Browsing imec Publications by imec author "813f94a69406dccfc22948fd8122300b49e243b3"
Now showing items 1-20 of 65
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A combined modelling approach to design test structures to study thermomigration in Cu interconnects
Ding, Youqi; Lofrano, Melina; Varela Pedreira, Olalla; Zahedmanesh, Houman; Croes, Kristof; De Wolf, Ingrid (2022) -
A framework for combined simulations of electromigration induced stress evolution, void nucleation, and its dynamics: Application to nano-interconnect reliability
Saleh, Ahmed; Croes, Kristof; Ceric, H.; De Wolf, Ingrid; Zahedmanesh, Houman (2023) -
A Novel System-Level Physics-based Electromigration Modelling Framework: Application to the Power Delivery Network
Zahedmanesh, Houman; Ciofi, Ivan; Zografos, Odysseas; Badaroglu, Mustafa; Croes, Kristof (2021) -
A numerical study on nano-indentation induced fracture of low dielectric constant brittle thin films using cube corner probes
Zahedmanesh, Houman; Vanstreels, Kris; Gonzalez, Mario (2016) -
A pragmatic network-aware paradigm for system-level electromigration predictions at scale
Zahedmanesh, Houman; Roussel, Philippe; Ciofi, Ivan; Croes, Kristof (2023) -
Advanced modeling and simulation of Cu nano-interconnects reliability
Ceric, Hajdin; Zahedmanesh, Houman (2019) -
Airgaps in advanced nano-interconnects; mechanics and impact on electromigration
Zahedmanesh, Houman; Besser, Paul; Wilson, Chris; Croes, Kristof (2016) -
Analysis of electromigration failure of nano-interconnects through a combination of modeling and experimental methods
Ceric, Hajdin; Zahedmanesh, Houman; Croes, Kristof (2019) -
Analysis of the mechanical integrity of nano-interconnects; A novel approach inspired by composite mechanics
Zahedmanesh, Houman; Vanstreels, Kris; Gonzalez, Mario (2018) -
Assessment of critical Co electromigration parameters
Varela Pedreira, Olalla; Lofrano, Melina; Zahedmanesh, Houman; Roussel, Philippe; van der Veen, Marleen; Simons, Veerle; Chery, Emmanuel; Ciofi, Ivan; Croes, Kristof (2022) -
Assessment of Electromigration in Nano-Interconnects
Ceric, Hajdin; Selberherr, Siegfried; Zahedmanesh, Houman; de Orio, Roberto; Croes, Kristof (2019) -
Bump pad design and its impact on the reliability of flip chip packages
Gonzalez, Mario; Lofrano, Melina; Vanstreels, Kris; Zahedmanesh, Houman; Beyne, Eric (2018) -
Buried power rail integration with FinFETs for ultimate CMOS scaling
Gupta, Anshul; Varela Pedreira, Olalla; Arutchelvan, Goutham; Zahedmanesh, Houman; Devriendt, Katia; Hanssen, Frederik; Tao, Zheng; Ritzenthaler, Romain; Wang, Shouhua; Radisic, Dunja; Kenis, Karine; Teugels, Lieve; Sebaai, Farid; Lorant, Christophe; Jourdan, Nicolas; Chan, BT; Subramanian, Sujith; Schleicher, Filip; Hopf, Toby; Peter, Antony; Rassoul, Nouredine; Debruyn, Haroen; Demonie, Ingrid; Siew, Yong Kong; Chiarella, Thomas; Briggs, Basoene; Zhou, Daisy; Rosseel, Erik; De Keersgieter, An; Capogreco, Elena; Dentoni Litta, Eugenio; Boccardi, Guillaume; Baudot, Sylvain; Mannaert, Geert; Bontemps, Noemie; Sepulveda Marquez, Alfonso; Mertens, Sofie; Kim, Min-Soo; Dupuy, Emmanuel; Vandersmissen, Kevin; Paolillo, Sara; Cousserier, Joris; Yakimets, Dmitry; Lazzarino, Frederic; Chehab, Bilal; Favia, Paola; Drijbooms, Chris; Jaysankar, Manoj; Morin, Pierre; Altamirano Sanchez, Efrain; Mitard, Jerome; Wilson, Chris; Holsteyns, Frank; Boemmels, Juergen; Demuynck, Steven; Tokei, Zsolt; Horiguchi, Naoto (2020) -
Buried Power Rail Integration with Si FinFETs for CMOS Scaling beyond the 5 nm Node
Gupta, Anshul; Mertens, Hans; Tao, Zheng; Demuynck, Steven; Boemmels, Juergen; Arutchelvan, Goutham; Devriendt, Katia; Varela Pedreira, Olalla; Ritzenthaler, Romain; Wang, Shouhua; Radisic, Dunja; Kenis, Karine; Teugels, Lieve; Sebaai, Farid; Lorant, Christophe; Jourdan, Nicolas; Chan, BT; Zahedmanesh, Houman; Subramanian, Sujith; Schleicher, Filip; Hopf, Toby; Peter, Antony; Rassoul, Nouredine; Debruyn, Haroen; Demonie, Ingrid; Siew, Yong Kong; Chiarella, Thomas; Briggs, Basoene; Zhou, Daisy; Rosseel, Erik; De Keersgieter, An; Capogreco, Elena; Dentoni Litta, Eugenio; Boccardi, Guillaume; Baudot, Sylvain; Mannaert, Geert; Bontemps, N.; Sepulveda Marquez, Alfonso; Mertens, Sofie; Kim, Min Soo; Dupuy, Emmanuel; Vandersmissen, Kevin; Paolillo, Sara; Yakimets, Dmitry; Chehab, Bilal; Favia, Paola; Drijbooms, Chris; Cousserier, Joris; Jaysankar, Manoj; Lazzarino, Frederic; Morin, Pierre; Altamirano Sanchez, Efrain; Mitard, Jerome; Wilson, Chris; Holsteyns, Frank; Tokei, Zsolt; Horiguchi, Naoto (2020) -
Challenges and solutions for chip package interaction
Vanstreels, Kris; Cherman, Vladimir; Zahedmanesh, Houman; De Wolf, Ingrid; Gonzalez, Mario (2015) -
Challenges for Interconnect Reliability: From Element to System Level
Varela Pedreira, Olalla; Zahedmanesh, Houman; Ding, Youqi; Ciofi, Ivan; Croes, Kristof (2023) -
Copper electromigration; prediction of scaling limits
Zahedmanesh, Houman; Varela Pedreira, Olalla; Wilson, Chris; Tokei, Zsolt; Croes, Kristof (2019) -
Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; A numerical investigation
Zahedmanesh, Houman; Gonzalez, Mario; Ciofi, Ivan; Croes, Kristof; Boemmels, Juergen; Tokei, Zsolt (2016) -
Determination of thermal expansion coefficients of low- dielectrics by cube corner indentation tests at elevated temperatures
Vanstreels, Kris; Zahedmanesh, Houman; Verdonck, Patrick; Baklanov, Mikhaïl (2016) -
Determination of thermal expansion coefficients of low-k dielectrics by cube corner indentation tests at elevated temperatures
Vanstreels, Kris; Zahedmanesh, Houman; Verdonck, Patrick; Hangen, Ude; Baklanov, Mikhaïl (2016)