Recently added

A novel electrically pumped III-V silicon micro-laser

De Koninck, Yannick; Tassaert, Martijn; Roelkens, Gunther; Baets, Roel; Bazin, A.; Raineri, F. (2012)

Hybrid silicon lasers for optical interconnect

De Koninck, Yannick; Keyvaninia, Shahram; Stankovic, Stevan; Van Thourhout, Dries; Roelkens, Gunther; Baets, Roel (2012)

Conformable electronics achieved by integration of foil-based electronics in textiles

de Kok, M.; Pacheco, K.; Olotu, G.; van den Brand, J.; Cherenack, K.; van Os, K.; Bossuyt, Frederick (2012)

Au-free CMOS-compatible AlGaN/GaN HEMT processing on 200 mm Si substrates

De Jaeger, Brice; Van Hove, Marleen; Wellekens, Dirk; Kang, Xuanwu; Liang, Hu; Mannaert, Geert; Geens, Karen; Decoutere, Stefaan (2012)

Tunable 4-channel ultra-dense WDM demultiplexer with III-V photodiodes integrated in silicon-on-insulator

De Heyn, Peter; Verstuyft, Steven; Keyvaninia, Shahram; Trita, Andrea; Van Thourhout, Dries (2012)

Ultra-high Q and finesse all-pass microring resonators on silicon-on-insulator using rib waveguides

De Heyn, Peter; Vermeulen, Diedrik; Van Vaerenbergh, Thomas; Kuyken, Bart; Van Thourhout, Dries (2012)

Robust 4-channel WDM demultiplexing filter based on collectively tuned silicon microrings

De Heyn, Peter; Vanslembrouck, Michael; Van Thourhout, Dries; Van Campenhout, Joris; De Coster, Jeroen; Pantouvaki, Marianna; Absil, Philippe (2012)

Broadband and picosecond intraband absorption in lead based colloidal quantum dots

De Geyter, Bram; Geiregat, Pieter; Gao, Yunan; ten Cate, Sybren; Houterpen, A.J.; Schins, J. M.; Van Thourhout, Dries; Siebbeles, L.D.A.; Hens, Zeger (2012)

Device and method for the measurement of anchor shear strength in MEMS devices

De Coster, Jeroen; Picco, Andrea; De Wolf, Ingrid (2012)

Low-frequency noise behaviour of bulk and DTMOS triple-gate devices under 60 MeV proton irradiation

de Andrade, M.G.C.; Martino, J.A.; Aoulaiche, Marc; Collaert, Nadine; Simoen, Eddy; Claeys, Cor (2012)

Impact of an etched EUV mask black border on imaging and overlay

Davydova, N.; de kruif, R.; Fukugami, N.; Kondo, S.; Philipsen, Vicky; Van Setten, E.; Connolly, B.; Lammers, A.; Vaenkatesan, V.; Zimmerman, J.; Harned, N. (2012)

High-Q parallel plate resonator for V-band in MCM-D technology

Dancila, Dragos; Rottenberg, Xavier; Tilmans, Harrie; De Raedt, Walter; Huynen, Isabelle; Rydberg, Anders (2012)

Understanding the stacked dies interface temperature and its influence during the 3D IC thermocompression stacking process

Daily, Robert; Capuz, Giovanni; Miller, Andy; Bex, Pieter; Rebibis, Kenneth June (2012)

Projection technology for future airplane cockpits

Cuypers, Dieter; De Smet, Herbert; Hugel, Xavier; Dubroca, Guilhem (2012)

Early assessment of emerging technologies for VLSI logic circuits from experimental measurements

Crupi, Felice; Magnone, Paolo; Alioto, Massimo; Franco, Jacopo; Groeseneken, Guido (2012)

Reliability challenges during different phases of 3D SIC processing

Croes, Kristof; Civale, Yann; Labie, Riet; Li, Yunlong; De Messemaeker, Joke; Vanstreels, Kris; Redolfi, Augusto; Velenis, Dimitrios; Varela Pedreira, Olalla; Van De Peer, Myriam; Cherman, Vladimir; Vandevelde, Bart; Beyne, Eric; De Wolf, Ingrid (2012)

Reliability concerns in copper TSV's: methods and results

Croes, Kristof; Cherman, Vladimir; Li, Yunlong; Zhao, Larry; Barbarin, Yohan; De Messemaeker, Joke; Civale, Yann; Velenis, Dimitrios; Stucchi, Michele; Kauerauf, Thomas; Redolfi, Augusto; Dimcic, Biljana; Ivankovic, Andrej; Van der Plas, Geert; De Wolf, Ingrid; Beyer, Gerald; Swinnen, Bart; Tokei, Zsolt; Beyne, Eric (2012-07)

