Browsing Conference contributions by imec author "107a1b814895c363316d8b16332bd8161a36b782"
Now showing items 1-15 of 15
-
A wet etching technique to reveal threading dislocations in thin germanium layers
Souriau, Laurent; Terzieva, Valentina; Meuris, Marc; Caymax, Matty (2008) -
Composite nanoparticles for defectivity reduction during CMP
Armini, Silvia; Terzieva, Valentina; Maex, Karen (2004) -
Copper grain growth in reduced dimensions
Brongersma, Sywert; Vanstreels, Kris; Wu, W.; Zhang, Wenqi; Ernur, Didem; D'Haen, Jan; Terzieva, Valentina; Van Hove, Marleen; Clarysse, Trudo; Carbonell, Laure; Vandervorst, Wilfried; De Ceuninck, Ward; Maex, Karen (2004-06) -
Corrosion of the copper damascene interconnects as a function of the electrochemical plating process parameters
Ernur, Didem; Wu, Wen; Brongersma, Sywert; Terzieva, Valentina; Maex, Karen (2004) -
Effect of sub-10nm fin-widths on the analog performance of FinFETs
Bhoir, Mandar; Nihar, Mohapatra; Chiarella, Thomas; Ragnarsson, Lars-Ake; Mitard, Jerome; Terzieva, Valentina; Horiguchi, Naoto (2019) -
Galvanic corrosion testing of WCxNy barrier metal in H202 based slurries
Ernur, Didem; Schuhmacher, Jörg; Terzieva, Valentina; Shamiryan, Denis; Maex, Karen (2003) -
Germanium: the past and possibly a future material for microelectronics
Brunco, David; De Jaeger, Brice; Eneman, Geert; Satta, Alessandra; Terzieva, Valentina; Souriau, Laurent; Leys, Frederik; Pourtois, Geoffrey; Houssa, Michel; Opsomer, Karl; Nicholas, Gareth; Meuris, Marc; Heyns, Marc (2007) -
High Ge content SGOI substrates obtained by the Ge condensation technique:a template for growth of strained epitaxial Ge
Souriau, Laurent; Terzieva, Valentina; Vandervorst, Wilfried; Clemente, Francesca; Brijs, Bert; Moussa, Alain; Caymax, Matty; Loo, Roger; Meuris, Marc (2007) -
High hole mobility SGOI substrates obtained by the Ge condensation technique
Souriau, Laurent; Nguyen, Tuan; Augendre, Emmanuel; Loo, Roger; Terzieva, Valentina; Caymax, Matty; Cristoloveanu, Sorin; Meuris, Marc; Vandervorst, Wilfried (2008) -
High hole mobility SGOI substrates obtained by the germanium condensation technique
Souriau, Laurent; Nguyen, Tuan; Vandervorst, Wilfried; Loo, Roger; Terzieva, Valentina; Caymax, Matty; Meuris, Marc (2008) -
Influence of electrochemical plating process parameters on corrosion of Cu damascene interconnects
Ernur, Didem; Wu, Wen; Brongersma, Sywert; Terzieva, Valentina; Maex, Karen (2004) -
Inhibition of galvanic corrosion of WNC barrier metal for reliable Cu CMP
Ernur, Didem; Terzieva, Valentina; Schuhmacher, Jorg; Maex, Karen (2004) -
New slurry formulation for copper-CMP process in a damascene integration scheme
Terzieva, Valentina; Sijmus, Bram; Meuris, Marc; Puppe, Lothar; Passing, Gerd (2002) -
Shrinking composite core-shell nanoparticles for CMP
Armini, Silvia; Eslava Fernandez, Salvador; Whelan, Caroline; Terzieva, Valentina; Maex, Karen (2005) -
The influence of the selectivity in a 2nd step slurry for a Cu CMP process
Sijmus, Bram; Vos, Ingrid; Terzieva, Valentina; Meuris, Marc; Hernandez, Jose Luis (2002)