Browsing by author "Teugels, Lieve"
Now showing items 21-40 of 102
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Challenges on surface conditioning in 3D device architectures: triple-gate finFETs, gate-all-around lateral and vertical nanowireFETs
Veloso, Anabela; Paraschiv, Vasile; Vecchio, Emma; Devriendt, Katia; Li, Waikin; Simoen, Eddy; Chan, BT; Tao, Zheng; Rosseel, Erik; Loo, Roger; Milenin, Alexey; Kunert, Bernardette; Teugels, Lieve; Sebaai, Farid; Lorant, Christophe; van Dorp, Dennis; Altamirano Sanchez, Efrain; Brus, Stephan; Marien, Philippe; Sibaja-Hernandez, Arturo; Matagne, Philippe; Waldron, Niamh; Mocuta, Dan; Collaert, Nadine (2017) -
Characterization of Sub-micron Metal Line Arrays Using Picosecond Ultrasonics
Mebendale, M.; Kotelyanskii, M.; Mair, R.; Mukundhan, P.; Bogdanowicz, Janusz; Teugels, Lieve; Charley, Anne-Laure; Kuszewski, Piotr (2020) -
Chemical mechanical planarization of patterned InP in shallow trench isolation (STI) template structures using hydrogen peroxide-based silica slurries containing oxalic acid or citric acid
Matovu, John B.; Ong, Patrick; Teugels, Lieve; Leunissen, Peter; Babu, S. V. (2014) -
Chemical mechanical polishing and planarization of Mn-based barrier/Ru liner films in Cu interconnects for advanced metallization nodes
Sagi, K.V.; Teugels, Lieve; van der Veen, Marleen; Struyf, Herbert; Babu, S.V. (2017) -
Chemical mechanical polishing of chemical vapor deposited Co films with minimal corrosion in the Cu/Co/Mn/SiCOH patterned structures
Sagi, K.V.; Teugels, Lieve; van der Veen, Marleen; Struyf, Herbert; Alety, S.R.; Babu, S.V. (2017) -
Chemical mechanical polishing of manganese (Mn)-based barrier films in the BEOL interconnects for advanced metallization nodes
Sagi, Kaushik; Babu, S.V.; van der Veen, Marleen; Struyf, Herbert; Teugels, Lieve (2016) -
Chemical mechanical polishing of nickel for damascene applications
Teugels, Lieve; Van den Eynde, Matthias; Delande, Tinne; Leunissen, Peter (2012) -
CMP of novel materials for frontend-of-line and backend-of-line applications
Leunissen, Peter; Ong, Patrick; Teugels, Lieve (2011) -
CMP on SiGe materials - linking chemical and physical properties to design low defect selective slurries
Ong, Patrick; Siebert, Max; Huang, Kevin; Teugels, Lieve; Ansar, Sheik; Leunissen, Peter (2014) -
CMP on SiGe materials – linking chemical and physical properties to design low defect and selective slurries
Ong, Patrick; Siebert, Max; Leunissen, Leonardus H. A.; Ibrahim, Sheikh Ansar Usman; Teugels, Lieve (2014) -
CMP process steps for the fabrication of spin-transfer torque magnetic random access memory
Tsvetanova, Diana; Heylen, Nancy; Teugels, Lieve; Crotti, Davide; Donadio, Gabriele Luca; Kar, Gouri Sankar; Struyf, Herbert; Souriau, Laurent; Mertens, Sofie; Swerts, Johan; Couet, Sebastien; Lin, Tsann; Paraschiv, Vasile; Kim, Woojin; Rao, Siddharth (2016) -
CMP process: optimization, analysis and challenges
Teugels, Lieve (2018) -
CMP processing of high-mobility channel material alternatives to Si
Ong, Patrick; Teugels, Lieve (2016) -
Co and Ru dual damascene compatible metallization studies
van der Veen, Marleen; Heylen, Nancy; Lariviere, Stephane; Vega Gonzalez, Victor; Kesters, Els; Le, Quoc Toan; Teugels, Lieve; Chew, Soon Aik; Philipsen, Harold; Hung, Joey; Adelmann, Christoph; Vanstreels, Kris; Jourdan, Nicolas; Holsteyns, Frank; Struyf, Herbert; Wilson, Chris; Tokei, Zsolt (2019) -
Contact module at dense gate pitch technology challenges
Demuynck, Steven; Mao, Ming; Kunnen, Eddy; Versluijs, Janko; Croes, Kristof; Wu, Chen; Schaekers, Marc; Peter, Antony; Kauerauf, Thomas; Teugels, Lieve; Boemmels, Juergen (2014) -
Critical dimension metrology using Raman spectroscopy
Gawlik, Andrzej; Bogdanowicz, Janusz; Nuytten, Thomas; Charley, Anne-Laure; Teugels, Lieve; Misiewicz, Jan; Vandervorst, Wilfried (2020) -
Demonstration of a collective hybrid die-to-wafer integration using glass carrier
Suhard, Samuel; Kennes, Koen; Bex, Pieter; Jourdain, Anne; Teugels, Lieve; Walsby, Edward; Bolton, Chris; Patel, Jash; Ashraf, Huma; Barnett, Richard; Fodor, Ferenc; Phommahaxay, Alain; La Tulipe, Douglas Charles; Beyer, Gerald; Beyne, Eric (2021) -
Development of post InGaAs CMP cleaning process for sub 10 nm device application
Purushothaman, Muthukrishnan; Choi, In-chan; Kim, Hyun-Tae; Teugels, Lieve; Kim, Tae-Gon; Park, Jin-Goo (2017-10) -
Development of post InGaAs CMP cleaning process for sub 10nm device application
Purushothaman, Muthukrishnan; Choi, In-Chan; Kim, Hyun-Tae; Teugels, Lieve; Kim, Tae-Gon; Park, Jin-Goo (2017-10) -
Effect of Al2O3 and SiO2 Abrasives on the CMP of molybdenum using different polishing parameters
Kalantzis, Panagiotis; Teugels, Lieve; De Gendt, Stefan (2017-10)