Recently added

Optimizing extended Hodgkin-Huxley neuron model simulations for a xeon/xeon phi node

Chatzikonstantis, George; Rodopoulos, Dimitrios; Strydis, Christos; De Zeeuw, Chris; Soudris, Dimitrios (2017)

Cryo-etching for integration in micro-electronic : Silicon deep etch for contact and low-k integration in Back end of line (BEOL)

Chanson, Romain; Lefaucheux, Philippe; Dussart, Remi; Shen, Peng; Urabe, Keiichiro; Dussarat, Christian; Maekawa, Kaoru; yatsuda, koichi; Tahara, Shigeru; de Marneffe, Jean-Francois (2017)

Low-k cryo-etching : comparison of four different High Boiling Point Organic (HBPO)

Chanson, Romain; Lefaucheux, P.L.; Dussart, R.; Tillocher, T.; Shen, P.; Urabe, K.; Dussarat, C.; Maekawa, K.; Yatsuda, K.; Tahara, S.; de Marneffe, Jean-Francois (2017)

Low damage ULK etching by means of high boiling point organic condensation

Chanson, Romain; Holtzer, Nicolas; Lefaucheux, Philippe; Dussart, Rémi; SHEN, Peng; URABE, Keiichiro; Dussarat, Christian; Maekawa, Kaoru; yatsuda, koichi; Tahara, Shigeru; de Marneffe, Jean-Francois (2017)

Integration of the Sequential Infiltration Synthesis (SIS) on Polyphtaladehyde (PPA) resist for thermal Scanning Probe Lithography (t-SPL) patterning

Chan, BT; de Marneffe, Jean-Francois; Spieser, Martin; Knoll, Armin; Knaepen, Werner (2017)

SW-SGD: The sliding window stochastic gradient descent algorithm

Chakroun, Imen; Haber, Tom; Ashby, Tom (2017)

Probing the critical region of conductive filament in nanoscale hafnium-oxide resistive-switching device by random telegraph signals

Chai, Zheng; Ma, Jigang; Zhang, Weidong; Govoreanu, Bogdan; Ji, Zhigang; Zhang, Jian Fu; Jurczak, Gosia (2017)

Extracellular matrix proteins as temporary coating for thin-film neural implants

Ceyssens, Frederik; Deprez, Marjolijn; Turner, Neill; Kil, Dries; van Kuyck, Kris; Welkenhuysen, Marleen; Nuttin, Bart; Badylak, Stephen; Puers, Bob (2017)

Registration strategies for multi-modal whole-body MRI mosaicing

Cerenka, Jakub; Polfliet, Mathias; Lecouvet, Frédéric; Michoux, Nicolas; De Mey, Johan; Vandemeulebroucke, Jef (2017-06)

Whole-body diffusion-weighted MR image stitching and alignment to anatomical MRI

Cerenka, Jakub; Polfliet, Mathias; Lecouvet, Frederic; Michoux, Nicolas; Vandemeulebroucke, Jef (2017)

Electrical atomic force microscopy for 2D transition metal dichalcogenide materials

Celano, Umberto; Virkki, Olli; Mascaro, Marco; Nalin Mehta, Ankit; Bender, Hugo; Chiappe, Daniele; Asselberghs, Inge; Paredis, Kristof; Hoflijk, Ilse; Franquet, Alexis; Huyghebaert, Cedric; Radu, Iuliana; Vandervorst, Wilfried (2017)

Characterization of grain boundaries and impact of plasma-induced patterned in 2D materials

Celano, Umberto; Virkki, Olli; Chiappe, Daniele; Heyne, Markus; Hoflijk, Ilse; Franquet, Alexis; Huyghebaert, Cedric; Paredis, Kristof; De Gendt, Stefan; Radu, Iuliana; Vandervorst, Wilfried (2017)

Nanoscale three-dimensional characterization with scalpel SPM

Celano, Umberto; Vandervorst, Wilfried (2017)

Direct probing of the dielectric scavenging-layer interface in oxide filamentary-based valence change memory

