Browsing imec Publications by imec author "240a41390b3d5efae2a78cdc2980abce2c2cbc7e"
Now showing items 1-14 of 14
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A Novel Volatile Film for Dielectric Plasma Damage Protection
de Marneffe, Jean-Francois; Rezvanov, Askar; Chanson, Romain; Babaei Gavan, Khashayar; Fujikawa, M.; Yamaguchi, T.; Nozawa, S.; Kikuchi, Y.; Maekawa, K. (2019) -
Effect of precoat on the sidewall profile of through silicon via's
Babaei Gavan, Khashayar; Lazzarino, Frederic; Brouri, Mohand; Tutunjyan, Nina; de Marneffe, Jean-Francois; Kunnen, Eddy; Xu, Kaidong (2013) -
Fabrication of magnetic tunnel junctions connected through a continuous free layer to enable spin logic devices
Wan, Danny; Manfrini, Mauricio; Vaysset, Adrien; Souriau, Laurent; Wouters, Lennaert; Thiam, Arame; Raymenants, Eline; Sayan, Safak; Jussot, Julien; Swerts, Johan; Couet, Sebastien; Rassoul, Nouredine; Babaei Gavan, Khashayar; Paredis, Kristof; Huyghebaert, Cedric; Ercken, Monique; Wilson, Chris; Mocuta, Dan; Radu, Iuliana (2018) -
Feasibility study of fully self aligned vias for 5nm node BEOL
Murdoch, Gayle; Boemmels, Juergen; Wilson, Chris; Babaei Gavan, Khashayar; Le, Quoc Toan; Tokei, Zsolt; Clark, William (2017) -
Gas Phase Pore Stuffing (GPPS)
Fujikawa, M; Yamaguchi, T; Nozawa, S; Niino, R; Chanson, Romain; Babaei Gavan, Khashayar; Lazzarino, Frederic; de Marneffe, Jean-Francois (2018) -
Gas phase pore stuffing for the protection of organo-silicate glass dielectric materials
Fujikawa, Makoto; de Marneffe, Jean-Francois; Chanson, Romain; Babaei Gavan, Khashayar; Rezvanov, Askar; Lazzarino, Frederic; Tokei, Zsolt; Yamaguchi, T.; Nozawa, N.; Sato, Nagisa (2018) -
Gas-phase pore stuffing for low-damage patterning of organo-silicate glass dielectric materials
de Marneffe, Jean-Francois; Fujikawa, T.M.; Yamaguchi, T.; Nozawa, S.; Niino, R.; Sato, N.; Chanson, R.; Babaei Gavan, Khashayar; Rezvanov, Askar; Lazzarino, Frederic; Tokei, Zsolt (2018) -
Integration challenges of spin torque majority gatelogic
Wilson, Chris; Manfrini, Mauricio; Thiam, Arame; Souriau, Laurent; Babaei Gavan, Khashayar; Rassoul, Nouredine; Radisic, Dunja; Vaysset, Adrien; Trivkovic, Darko; Ercken, Monique; Swerts, Johan; Briggs, Basoene; Sayan, Safak; Radu, Iuliana; Mocuta, Dan (2016) -
Integration of interconnected magnetic tunnel junctions for spin torque majority gates
Wan, Danny; Manfrini, Mauricio; Souriau, Laurent; Sayan, Safak; Jussot, Julien; Swerts, Johan; Rassoul, Nouredine; Babaei Gavan, Khashayar; Wouters, Lennaert; Paredis, Kristof; Huyghebaert, Cedric; Vaysset, Adrien; Thiam, Arame; Ercken, Monique; Wilson, Chris; Mocuta, Dan; Radu, Iuliana (2017) -
Interconnected magnetic tunnel junctions for spin-logic applications
Manfrini, Mauricio; Vaysset, Adrien; Wan, Danny; Raymenants, Eline; Swerts, Johan; Rao, Siddharth; Zografos, Odysseas; Souriau, Laurent; Babaei Gavan, Khashayar; Rassoul, Nouredine; Radisic, Dunja; Cupak, Miroslav; Dehan, Morin; Sayan, Safak; Nikonov, Dmitry E.; Manipatruni, Sasikanth; Young, Ian A.; Mocuta, Dan; Radu, Iuliana (2018) -
Interconnected MTJs driven by STT for spin-logic applications
Manfrini, Mauricio; Vaysset, Adrien; Wan, Danny; Raymenants, Eline; Swerts, Johan; Rao, Siddharth; Souriau, Laurent; Babaei Gavan, Khashayar; Rassoul, Nouredine; Radisic, Dunja; Cupak, Miroslav; Dehan, M; Sayan, S; Nikonov, D.E.; Manipatruni, S; Young, I. A.; Mocuta, Dan; Radu, Iuliana (2017) -
Patterning challenges for beyond 3nm logic devices: Example of an interconnected magnetic tunnel junction
Thiam, Arame; Wan, Danny; Souriau, Laurent; Babaei Gavan, Khashayar; Rassoul, Nouredine; Swerts, Johan; Couet, Sebastien; Raymenants, Eline; Jussot, Julien; Trivkovic, Darko; Ercken, Monique; Wilson, Chris; Radu, Iuliana (2019) -
Use of a thermally degradable chemical vapor deposited polymer film for low damage plasma processing of highly porous dielectrics
de Marneffe, Jean-Francois; Yamaguchi, Tatsuya; Fujikawa, Makoto; Rezvanov, Askar; Chanson, Romain; Zhang, Jianran; Babaei Gavan, Khashayar; El Otell, Ziad; Nozawa, S.; Kikuchi, Y.; Maekawa, Kaoru (2019) -
Via-middle through-silicon via with integrated airgap to zero TSV-induced stress impact on device performance
Civale, Yann; Van Huylenbroeck, Stefaan; Redolfi, Augusto; Guo, Wei; Babaei Gavan, Khashayar; Jaenen, Patrick; La Manna, Antonio; Beyer, Gerald; Swinnen, Bart; Beyne, Eric (2013)