Conference contributions: Recent submissions

A novel electrically pumped III-V silicon micro-laser

Hybrid silicon lasers for optical interconnect

Conformable electronics achieved by integration of foil-based electronics in textiles

Au-free CMOS-compatible AlGaN/GaN HEMT processing on 200 mm Si substrates

Tunable 4-channel ultra-dense WDM demultiplexer with III-V photodiodes integrated in silicon-on-insulator

Ultra-high Q and finesse all-pass microring resonators on silicon-on-insulator using rib waveguides

Robust 4-channel WDM demultiplexing filter based on collectively tuned silicon microrings

Broadband and picosecond intraband absorption in lead based colloidal quantum dots

Device and method for the measurement of anchor shear strength in MEMS devices

Low-frequency noise behaviour of bulk and DTMOS triple-gate devices under 60 MeV proton irradiation

Impact of an etched EUV mask black border on imaging and overlay

High-Q parallel plate resonator for V-band in MCM-D technology

Understanding the stacked dies interface temperature and its influence during the 3D IC thermocompression stacking process

Projection technology for future airplane cockpits

Early assessment of emerging technologies for VLSI logic circuits from experimental measurements

Reliability challenges during different phases of 3D SIC processing

Reliability concerns in copper TSV's: methods and results

High-speed full 3D feature metrology for litho monitoring, matching and model calibration with scatterometry

Run-time resource management based on design space exploration

Atomic layer deposition of high-k dielectric layers on single-walled carbon nanotubes

Conference contributions: Recent submissions

A novel electrically pumped III-V silicon micro-laser ﻿

Hybrid silicon lasers for optical interconnect ﻿

Conformable electronics achieved by integration of foil-based electronics in textiles ﻿

Au-free CMOS-compatible AlGaN/GaN HEMT processing on 200 mm Si substrates ﻿

Tunable 4-channel ultra-dense WDM demultiplexer with III-V photodiodes integrated in silicon-on-insulator ﻿

Ultra-high Q and finesse all-pass microring resonators on silicon-on-insulator using rib waveguides ﻿

Robust 4-channel WDM demultiplexing filter based on collectively tuned silicon microrings ﻿

Broadband and picosecond intraband absorption in lead based colloidal quantum dots ﻿

Device and method for the measurement of anchor shear strength in MEMS devices ﻿

Low-frequency noise behaviour of bulk and DTMOS triple-gate devices under 60 MeV proton irradiation ﻿

Impact of an etched EUV mask black border on imaging and overlay ﻿

High-Q parallel plate resonator for V-band in MCM-D technology ﻿

Understanding the stacked dies interface temperature and its influence during the 3D IC thermocompression stacking process ﻿

Projection technology for future airplane cockpits ﻿

Early assessment of emerging technologies for VLSI logic circuits from experimental measurements ﻿

Reliability challenges during different phases of 3D SIC processing ﻿

Reliability concerns in copper TSV's: methods and results ﻿

High-speed full 3D feature metrology for litho monitoring, matching and model calibration with scatterometry ﻿

Run-time resource management based on design space exploration ﻿

Atomic layer deposition of high-k dielectric layers on single-walled carbon nanotubes ﻿

A novel electrically pumped III-V silicon micro-laser

Hybrid silicon lasers for optical interconnect

Conformable electronics achieved by integration of foil-based electronics in textiles

Au-free CMOS-compatible AlGaN/GaN HEMT processing on 200 mm Si substrates

Tunable 4-channel ultra-dense WDM demultiplexer with III-V photodiodes integrated in silicon-on-insulator

Ultra-high Q and finesse all-pass microring resonators on silicon-on-insulator using rib waveguides

Robust 4-channel WDM demultiplexing filter based on collectively tuned silicon microrings

Broadband and picosecond intraband absorption in lead based colloidal quantum dots

Device and method for the measurement of anchor shear strength in MEMS devices

Low-frequency noise behaviour of bulk and DTMOS triple-gate devices under 60 MeV proton irradiation

Impact of an etched EUV mask black border on imaging and overlay

High-Q parallel plate resonator for V-band in MCM-D technology

Understanding the stacked dies interface temperature and its influence during the 3D IC thermocompression stacking process

Projection technology for future airplane cockpits

Early assessment of emerging technologies for VLSI logic circuits from experimental measurements

Reliability challenges during different phases of 3D SIC processing

Reliability concerns in copper TSV's: methods and results

High-speed full 3D feature metrology for litho monitoring, matching and model calibration with scatterometry

Run-time resource management based on design space exploration

Atomic layer deposition of high-k dielectric layers on single-walled carbon nanotubes