Browsing Conference contributions by imec author "6ba854a03ba43a99603f3feaa0360d0b4898806f"
Now showing items 21-31 of 31
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On the feasibility of die-to-wafer inorganic dielectric bonding
Wang, Teng; Podpod, Arnita; Capuz, Giovanni; Peng, Lan; Phommahaxay, Alain; Inoue, Fumihiro; Bex, Pieter; Dubey, Vikas; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2016) -
Picking large thinned dies with high topography on both sides
Gerets, Carine; Derakhshandeh, Jaber; Wang, Teng; Capuz, Giovanni; Podpod, Arnita; Demeurisse, Caroline; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2014) -
Polymer and bump planarization for fine pitch micro-bump stacking
Inoue, Fumihiro; Derakhshandeh, Jaber; Moeller, Berthold; Gokita, Yohei; Duval, Fabrice; Bex, Pieter; Capuz, Giovanni; Rebibis, Kenneth June; Miller, Andy; Sleeckx, Erik; Beyer, Gerald; Beyne, Eric (2018) -
Process complexity and cost considerations of multi-layer die stacks
Velenis, Dimitrios; De Vos, Joeri; Kim, Soon-Wook; Derakhshandeh, Jaber; Bex, Pieter; Capuz, Giovanni; Suhard, Samuel; Rebibis, Kenneth June; Van Huylenbroeck, Stefaan; Marinissen, Erik Jan; Phommahaxay, Alain; Miller, Andy; Beyer, Gerald; Van der Plas, Geert; Beyne, Eric (2019) -
Process development to enable 3D IC multi-tier die bond for 20 $lm pitch and beyond
Hu, Yu-Hsiang; Liu, C.S.; Chen, M.T.; Cheng, M.D.; Kuo, H.J.; Lii, M.J.; La Manna, Antonio; Rebibis, Kenneth June; Wang, Teng; Daily, Robert; Capuz, Giovanni; Velenis, Dimitrios; Beyer, Gerald; Beyne, Eric; Yu, Doug C.H. (2014) -
Process development to enable die sorting and 3D IC stacking
La Manna, Antonio; Daily, Robert; Capuz, Giovanni; Rebibis, Kenneth June; Bogaerts, Lieve; Miller, Andy; Beyne, Eric (2012-12) -
Reliability of 3D package using wafer level underfill and low CTE epoxy mold compound materials
Cadacio Jr., Francisco; Rebibis, Kenneth June; Capuz, Giovanni; Daily, Robert; Gerets, Carine; Duval, Fabrice; Wang, Teng; Miller, Andy; Beyer, Gerald; Beyne, Eric (2014) -
Thermal compression bonding: understanding heat transfer by in situ measurement and modeling
Bex, Pieter; Wang, Teng; Cherman, Vladimir; Lofrano, Melina; Capuz, Giovanni; Sleeckx, Erik; Beyne, Eric (2017) -
Underfill material screening and process characterization for 3D stacking
Rebibis, Kenneth June; La Manna, Antonio; Gerets, Carine; Beyne, Eric; Daily, Robert; Capuz, Giovanni (2012) -
Understanding the stacked dies interface temperature and its influence during the 3D IC thermocompression stacking process
Daily, Robert; Capuz, Giovanni; Miller, Andy; Bex, Pieter; Rebibis, Kenneth June (2012) -
Wafer reconstruction: An alternative 3D integration process flow
Wang, Teng; Silva, J.L.; Daily, Robert; Capuz, Giovanni; Gonzalez, Mario; Rebibis, Kenneth June; Kroehnert, S.; Beyne, Eric (2013)