Investigation of TSV noise coupling in 3D-ICs using an experimental validated 3D TSV circuit model including Si substrate effects and TSV capacitance inversion behavior after wafer thinning

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Authors
Sun, Xiao; Rack, Martin; Van der Plas, Geert; Stucchi, Michele; De Vos, Joeri; Absil, Philippe; Raskin, J.P.; Beyne, Eric
Conference
IEEE MTT-S International Microwave Symposium - IMS
Title
Investigation of TSV noise coupling in 3D-ICs using an experimental validated 3D TSV circuit model including Si substrate effects and TSV capacitance inversion behavior after wafer thinning
Publication type
Proceedings paper
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