Celano, Umberto; Op de Beeck, Jonathan; Clima, Sergiu; Luebben, Michael; Koenraad, Paul; Goux, Ludovic; Valov, Ilia; Vandervorst, Wilfried (2017)

Tuning the switching behavior of conductive-bridge resistive memory by the modulation of the cation-supplier alloys

Celano, Umberto; Mirabelli, Luigi; Goux, Ludovic; Opsomer, Karl; Devulder, Wouter; Crupi, Felice; Detavernier, Christophe; Jurczak, Gosia; Vandervorst, Wilfried (2017)

Non-filamentary (VMCO) memory: a two- and three-dimensional study on switching and failure modes

Celano, Umberto; Gastaldi, Carlotta; Subhechha, Subhali; Govoreanu, Bogdan; Donadio, Gabriele Luca; Franquet, Alexis; Ahmad, Tareq; Detavernier, Christophe; Richard, Olivier; Bender, Hugo; Goux, Ludovic; Kar, Gouri Sankar; van der Heide, Paul; Vandervorst, Wilfried (2017)

Evidences of areal switching in Vacancy-Modulated Conductive Oxide (VMCO) memory

Celano, Umberto; Gastaldi, Carlotta; Govoreanu, Bogdan; Richard, Olivier; Bender, Hugo; Goux, Ludovic; Kar, Gouri Sankar; Vandervorst, Wilfried (2017)

Individual device analysis using hybrid TEM-scalpel SSRM metrology

Celano, Umberto; Favia, Paola; Drijbooms, Chris; Dixon-Luinenburg, Oberon; Richard, Olivier; Bender, Hugo; Vancoille, Eric; Paredis, Kristof; Loo, Roger; Schulze, Andreas; Hikavyy, Andriy; Witters, Liesbeth; Mitard, Jerome; Collaert, Nadine; Horiguchi, Naoto; Vandervorst, Wilfried (2017)

Metrology for memristive devices: from filamentary to areal switching

Celano, Umberto (2017)

Hybrid copper dielectric direct bonding of 200mm CMOS wafers with five metal levels: morphologic, electrical and reliability characterization

Cavaco, Celso; Peng, Lan; Guerrieri, Stefano; Osman, Haris (2017)

imec Publications: Recent submissions

Optimizing extended Hodgkin-Huxley neuron model simulations for a xeon/xeon phi node ﻿

Cryo-etching for integration in micro-electronic : Silicon deep etch for contact and low-k integration in Back end of line (BEOL) ﻿

Low-k cryo-etching : comparison of four different High Boiling Point Organic (HBPO) ﻿

Low damage ULK etching by means of high boiling point organic condensation ﻿

Integration of the Sequential Infiltration Synthesis (SIS) on Polyphtaladehyde (PPA) resist for thermal Scanning Probe Lithography (t-SPL) patterning ﻿

SW-SGD: The sliding window stochastic gradient descent algorithm ﻿

Probing the critical region of conductive filament in nanoscale hafnium-oxide resistive-switching device by random telegraph signals ﻿

Extracellular matrix proteins as temporary coating for thin-film neural implants ﻿

Registration strategies for multi-modal whole-body MRI mosaicing ﻿

Whole-body diffusion-weighted MR image stitching and alignment to anatomical MRI ﻿

Electrical atomic force microscopy for 2D transition metal dichalcogenide materials ﻿

Characterization of grain boundaries and impact of plasma-induced patterned in 2D materials ﻿

Nanoscale three-dimensional characterization with scalpel SPM ﻿

Direct probing of the dielectric scavenging-layer interface in oxide filamentary-based valence change memory ﻿

Tuning the switching behavior of conductive-bridge resistive memory by the modulation of the cation-supplier alloys ﻿

Non-filamentary (VMCO) memory: a two- and three-dimensional study on switching and failure modes ﻿

Evidences of areal switching in Vacancy-Modulated Conductive Oxide (VMCO) memory ﻿

Individual device analysis using hybrid TEM-scalpel SSRM metrology ﻿

Metrology for memristive devices: from filamentary to areal switching ﻿

Hybrid copper dielectric direct bonding of 200mm CMOS wafers with five metal levels: morphologic, electrical and reliability characterization ﻿