self-assembled monolayers as a method to enable fabrication of advanced interconnects
Maestre Caro, Arantxa; Chebiam, Ramanan V.; Teugels, Lieve; Clendenning, Scott; Clarke, Jim (2013) -
Fabrication challenges and opportunities for high-mobility materials: from CMOS applications to emerging derivative technologies
Collaert, Nadine; Alian, AliReza; De Jaeger, Brice; Peralagu, Uthayasankaran; Vais, Abhitosh; Walke, Amey; Witters, Liesbeth; Yu, Hao; Capogreco, Elena; Devriendt, Katia; Hopf, Toby; Kenis, Karine; Mannaert, Geert; Milenin, Alexey; Peter, Antony; Sebaai, Farid; Teugels, Lieve; van Dorp, Dennis; Wostyn, Kurt; Horiguchi, Naoto; Waldron, Niamh (2019-03) -
First demonstration of 3D stacked Finfets at a 45nm fin pitch and 110nm gate pitch technology on 300mm wafers
Vandooren, Anne; Franco, Jacopo; Wu, Zhicheng; Parvais, Bertrand; Li, Waikin; Walke, Amey; Peng, Lan; Deshpande, Paru; Rassoul, Nouredine; Hellings, Geert; Jamieson, Geraldine; Inoue, Fumihiro; Devriendt, Katia; Teugels, Lieve; Heylen, Nancy; Vecchio, Emma; Zheng, T.; Rosseel, Erik; Vanherle, Wendy; Hikavyy, Andriy; Mannaert, Geert; Chan, BT; Ritzenthaler, Romain; Mitard, Jerome; Ragnarsson, Lars-Ake; Waldron, Niamh; De Heyn, Vincent; Demuynck, Steven; Boemmels, Juergen; Mocuta, Dan; Ryckaert, Julien; Collaert, Nadine (2018) -
First demonstration of MOVPE In1-xGaxAs macaroni channel for 3-D NAND memory devices
Ramesh, Siva; Vadakupudhu Palayam, Senthil; Rosseel, Erik; Arreghini, Antonio; Kunert, Bernardette; Baryshnikova, Marina; Zhang, Liping; Ong, Patrick; Teugels, Lieve; Pak, Murat; Jossart, Nico; Raymaekers, Tom; Stiers, Jimmy; Van den Bosch, Geert; Furnemont, Arnaud (2019) -
First demonstration of sub-12 nm gate last IGZO-TFTs with oxygen tunnel architecture for front gate devices
Subhechha, Subhali; Rassoul, Nouredine; Belmonte, Attilio; Delhougne, Romain; Donadio, Gabriele Luca; Banerjee, Kaustuv; Dekkers, Harold; van Setten, Michiel; Mao, Ming; Puliyalil, Harinarayanan; Kundu, Shreya; Pak, Murat; Teugels, Lieve; Tsvetanova, Diana; Bazzazian, Nina; Klijs, Lars; Vaisman Chasin, Adrian; Heijlen, Jeroen; Kar, Gouri Sankar (2021) -
Galvanic corrosion issues related to copper/barrier CMP via inline electrochemical measurements
Teugels, Lieve; Nagar, Magi; Li, Yunlong; Heylen, Nancy (2010) -
Gate-all-around InGaAs nanowire FETs with peak transconductance of 2200 μS/μm at 50nm Lg using a replacement fin RMG flow
Waldron, Niamh; Sioncke, Sonja; Franco, Jacopo; Nyns, Laura; Vais, Abhitosh; Zhou, Daisy; Lin, Dennis; Boccardi, Guillaume; Sebaai, Farid; Xie, Qi; Givens, M.; Tang, F.; Jiang, X.; Chiu, Eddie; Opdebeeck, Ann; Merckling, Clement; Maes, Jan; van Dorp, Dennis; Teugels, Lieve; Sibaja-Hernandez, Arturo; De Meyer, Kristin; Barla, Kathy; Collaert, Nadine; Thean, Aaron (2015) -
Guiding the formation of single-handed enantiomeric porphyrin domains using kinked and chiral stepped surfaces
Avila-Bront, L. Gaby; Fleming, Christopher D; Whitfield, Mark C; Teugels, Lieve; Sibener, S.J. (2013) -
High-aspect-ratio ruthenium lnes for buried power rail
Gupta, Anshul; Kundu, Shreya; Teugels, Lieve; Boemmels, Juergen; Adelmann, Christoph; Heylen, Nancy; Jamieson, Geraldine; Varela Pedreira, Olalla; Ciofi, Ivan; Chava, Bharani; Wilson, Chris; Tokei, Zsolt (2018) -
Hybrid Metallization with Cu in sub 30nm Interconnects
van der Veen, Marleen; Soethoudt, Job; Delabie, Annelies; Varela Pedreira, Olalla; Vega Gonzalez, Victor; Lariviere, Stephane; Teugels, Lieve; Jourdan, Nicolas; Decoster, Stefan; Struyf, Herbert; Wilson, Chris; Croes, Kristof; Tokei, Zsolt (2020) -
IGZO integration scheme for enabling IGZO nFETs
Kljucar, Luka; Mitard, Jerome; Rassoul, Nouredine; Dekkers, Harold; Steudel, Soeren; del Agua Borniquel, Jose Ignacio; De Wachter, Bart; Teugels, Lieve; Tsvetanova, Diana; Devriendt, Katia; Grisin, Ilja; Boccardi, Guillaume; Hody, Hubert; Nag, Manoj; Di Piazza, Luca; Wilson, Chris; Kar, Gouri Sankar; Tokei, Zsolt; Ramalingam, J.; Cao, Yong; Diehl, Daniel L. (2019) -
III-V CMP process development
Ong, Patrick; Ansar, Sheikh; Gillot, Christophe; Lan, Yongqing; Teugels, Lieve; Waldron, Niamh; Proelss, Julian (2013) -
III/V CMP process development
Ong, Patrick; Usman Ibrahim, Ansar; Gillot, Christophe; Lan, Yongqing; Teugels, Lieve; Waldron, Niamh; Proelss, Julian (2013) -
Improvement in post-Chemical Mechanical Planarization cleaning process for Ru interconnects
Harada, Ken; Shibata, Toshiaki; Kawase, Yasuhiro; Teugels, Lieve; Heylen, Nancy; Struyf, Herbert (2019) -
Improving defectivity for III-V CMP processes for < 10 NM technology nodes
Teugels, Lieve; Ong, Patrick; Waldron, Niamh; Boccardi, Guillaume; Usman Ibrahim, Ansar; Siebert, Max; Leunissen, Leonardus (2014) -
Improving defectivity for III-V CMP processes for <10 nm technology nodes
Teugels, Lieve; Ong, Patrick; Boccardi, Guillaume; Waldron, Niamh; Usman Ibrahim, Ansar; Siebert, Joerg Max; Leunissen, Leonardus A.H. (2014)